Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
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$43.000
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Argo Parts USA
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Polyethylene offers high durability and resistance to heat and chemicals, ensuring a reliable and long-lasting performance of the chip carrier IC and component socket.
Designed specifically for SIP39 devices, ensuring compatibility and secure fit for optimal functionality.
With 39 contacts, this chip carrier IC and component socket provides ample connection points for various components, enhancing versatility and connectivity options.
The tin lead finish over nickel ensures smooth and reliable mating connections with minimal risk of corrosion or oxidation, promoting stable and efficient data transmission.
The tin/lead termination with nickel barrier offers excellent conductivity and protection against wear and tear, extending the lifespan of the socket and the connected components.
Specifically designed as an IC socket, this product is optimized for integrated circuits, providing a secure and stable platform for IC installation and operation.
The rectangular contact configuration ensures easy and accurate alignment of components, reducing the risk of misalignment or damage during installation or removal.
Chip Carrier IC & Component Sockets 342-90-139-00-594000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
342-90-139-00-594000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LM317T
Fairchild Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
2N7002
Continental Device India
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
1N4148WT
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
STMicroelectronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
1N4148
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
06035C103KAT2A
KYOCERA AVX
06035C103KAT2A by KYOCERA AVX is a SMT ceramic capacitor with 0.01uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and 10% tolerance. Ideal for applications requiring compact surface mount capacitors with stable performance in a wide temperature range.
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
Rectron
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
Shandong Yiguang Electronic Joint Stock
MBRS3200T3G
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
2N2222A
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
110-99-308-41-001000
Mill-max Mfg
Mill-max Mfg's 110-99-308-41-001000 is a DIP8 IC socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 8 contacts with TIN LEAD finish, it is ideal for chip carrier applications requiring reliable connections in electronic devices.
ICF-316-T-I-TR
Samtec
Samtec's ICF-316-T-I-TR is a Chip Carrier IC Socket with 16 contacts, rated at 1A. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP16 devices. With liquid crystal polymer housing and surface mount termination, it operates b/w -55°C to 125°C, making it ideal for various electronic applications.
510-93-168-17-101002
Mill-max Mfg 510-93-168-17-101002 is a Chip Carrier IC Socket with 168 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It is used on PGA168 devices with rectangular PCB contact pattern and polycyclohexydimethylene terephthalate-polyester housing material.
HLT-1712-G-T
Samtec's HLT-1712-G-T is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has gold (Au) mating finish over nickel (Ni). This IC socket is ideal for various applications requiring reliable connections.
2-1571550-2
TE Connectivity
TE Connectivity 2-1571550-2 is a DIP8 IC SOCKET with 8 contacts. It features PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a current rating of 3A. The socket has a housing made of PCT plastic polyester and operates within a temperature range of -55 to 105°C.
XR2A-2401-N
Omron
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
ST5-15-1.00-L-D-P-TR
IC SOCKET;
110-87-314-41-001101
Preci-dip Sa
110-87-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts and 7.62mm PCB row spacing. It features Beryllium Copper contact material, Gold Flash finish, and POLYESTER housing material. Ideal for applications requiring a current rating of 1A, dielectric voltage of 1400VAC, and operating temperatures from -55 to 125°C.
MPAS-069-ZHGT-11
Samtec's MPAS-069-ZHGT-11 is a PGA69 IC socket with 69 contacts, 2.54mm terminal pitch, and rectangular PCB contact pattern. It features polyester housing material, solder termination type, and operates b/w -65°C to 125°C. Ideal for chip carrier applications requiring a mating contact pitch of 0.1 inch and insulation resistance of 5G ohm.
1-1393143-7
IC SOCKET; Housing Material: POLYESTER; No. of Contacts: 16; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
2625-6325-9UA-1902
3m Electronic Products Division
2625-6325-9UA-1902 by 3M Electronic Products Division is a POLYETHERSULFONE chip carrier IC socket for PGA625 with 625 gold contacts. It features gold (30) over nickel (50) finish for mating and termination, suitable for high-performance integrated circuit applications.
4-1571552-9
TE Connectivity's 4-1571552-9 is a Chip Carrier IC Socket with 28 contacts, Beryllium Copper material, and 15.24mm PCB row spacing. It is used for DIP28 devices in applications requiring a -55 to 105°C operating temperature range and solder termination.
551-90-022-05-001005
Mill-max Mfg 551-90-022-05-001005 is a PGA22 IC socket with 22 contacts. It features TIN LEAD (200) mating finish and Tin/Lead termination with Nickel barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it's ideal for Chip Carrier applications.
4-1419106-0
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
60431011
Fci
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Additional Features: POLARIZED;
A08-LC-TT
Assmann Wsw Components
A08-LC-TT by Assmann Wsw Components is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and polybutylene terephthalate housing material. It has a solder termination type, bellowed contact style, and can withstand temperatures from -55 to 85°C. Ideal for applications requiring a chip carrier socket with rectangular contact pattern on a 0.1-inch pitch.
PY14QN-Y1
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
RSE116685
Amphenol
Amphenol's RSE116685 is a RELAY SOCKET with 8 GOLD contacts. Made of POLYETHERIMIDE, it operates b/w -65°C to 125°C. Ideal for Chip Carrier ICs, this socket ensures reliable connections in various electronic applications.
27E122
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
08-3518-10E
Aries Electronics
Aries Electronics 08-3518-10E is a DIP18 IC socket with 8 contacts, made of brass with gold finish. It has a 0.1" contact pitch and can handle up to 3A current. Ideal for chip carrier applications due to its rectangular PCB contact pattern and nylon46 housing material.
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342-90-139-00-591000
Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
342-90-139-00-593000
Mill-max Mfg's 342-90-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Ni barrier. Ideal for Chip Carrier IC & Component Sockets applications.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
342-90-156-00-593000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; JESD-609 Code: e0; Additional Features: SOCKET HEADER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
342-90-139-00-591100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
342-90-139-00-591
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 39; Contact Material: NOT SPECIFIED; Contact Finish (Termination): TIN LEAD OVER NICKEL;
342-90-139-00-592100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
342-90-139-00-592
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL; No. of Contacts: 39; JESD-609 Code: e0;
342-90-139-00-593100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: SOCKET HEADER;
342-90-139-00-593
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL; Additional Features: SOCKET HEADER;
342-90-139-00-594100
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); JESD-609 Code: e0; Contact Config: RECTANGLE;
342-90-139-00-594
IC SOCKET; Device Type Used On: SIP39; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; JESD-609 Code: e0; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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