Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Mill-max Mfg's 342-10-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
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Polyethylene is a durable and lightweight material, making it ideal for protecting the chip carrier IC and ensuring its longevity.
SIP39 device compatibility ensures that this chip carrier IC socket is specifically designed to fit and accommodate SIP39 devices, providing a secure and reliable connection.
With 39 contacts, this chip carrier IC socket can support a wide range of connections, allowing for versatility and compatibility with various devices.
The gold over nickel contact finish offers excellent conductivity and corrosion resistance, ensuring reliable and high-quality connections for the chip carrier IC.
Being an IC socket, this product is designed to securely hold and connect integrated circuits in place, making it easy to replace or upgrade chips as needed.
The rectangular contact configuration provides a stable and secure connection for the chip carrier IC, reducing the risk of loose connections or signal interference.
Chip Carrier IC & Component Sockets 342-10-139-00-593000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
342-10-139-00-593000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
General Semiconductor
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Panjit International
Hitachi
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99-7-F
Multicomp Pro
Crimson Semiconductor
First Components International
Diotec Semiconductor Ag
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
TM4C1294NCPDTI3
Texas Instruments
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
ICF-308-T-O
Samtec
Samtec's ICF-308-T-O is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and Liquid Crystal Polymer housing. It is used for DIP8 devices in applications requiring -55 to 125°C operating temperature range and surface mount termination.
134-10-328-00-050000
Mill-max Mfg
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
XR2B-4011-N
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
2-1571552-7
TE Connectivity
TE Connectivity's 2-1571552-7 is a Chip Carrier IC Socket with 22 contacts, rated at 3A current. It has a PCB contact row spacing of 10.16mm and operates b/w -55°C to 105°C. Ideal for DIP22 devices, it features a thermoplastic polyester housing and solder termination for reliable performance in various applications.
822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD;
1-1437508-3
TRANSISTOR SOCKET; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT APPLICABLE;
ICA-203-S-TG30
Robinson Nugent
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Manufacturer Series: ICE; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 20;
390261-6
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
PY11QN
RELAY SOCKET;
HLS-1217-T-22-L
The Samtec HLS-1217-T-22-L is a POLYETHYLENE chip carrier socket with 204 GOLD contacts for PGA204 devices. It features IC SOCKET type and GOLD (Au) contact finish for mating and termination. Ideal for high-performance applications requiring reliable connections in electronic systems.
134-10-328-00-000000
134-10-328-00-000000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
MVAT-114-NT-13
IC SOCKET; Device Type Used On: PGA114; Contact Finish (Termination): TIN; No. of Contacts: 114; Additional Features: PGA SOCKET; JESD-609 Code: e3;
390261-4
TE Connectivity's 390261-4 is a Chip Carrier IC Socket with 16 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP16 devices, it has a rectangular contact pattern and glass-filled PBT housing material.
614-91-964-31-018000
IC SOCKET;
PA1A-PS-H
Panasonic
RELAY SOCKET; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED;
110-93-632-41-001000
Mill-max Mfg's 110-93-632-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 32 contacts with Tin/Lead finish, it is designed for DIP32 devices. Ideal for applications requiring reliable connections in electronic circuits.
XR2A-2011-N
IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
110-87-306-41-001101
Preci-dip Sa
110-87-306-41-001101 by Preci-dip Sa is a DIP6 IC socket with 6 contacts, rated for 1A current. It features a PCB contact row spacing of 7.62mm and housing material made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. This socket is ideal for applications requiring a dielectric withstand voltage of 1400VAC and operating temperatures ranging from -55 to 125°C.
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342-10-139-00-591000
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
342-10-139-00-594000
Mill-max Mfg's 342-10-139-00-594000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
342-10-156-00-593000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 56; Contact Material: NOT SPECIFIED;
342-10-142-00-591000
IC SOCKET; Device Type Used On: SIP42; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
342-10-139-00-592000
IC SOCKET; Device Type Used On: SIP39; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED;
342-10-139-00-591100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: SOCKET HEADER; JESD-609 Code: e4;
342-10-139-00-591
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (10) OVER NICKEL;
342-10-139-00-592100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; Contact Config: RECTANGLE; JESD-609 Code: e4;
342-10-139-00-592
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): GOLD OVER NICKEL; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL;
342-10-139-00-593100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: SOCKET HEADER; No. of Contacts: 39;
342-10-139-00-593
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 39; JESD-609 Code: e4;
342-10-139-00-594100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Contact Config: RECTANGLE;
342-10-139-00-594
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 39; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
Supply Digital Components
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