Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Mill-max Mfg's 342-10-139-00-594000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$13.174
Lifecycle Status
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3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
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1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$0.670
$0.640
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Advanced Electronics
$12.714
$12.079
Continental Prestige Electronics
$12.910
Netroflash
Semicontronic
$25.000
$24.375
$24.250
Ampacity Inc.
$26.000
Aztec Data Supply Inc.
Argo Parts USA
Polyethylene is a durable and lightweight material, making it ideal for housing the chip carrier IC and component sockets. It provides sturdy protection for the internal components.
Designed specifically for SIP39 devices, ensuring a precise and secure fit. This compatibility enhances the performance and reliability of the product.
Having 39 contacts allows for versatile connectivity options and compatibility with a wide range of devices. This high number of contacts can accommodate various configurations.
Gold over nickel contact finish ensures excellent conductivity and corrosion resistance, maintaining reliable connections over time. This improves the longevity and performance of the product.
The IC socket type provides a secure and stable connection for the integrated circuit, preventing any potential damage or disconnection. This design feature enhances the overall functionality of the product.
The rectangle contact configuration offers a standardized and efficient layout for easy installation and maintenance. This design simplifies the process of connecting and disconnecting components, making the product user-friendly.
Chip Carrier IC & Component Sockets 342-10-139-00-594000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
342-10-139-00-594000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/56351
Esterline Technologies
CONNECTOR ACCESSORY; IEC Conformity: NO; Contact Gender: FEMALE; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT; Tool Settings: M22520/2-10;
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ABS07-32.768KHZ-T
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
DS18B20Z/T&R
Maxim Integrated
DS18B20Z/T&R by Maxim Integrated is a 12-bit digital temperature sensor with a max supply voltage of 5.5V and an accuracy of 0.50°C. It features a 1-Wire interface, operates b/w -55°C to 125°C, and is ideal for applications requiring precise temperature monitoring in compact spaces.
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
1N4148WT
Jiangsu Changjiang Electronics Technology
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
XR2D-0801-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
1-2324271-2
TE Connectivity
TE Connectivity 1-2324271-2 is a POLYETHYLENE chip carrier socket for LGA4189 devices. With 2097 contacts, it supports 0.5A current rating and operates b/w -25°C to 100°C. Ideal for surface mount applications in various electronic systems.
27E630
IC SOCKET; Housing Material: PHENOLIC; Termination Type: SOLDER; No. of Contacts: 22; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
SIM-AMS1
Phoenix Contact
RELAY SOCKET;
TF58
Fischer Elektronik & Kg
TF58 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-5 devices with 8 GOLD contacts. Its POLYTETRAFLUORO ETHYLENE housing material ensures durability. Ideal for chip carrier IC applications due to its reliable gold contact finish.
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
3-1437530-5
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; Additional Features: UL94V-0; No. of Contacts: 20;
342-10-142-00-591000
Mill-max Mfg
Mill-max Mfg 342-10-142-00-591000 is a POLYETHYLENE IC SOCKET for SIP42 devices with 42 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
342-90-139-00-594000
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
IC149-100-025-B5
Fujitsu
Fujitsu IC149-100-025-B5 is a 100-contact QFP100 chip carrier socket with POLYPHENYLENE SULPHIDE housing. It features BERYLLIUM COPPER contacts finished in GOLD (Au) with Nickel (Ni) barrier. Ideal for IC SOCKET applications requiring reliable connections and durability.
5-210781-0
Tyco Electronics Amp
5-210781-0 by Tyco Electronics Amp is a 50-contact IC socket with gold finish, suitable for SIP50 devices. It features GLASS FILLED POLYETHYLENE POLYESTER housing and BERYLLIUM COPPER contacts. Ideal for chip carrier IC applications requiring reliable connections.
ZA8-20-2-1.00-Z-10
Samtec
IC SOCKET;
XR2A-2811-N
IC SOCKET; Device Type Used On: DIP28; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; No. of Contacts: 28; Contact Finish (Mating): NOT SPECIFIED;
60431011
Delphi Connection Systems
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
5-1437536-6
TE Connectivity's 5-1437536-6 is a DIP28 IC socket with 28 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and housing material made of polyester, it operates b/w -55°C to 125°C. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and straight mounting style.
110-93-308-41-605000
110-93-308-41-605000 by Mill-max Mfg is a Chip Carrier IC & Component Socket made of PLASTIC. It features 8 contacts with GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead (Sn/Pb) with Nickel (Ni) barrier for termination. This DIP8 device type socket is ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
PY14-Y3
CQF208-168B
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
110-43-308-41-001000
110-43-308-41-001000 by Mill-max Mfg is a DIP8 IC socket with 0.1" contact pitch, suitable for chip carrier ICs. Featuring polyethylene housing, matte tin over nickel termination, and 3A current rating, it operates b/w -55°C to 125°C. Ideal for applications requiring reliable connections in electronic devices.
173-10-328-00-001000
The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
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342-10-139-00-591000
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
342-10-139-00-593000
Mill-max Mfg's 342-10-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
342-10-156-00-593000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD OVER NICKEL; No. of Contacts: 56; Contact Material: NOT SPECIFIED;
IC SOCKET; Device Type Used On: SIP42; Housing Material: POLYETHYLENE; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
342-10-139-00-592000
IC SOCKET; Device Type Used On: SIP39; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL; Contact Material: NOT SPECIFIED;
342-10-139-00-591100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: SOCKET HEADER; JESD-609 Code: e4;
342-10-139-00-591
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (10) OVER NICKEL;
342-10-139-00-592100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; Contact Config: RECTANGLE; JESD-609 Code: e4;
342-10-139-00-592
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): GOLD OVER NICKEL; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL;
342-10-139-00-593100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: SOCKET HEADER; No. of Contacts: 39;
342-10-139-00-593
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 39; JESD-609 Code: e4;
342-10-139-00-594100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Contact Config: RECTANGLE;
342-10-139-00-594
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 39; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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