Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
Median Price
$17.605
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
VNN
Vyrian
Semicontronic
$7.000
$6.825
$6.790
AZTECH Wire
$14.788
Continental Prestige Electronics
$17.253
Ampacity Inc.
$36.000
Argo Parts USA
Aztec Data Supply Inc.
Polyethylene is a durable and lightweight material, making this chip carrier socket resistant to damage and easy to handle.
Designed specifically for SIP56 devices, ensuring a perfect fit and secure connection.
With 56 contacts, this chip carrier socket can accommodate a wide range of ICs and components, providing versatility.
The Tin Lead finish over Nickel ensures a reliable and low-resistance connection, reducing signal loss and enhancing performance.
The Tin/Lead finish with Nickel barrier provides excellent conductivity and corrosion resistance, prolonging the lifespan of the chip carrier socket.
Designed as an IC socket, this chip carrier socket is easy to install and remove, saving time and effort during component replacement.
The rectangular contact configuration ensures a secure and stable connection between the IC and the socket, preventing any signal loss or interference.
Chip Carrier IC & Component Sockets 342-90-156-00-593000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
342-90-156-00-593000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
Changzhou Galaxy Century Microelectronics
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Transys Electronics
Excel (Suzhou) Semiconductor
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
Zetex Plc
M39029/56-351
TE Connectivity
TE Connectivity's M39029/56-351 is a CRIMP contact type backshell accessory with rated voltage of 115V. It operates b/w -65 to 175 °C, suitable for MIL-C-39029/56 connectors with wire gauge ranging from 28 to 22 AWG. Ideal for military applications requiring female contacts and copper alloy material.
540-88-044-17-400
Preci-dip Sa
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
P7SA-14F-ND
Omron
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 6;
XR2T-4811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
PL11-Q
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-1601-N
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
HLT-1712-T-H
Samtec
The Samtec HLT-1712-T-H is a plastic IC socket with 204 brass contacts, featuring Tin over Nickel mating finish. Designed for use on PGA204 devices, it offers reliable connectivity and durability in chip carrier applications.
SZX-SMF-14N
Honeywell Sensing And Control
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Manufacturer Series: SZX-SMF-14N; Contact Material: NOT SPECIFIED;
HLS-1820-T-22
The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
ALC-640-STT
Samtec's ALC-640-STT is a Chip Carrier IC Socket with 40 contacts, 15.24mm PCB row spacing, and brass housing material. It is used for DIP40 devices, featuring solder termination and a mating contact pitch of 0.1". Ideal for applications requiring reliable connections in electronic circuits.
XR2T-1811-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
PT11QN
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
PYF08M
RELAY SOCKET;
1860000-1
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER; Additional Features: STANDARDS: CUL; VDE; No. of Contacts: 14; Contact Material: NOT APPLICABLE;
A08-LC-TT
Assmann Wsw Components
A08-LC-TT by Assmann Wsw Components is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and polybutylene terephthalate housing material. It has a solder termination type, bellowed contact style, and can withstand temperatures from -55 to 85°C. Ideal for applications requiring a chip carrier socket with rectangular contact pattern on a 0.1-inch pitch.
5665
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC84; Additional Features: PLCC SOCKET, 94V-0; No. of Contacts: 84; Manufacturer Series: 5665;
2-1571550-8
TE Connectivity 2-1571550-8 is a DIP24 IC SOCKET with 24 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has solder termination, operates b/w -55°C to 105°C, and offers high insulation resistance of 5G ohm.
CQF100-138A
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
XR2T-2021-N
IC SOCKET; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD FLASH;
SM2S-05C
Idec
D01-997.3242
Harwin Plc
Sockets and Chip Carriers;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
342-90-139-00-591000
Mill-max Mfg
Mill-max Mfg's 342-90-139-00-591000 is a POLYETHYLENE chip carrier IC socket with 39 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for SIP39 devices. Ideal for applications requiring IC SOCKET with RECTANGLE contact configuration.
342-90-139-00-593000
Mill-max Mfg's 342-90-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Ni barrier. Ideal for Chip Carrier IC & Component Sockets applications.
342-90-139-00-594000
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
342-90-156-00-591100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); Additional Features: SOCKET HEADER;
342-90-156-00-591
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Additional Features: SOCKET HEADER; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL;
342-90-156-00-592100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150); Contact Material: NOT SPECIFIED;
342-90-156-00-592
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Additional Features: SOCKET HEADER; Contact Finish (Termination): TIN LEAD OVER NICKEL;
342-90-156-00-593100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Contact Config: RECTANGLE; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150);
342-90-156-00-593
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 56; Contact Config: RECTANGLE;
342-90-156-00-594100
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Additional Features: SOCKET HEADER; No. of Contacts: 56;
342-90-156-00-594
IC SOCKET; Device Type Used On: SIP56; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 56; Contact Finish (Termination): TIN LEAD OVER NICKEL; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL;
342-90-156-00-591000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; JESD-609 Code: e0; Additional Features: SOCKET HEADER; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150);
342-90-156-00-592000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; JESD-609 Code: e0; No. of Contacts: 56; Contact Material: NOT SPECIFIED;
342-90-156-00-594000
IC SOCKET; Device Type Used On: SIP56; Housing Material: POLYETHYLENE; No. of Contacts: 56; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved