Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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5-210781-0 by Tyco Electronics Amp is a 50-contact IC socket with gold finish, suitable for SIP50 devices. It features GLASS FILLED POLYETHYLENE POLYESTER housing and BERYLLIUM COPPER contacts. Ideal for chip carrier IC applications requiring reliable connections.
Median Price
$22.010
Lifecycle Status
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4
In-Stock Inventory
1k+
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1+ parts
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VNN
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$21.570
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$52.000
Argo Parts USA
This housing material offers high strength and durability, making it suitable for use in various environments.
Designed specifically to be used on SIP50 devices, ensuring compatibility and optimal performance.
Beryllium copper contacts provide excellent conductivity and reliability, ensuring a strong and stable connection.
With a high number of contacts, this product offers versatility and compatibility with a wide range of devices.
Gold mating finish ensures reliable signal transmission and minimizes signal loss, resulting in high performance.
Gold termination finish provides corrosion resistance and long-term durability, enhancing the lifespan of the product.
This type of IC socket is widely used and trusted in the industry, ensuring compatibility and reliability for various applications.
Chip Carrier IC & Component Sockets 5-210781-0 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Tyco Electronics Amp
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Product Series:
5-210781-0 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
SMBJ18CA
Onsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
CRG0805F10R
TE Connectivity
TE Connectivity's CRG0805F10R is a 10 ohm fixed resistor with 1% tolerance and 0.125 W power dissipation. It features thick film technology, SMT package style, and matte tin over nickel terminal finish. Ideal for surface mount applications in electronics, offering a temperature coefficient of 200 ppm/°C and operating voltage of 150 V.
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
Toshiba
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Kec
DS18B20Z+T&R
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
LM358N
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
816-AG11D-ESL-LF
TE Connectivity's 816-AG11D-ESL-LF is a DIP16 IC socket with 16 contacts, rated at 3A current. Featuring a PCB contact row spacing of 7.62mm and rectangular pattern, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage withstand of 1000VAC in temperatures ranging from -55 to 105°C.
150-80-316-00-018101
Preci-dip Sa
150-80-316-00-018101 by Preci-dip Sa is a DIP16 IC socket with housing made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It features 16 brass contacts with Tin finish for mating and termination. Ideal for chip carrier IC applications requiring reliable connections in electronic devices.
40-6508-311
Aries Electronics
Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
169-PRS13001-16
Aries Electronics 169-PRS13001-16 is a PGA169 IC socket with 169 contacts, made of POLYPHENYLENE SULPHIDE. It has a contact pitch of 0.1" and operates b/w -65°C to 200°C. Ideal for chip carrier ICs, it features solder termination and a rectangular PCB contact pattern.
9-1437539-2
TE Connectivity 9-1437539-2 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a housing material of polyester. The socket has a min operating temperature of -55°C and max of 125°C, with solder termination type.
D2816-42
Harwin Plc
The Harwin PLC D2816-42 is a Chip Carrier IC Socket with 16 contacts, rated for 1A current. It has a plastic housing and solder termination, suitable for DIP16 devices. With a temperature range of -55 to 125°C, it offers high insulation resistance and dielectric voltage withstand capability of 1400VAC, making it ideal for various electronic applications.
XR2B-3201-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
818-22-024-10-002101
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
PT08
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
28-3508-311
Aries Electronics 28-3508-311 is a DIP28 IC socket with 28 contacts, featuring rectangular PCB contact pattern spaced at 7.62mm. It uses wire wrap termination and has a body size of 1.4" x 0.7" x 0.19". Ideal for applications requiring reliable connections in electronic circuits.
6-1415035-1
TE Connectivity's 6-1415035-1 is an IC socket with 8 contacts, rated for 16A current. With a body size of 3.031" x 0.622" x 2.421", it operates b/w -40°C to 70°C and uses screw termination. Ideal for chip carrier ICs on relays.
510-93-168-17-101003
IC SOCKET;
ICO-314-ZLGG
Samtec
Samtec's ICO-314-ZLGG is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It features rectangular contact pattern, gold finish over nickel, and polyester housing material. Ideal for DIP14 devices, it has a mating pitch of 0.1 inch and operates b/w -65°C to 125°C.
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
XR2A-2465
IC SOCKET; Manufacturer Series: XR2;
PTF08A
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
2833563
Phoenix Contact
RELAY SOCKET;
95.03SPA
Finder
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 5;
2-1571586-9
TE Connectivity 2-1571586-9 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and thermoplastic housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and current rating of 3A in temperatures ranging from -55 to 105°C.
XR2A-2005
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
5-210781-6
Tyco Electronics Amp
IC SOCKET; Device Type Used On: SIP56; Housing Material: THERMOPLASTIC POLYESTER; No. of Contacts: 56; Contact Finish (Termination): GOLD; Manufacturer Series: 210781;
5-210781-1
IC SOCKET; Device Type Used On: SIP51; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 51; Contact Finish (Mating): GOLD (30); Manufacturer Series: 210781;
5-210781-2
IC SOCKET; Device Type Used On: SIP52; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 52; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
5-210781-3
IC SOCKET; Device Type Used On: SIP53; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; No. of Contacts: 53;
5-210781-7
IC SOCKET; Device Type Used On: SIP57; Housing Material: THERMOPLASTIC POLYESTER; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; No. of Contacts: 57;
5-210781-8
IC SOCKET; Device Type Used On: SIP58; Housing Material: THERMOPLASTIC POLYESTER; Contact Finish (Termination): GOLD; No. of Contacts: 58; JESD-609 Code: e4;
5-210781-9
IC SOCKET; Device Type Used On: SIP59; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
5-210781-4
IC SOCKET; Device Type Used On: SIP54; Housing Material: THERMOPLASTIC POLYESTER; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: 210781;
5-210781-5
IC SOCKET; Device Type Used On: SIP55; Housing Material: THERMOPLASTIC POLYESTER; JESD-609 Code: e4; No. of Contacts: 55; Contact Material: BERYLLIUM COPPER;
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