Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
TE Connectivity's 390261-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular contact pattern. It features glass-filled PBT housing, solder termination, and leaf contact style. Ideal for applications requiring a 1A current rating, it operates b/w -40°C to 105°C with a dielectric voltage of 1000VAC.
Median Price
$1.810
Lifecycle Status
Suppliers In-Stock
44
In-Stock Inventory
1k+
Powell Electronics
1+ parts
100+ parts
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1k+ parts
10k+ parts
Nova Conductors
$0.100
DF Sales Co.
$0.167
Component Electronics Inc.
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American Microsemiconductor Inc.
$0.510
Freelance Electronics
$0.558
Jameco Electronics
ComSIT Distribution GmbH
Electro Mavin
EMSNET
Inventory MP
Semi Source
Mil-Aero Solutions, Inc.
QIE Inc.
PC Components Company LLC
Standard Data Resources
VNN
Atlantic Semiconductor
ACDS - Activité Composants Distribution Service
Prism Electronics
GSS - Global Semi Support
Sea View Technologies
MISTER SPROCKETS
J & M Industries LLC
Ashlea Components Ltd
Connector Distribution Corp
Right Parts Inc.
Electronics Depot
ZD Integrated Circuits Inc.
NAC Semi
Flex Direct, LLC
Sensible Micro Corp
$0.088
$0.081
R&J Components
Diverse Electronics
Component Sense
Mentor Electronics Marketing, LLC
Lantek
Florida Circuit
Vyrian
First Choice Components Inc.
Bristol Electronics
Quantum Digital Technology
Classic Components Corporation
Continental Prestige Electronics
$0.098
Argo Parts USA
$0.097
Netroflash
Advanced Electronics
$0.102
Semicontronic
$1.540
$1.502
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Ampacity Inc.
AZTECH Wire
$19.609
Glotronic Ltd.
Aztec Data Supply Inc.
Perfect Parts
Cyclops Electronics Ltd (Excess)
GreenTree Electronics
A-Plus Industry Inc.
The 7.62mm row spacing allows for easy connection of the chip carrier IC to the PCB, making installation and maintenance convenient.
The use of glass filled polybutylene terephthalate ensures durability and heat resistance, making this chip carrier IC socket suitable for various operating environments.
With a minimum operating temperature of -40°C, this chip carrier IC socket can function reliably even in extreme cold conditions.
The solder termination type ensures a reliable and secure connection between the IC socket and the PCB, minimizing the risk of signal interference or power loss.
The 0.4 inch body length provides enough space for the DIP8 device to be securely attached to the IC socket, ensuring proper alignment and connection.
Having 8 contacts allows for a stable and reliable connection between the chip carrier IC and the PCB, ensuring proper signal transmission and power delivery.
With a maximum operating temperature of 105°C, this chip carrier IC socket can withstand high temperatures without compromising its performance.
Chip Carrier IC & Component Sockets 390261-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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390261-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Hitachi
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
LM317T
Linear Technology
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Operating Temperature (TJ-Min): 0 Cel; No. of Functions: 1; JESD-609 Code: e0;
1N4148WS
General Semiconductor
Nexperia
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148WT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
XR2D-1804
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
GFZ-30-01-G-30-AD
Samtec
The Samtec GFZ-30-01-G-30-AD is a Chip Carrier IC Socket with 900 contacts. It features Beryllium Copper contact material and Liquid Crystal Polymer housing. Designed for LGA900 devices, it has Gold over Nickel finish for mating and termination. Ideal for high-performance electronic applications.
P2R-057P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
PF113A
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
540-88-044-17-400-TR
Preci-dip Sa
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
2-1571550-8
TE Connectivity 2-1571550-8 is a DIP24 IC SOCKET with 24 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has solder termination, operates b/w -55°C to 105°C, and offers high insulation resistance of 5G ohm.
27E305
IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
P3G-08
PY11
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
PF113A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
416-43-226-41-003000
Mill-max Mfg
416-43-226-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It features RECTANGLE contact configuration, suitable for Chip Carrier IC & Component Sockets applications.
XR2A-0801-N
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
P2CF-08-E
5-1415043-1
IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
HLT-1910-G-H
The Samtec HLT-1910-G-H is a plastic IC socket with 190 brass contacts. It features gold over nickel mating finish and gold with nickel termination finish. Designed for use on PGA190 devices, it is ideal for chip carrier applications.
IC149-100-025-B5
Fujitsu
Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
5-1437539-3
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
822472-3
TE Connectivity's 822472-3 is a PLASTIC Chip Carrier IC Socket for PLCC32 devices. With -55 to 105 °C operating range, it has 32 contacts and 600VAC dielectric voltage. Ideal for surface mount applications with bellowed contact style and TIN LEAD finish.
110-87-632-41-001101
110-87-632-41-001101 by Preci-dip Sa is a DIP32 IC socket with 32 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications requiring reliable connections.
CQF024-165B
Texas Instruments
IC SOCKET; Device Type Used On: QFP24; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 24; Manufacturer Series: CQF;
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390261-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390261-4
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390261-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-5
IC SOCKET; Device Type Used On: DIP40; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Contact Material: PHOSPHOR BRONZE; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD;
390261-5
IC SOCKET; Device Type Used On: DIP18; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390261-9
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-2
390261-1
IC SOCKET; Device Type Used On: DIP6; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390261-3
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-1-1
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-2-2
390262-3-3
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-5-5
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390262-7-7
IC SOCKET; Device Type Used On: DIP48; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
390263-2
IC SOCKET; Device Type Used On: DIP32; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYETHYLENE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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