Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 342-10-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices. Featuring 56 gold over nickel contacts in RECTANGLE configuration, it offers reliable connectivity for various electronic applications.
Median Price
$12.482
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
Continental Prestige Electronics
$12.232
Netroflash
$11.858
$11.608
Ampacity Inc.
$15.000
AZTECH Wire
$17.283
Semicontronic
$58.000
$56.550
$56.260
Aztec Data Supply Inc.
Argo Parts USA
Polyethylene is known for its high strength and durability, making it a reliable housing material for protecting the components inside.
Designed specifically for SIP56 devices, ensuring a perfect fit and optimal performance.
With 56 contacts, this chip carrier IC socket can accommodate a wide range of components, offering flexibility in device compatibility.
The gold over nickel finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity.
The IC socket type is industry-standard, making it compatible with a wide range of integrated circuits and components.
The rectangle contact configuration allows for easy alignment and insertion of components, making installation quick and hassle-free.
Chip Carrier IC & Component Sockets 342-10-156-00-593000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
342-10-156-00-593000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
MURS160T3G
Onsemi
MURS160T3G by Onsemi is a single rectifier diode with a max output current of 2A and max repetitive peak reverse voltage of 600V. It has a fast recovery time of 0.075us, making it suitable for high voltage applications. The diode operates in temperatures ranging from -65 to 175°C, ideal for power systems requiring ultra-fast response.
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
LM317AEMP/NOPB
Texas Instruments
LM317AEMP/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and a max output current of 1.5A. It operates in temperatures ranging from -40°C to 125°C, making it suitable for various applications requiring precise voltage regulation in a compact package.
1N4148
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XR2H-2811-N
Omron
IC SOCKET; Manufacturer Series: XR2;
SS5-15-3.50-L-D-K-TR
Samtec
IC SOCKET;
218-7223-55-1902
3m Electronic Products Division
218-7223-55-1902 by 3M Electronic Products Division is a SOIC18 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold-over-nickel contacts for mating and termination, making it ideal for chip carrier IC applications.
CQF100143E
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
XR2A-1401-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
IC51-0484-806
Yamaichi Electronics
Yamaichi Electronics' IC51-0484-806 is a QFP48 chip carrier socket with staggered PCB contact pattern, polysulfone housing, and solder termination. Featuring 48 Be-Cu contacts with AU ON NI finish, it has a mating pitch of 0.02" and dielectric strength of 700VAC. Ideal for applications requiring high insulation resistance and reliable connection in electronic devices.
XR2A-4205
XR2T-2221-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
XR2T-1801-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
PTFZ-08-E
Omron's PTFZ-08-E is a Chip Carrier IC Socket with 8 contacts, rated at 15A current. It has a straight mounting style and blade pin-skt contact style, suitable for use on relays. With a min operating temperature of -25°C and screw termination type, it offers reliable performance in various applications.
111-91-964-41-001000
Mill-max Mfg
Mill-max Mfg's 111-91-964-41-001000 is a Chip Carrier IC Socket with 64 contacts. It features Beryllium Copper contact material, Gold over Nickel mating finish, and Tin/Lead termination. Ideal for DIP64 devices, this socket has a Polyethylene housing and rectangular contact configuration.
MT78745
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
08-350000-11-RC
Aries Electronics
IC SOCKET; Device Type Used On: SOIC8-DIP8; Contact Finish (Mating): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: SOCKET ADAPTER; No. of Contacts: 8;
110-87-320-41-001101
Preci-dip Sa
110-87-320-41-001101 by Preci-dip Sa is a DIP20 IC socket with 20 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. With a PCB contact row spacing of 7.62mm, it is ideal for applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
MT78755
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SOLDER; Contact Material: NOT SPECIFIED;
415-43-236-41-001000
Mill-max Mfg's 415-43-236-41-001000 is a POLYETHYLENE chip carrier socket for SIP36 devices with 36 TIN contacts. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration and reliable termination finish.
ICF-308-T-I-TR
Samtec's ICF-308-T-I-TR is a Chip Carrier IC Socket with 8 contacts, rated at 1A current. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP8 devices. With liquid crystal polymer housing and operating temperatures from -55°C to 125°C, it offers surface mount termination for various applications.
SH3B-05C
Idec
SH3B-05C by Idec is a Chip Carrier IC Socket with 3 contacts, rated for 10A current. It is used on relays with screw termination and straight mounting style. This socket has a body size of 2.716" x 1.181" x 1.161", making it suitable for various relay applications.
P2R-08P
RELAY SOCKET; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
XR2D-0801-N
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
342-10-139-00-591000
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
342-10-139-00-593000
Mill-max Mfg's 342-10-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
342-10-139-00-594000
Mill-max Mfg's 342-10-139-00-594000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
342-10-142-00-591000
IC SOCKET; Device Type Used On: SIP42; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
342-10-156-00-591000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 56; Contact Finish (Mating): NOT SPECIFIED;
342-10-156-00-592000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; JESD-609 Code: e4;
342-10-156-00-594000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE; JESD-609 Code: e4;
342-10-156-00-591100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
342-10-156-00-591
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): GOLD (10) OVER NICKEL; Contact Config: RECTANGLE; JESD-609 Code: e4;
342-10-156-00-592100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
342-10-156-00-592
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
342-10-156-00-593100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Additional Features: SOCKET HEADER; Contact Material: NOT SPECIFIED;
342-10-156-00-593
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
342-10-156-00-594100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
342-10-156-00-594
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Material: NOT SPECIFIED; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved