Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's ICF-324-F-O is a Chip Carrier IC Socket with 24 contacts, 0.1" pitch, and gold flash over nickel finish. It has a body size of 1.2"x0.375"x0.18" and operates b/w -55°C to 125°C. Ideal for DIP24 devices in applications requiring high insulation resistance and dielectric voltage withstand capabilities.
Median Price
$2.950
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
< 1k
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Continental Prestige Electronics
$2.891
Argo Parts USA
Netroflash
Corohmni
$3.140
AZTECH Wire
$15.356
Aztec Data Supply Inc.
The 7.62mm spacing allows for easy and secure connection to the PCB, ensuring stable performance and reliability.
Liquid Crystal Polymer provides excellent mechanical and thermal properties, making the socket durable and suitable for various environments.
With a minimum operating temperature of -55°C, this socket can function efficiently in extreme cold conditions.
Beryllium Copper Alloy offers high conductivity and durability, ensuring a reliable and stable electrical connection.
With 24 contacts, this socket is suitable for connecting complex electronic components and allows for versatile applications.
The gold flash over nickel finish provides excellent conductivity and corrosion resistance, ensuring a reliable and long-lasting connection.
With a current rating of 1A, this socket can handle moderate power requirements and is suitable for a wide range of electronic applications.
The high dielectric withstanding voltage of 600VAC ensures safe and reliable operation in different voltage environments.
Chip Carrier IC & Component Sockets ICF-324-F-O attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
Contact Style:
Installation Type:
Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
Mounting Style:
PCB Contact Layout:
IC Socket Type:
Housing Material:
Length:
Width:
Depth:
JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
ICF-324-F-O Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
FT232RQ-REEL
FTDI
FTDI's FT232RQ-REEL is a USB bus controller with 32 terminals, operating at 3.3-5.25V. It supports data transfer rates up to 60MBps and clock frequency of 12.02MHz, suitable for RS232/RS422/RS485 interfaces in various applications like industrial automation and communication systems.
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Wuxi Xuyang Electronic
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
1N4148WT
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Jiangsu Jiejie Microelectronics
Zetex Plc
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
XR2A-2221-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
110-87-318-41-001101
Preci-dip Sa
110-87-318-41-001101 by Preci-dip Sa is a DIP18 IC socket with 18 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for applications requiring a straight mounting style and high insulation resistance up to 10^10 ohm.
326-93-109-41-002000
Mill-max Mfg
Mill-max Mfg 326-93-109-41-002000 is a PLASTIC IC SOCKET for SIP9 devices with 9 BERYLLIUM COPPER contacts. Features Tin/Lead finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
PT08-0
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-4205
IC SOCKET; Manufacturer Series: XR2;
XR3G-2811
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Finish (Termination): GOLD;
2227MC-16-03-09-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
134-10-328-00-020000
134-10-328-00-020000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 GOLD OVER NICKEL contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
110-87-628-41-001101
110-87-628-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, rated for 1A current. It features Beryllium Copper contacts with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing material. With a temperature range of -55 to 125 °C, it's ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capability up to 1400VAC.
SFS4-SFD-R
RELAY SOCKET; Manufacturer Series: SF;
P2RF-05
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
390261-6
TE Connectivity
TE Connectivity's 390261-6 is a Chip Carrier IC Socket with 20 contacts, PCB contact row spacing of 7.62mm, and housing material made of glass-filled PBT. It is used for DIP20 devices, has a solder termination type, and operates b/w -40°C to 105°C.
315-43-103-41-001000
The Mill-max Mfg 315-43-103-41-001000 is a PLASTIC IC SOCKET for SIP3 devices with 3 TIN contacts. It features RECTANGLE contact configuration and is ideal for Chip Carrier IC & Component Sockets applications.
416-43-226-41-008000
416-43-226-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
XR2A-3225
8134-HC-6P2
TE Connectivity's 8134-HC-6P2 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. Ideal for applications requiring a temperature range of -65°C to 125°C, this socket offers reliable performance in various electronic devices.
CQF208-168B
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
PT11QN
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
40-6554-10
Aries Electronics
Aries Electronics 40-6554-10 is a DIP42 IC socket with 40 contacts, PCB contact spacing of 15.24mm, and housing made of polyphenylene sulfide. It has a mating contact pitch of 0.1 inch and is used for chip carrier applications requiring a current rating of 1A at temperatures up to 105°C.
XR2B-2801-N
IC SOCKET; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
ICF-316-T-O-TR
Samtec
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
ICF-308-T-O
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-308-T-I-TR
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-320-T-O-TR
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
ICF-316-T-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Mating Contact Pitch (inch): 0.1;
ICF-328-T-O-TR
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .375 inch;
ICF-324-S-0
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-324-T-O-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Rating (Current): 1 A;
ICF-324-S-I
ICF-324-T-I
ICF-324-T-O
ICF-324-TL-I
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Termination Type: SURFACE MOUNT;
ICF-324-TL-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Terminal Pitch (mm): 2.54;
ICF-324-F-I-TR
ICF-324-TL-O-TR
ICF-324-FM-I-TR
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Config: RECTANGLE;
ICF-324-SM-I
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Mating Contact Pitch (inch): 0.1;
ICF-324-STL-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Minimum Operating Temperature: -55 Cel;
ICF-324-TM-I
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Maximum Operating Temperature: 125 Cel;
ICF-324-TM-O-TR
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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