Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
Median Price
$17.605
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Nova Conductors
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Vyrian
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AZTECH Wire
$0.540
$0.520
$0.510
$0.500
Semicontronic
$7.000
$6.825
$6.790
Continental Prestige Electronics
$17.253
Ampacity Inc.
$36.000
Argo Parts USA
Aztec Data Supply Inc.
Polyethylene is a durable and lightweight material, making this chip carrier socket resistant to damage and easy to handle.
Designed specifically for SIP56 devices, ensuring a perfect fit and secure connection.
With 56 contacts, this chip carrier socket can accommodate a wide range of ICs and components, providing versatility.
The Tin Lead finish over Nickel ensures a reliable and low-resistance connection, reducing signal loss and enhancing performance.
The Tin/Lead finish with Nickel barrier provides excellent conductivity and corrosion resistance, prolonging the lifespan of the chip carrier socket.
Designed as an IC socket, this chip carrier socket is easy to install and remove, saving time and effort during component replacement.
The rectangular contact configuration ensures a secure and stable connection between the IC and the socket, preventing any signal loss or interference.
Chip Carrier IC & Component Sockets 342-90-156-00-593000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
342-90-156-00-593000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LM2931Z-5.0RPG
Onsemi
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
M39029/58-360
Fct Electronic
CONNECTOR ACCESSORY; IEC Conformity: NO; Alternate Contact Sources: MILITARY; MIL Conformity: YES; Contact Gender: MALE; MIL-Connector Accessory Name: CONTACT;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
EU2B-YS3103F
Idec
ROTARY SWITCH;
Itt Semiconductor
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148WT
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
Amphenol
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Additional Features: STANDARD: MIL-DTL-38999; Contact Gender: FEMALE; MIL-Connector Accessory Name: CONTACT; Associated Military - Specifications: MIL-DTL-38999;
Central Semiconductor
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2-345832-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
224-1275-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 224-1275-00-0602J is a DIP24 IC socket with 24 contacts. It features Beryllium Copper contact material and Gold (Au) finish for mating and termination. The housing material is Glass Filled Polysulfone, making it ideal for chip carrier applications.
XR2A-2473-N
Omron
IC SOCKET; Device Type Used On: DIP24; JESD-609 Code: e4; No. of Contacts: 24; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): NOT SPECIFIED;
8501NR61B
Schneider Electric Sa
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
D2816-42
Harwin Plc
The Harwin PLC D2816-42 is a Chip Carrier IC Socket with 16 contacts, rated for 1A current. It has a plastic housing and solder termination, suitable for DIP16 devices. With a temperature range of -55 to 125°C, it offers high insulation resistance and dielectric voltage withstand capability of 1400VAC, making it ideal for various electronic applications.
ICF-328-T-O-TR
Samtec
Samtec's ICF-328-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It utilizes liquid crystal polymer housing material and has a mating contact pitch of 0.1 inch. Ideal for DIP28 devices, it offers surface mount termination and operates b/w -55°C to 125°C.
299-43-310-10-001000
Mill-max Mfg
Mill-max Mfg's 299-43-310-10-001000 is a PCT POLYESTER IC SOCKET for DIP10 devices with 10 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
HLT-0919-G-R
Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
XR2T-2811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
27E122
TE Connectivity
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
RXZE2M114M
RELAY SOCKET;
PY08-02
RELAY SOCKET; No. of Contacts: 8; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
XR2A-2205
IC SOCKET; Manufacturer Series: XR2;
XR2T-3221-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH;
410-47-220-41-001000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
TF183
Fischer Elektronik & Kg
TF183 by Fischer Elektronik & Kg is a TRANSISTOR SOCKET for TO-18 devices with 3 GOLD contacts. It features POLYTETRAFLUORO ETHYLENE housing material, ideal for chip carrier IC applications.
123-13-322-41-001000
123-13-322-41-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP22 devices with 22 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
299-43-314-10-001000
The Mill-max Mfg 299-43-314-10-001000 is a plastic chip carrier IC socket with a DIP14 device type. It has a mating contact pitch of 0.1 inch and can handle a current rating of 3A. This IC socket is commonly used for right angle mounting in various electronic applications.
5-1437536-2
TE Connectivity 5-1437536-2 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and polyester housing material. Suitable for applications requiring a current rating of 3A, it has solder termination and operates b/w -55°C to 125°C.
ICF-316-T-O-TR
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
342-90-139-00-591000
Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
342-90-139-00-593000
Mill-max Mfg's 342-90-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Ni barrier. Ideal for Chip Carrier IC & Component Sockets applications.
342-90-139-00-594000
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
342-90-156-00-591100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); Additional Features: SOCKET HEADER;
342-90-156-00-591
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL;
342-90-156-00-592100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); Contact Material: NOT SPECIFIED;
342-90-156-00-592
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Additional Features: SOCKET HEADER; Contact Finish (Termination): TIN LEAD OVER NICKEL;
342-90-156-00-593100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Config: RECTANGLE; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150);
342-90-156-00-593
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 56; Contact Config: RECTANGLE;
342-90-156-00-594100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Additional Features: SOCKET HEADER; No. of Contacts: 56;
342-90-156-00-594
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Contact Finish (Termination): TIN LEAD OVER NICKEL; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL;
342-90-156-00-591000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; JESD-609 Code: e0; Additional Features: SOCKET HEADER; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150);
342-90-156-00-592000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; JESD-609 Code: e0; No. of Contacts: 56; Contact Material: NOT SPECIFIED;
342-90-156-00-594000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; No. of Contacts: 56; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
Supply Digital Components
$106.00
$54.25
$11.90
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12,000 In-Stock
Total price ≈ $80,197.29
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