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822472-3

TE Connectivity

822472-3 by TE Connectivity

TE Connectivity's 822472-3 is a PLASTIC Chip Carrier IC Socket for PLCC32 devices. With -55 to 105 °C operating range, it has 32 contacts and 600VAC dielectric voltage. Ideal for surface mount applications with bellowed contact style and TIN LEAD finish.

Median Price

$3.200

Lifecycle Status

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Component Electronics Inc.

Canada . 47 parts In-Stock

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DF Sales Co.

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Classic Components Corporation

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Mentor Electronics Marketing, LLC

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Vyrian

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Legend Electronics Inc.

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Lantek

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Nova Conductors

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Semtec, LLC

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AZTECH Wire

Italy . 654 parts In-Stock

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Ampacity Inc.

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Overview

Discover the ultimate solution for your Chip Carrier IC & Component Socket needs with TE Connectivity's 822472-3. Crafted with high-quality plastic housing and precision engineering by a trusted manufacturer, this IC socket is designed for PLCC32 devices, offering easy surface mount installation and bellowed type contacts for secure connections. With a rating of 1A and a wide operating temperature range, this versatile socket ensures reliable performance in various applications. Trust TE Connectivity to deliver value, benefits, and unmatched quality with the 822472-3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, extending the product's lifespan.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can handle higher voltage inputs, increasing compatibility with various systems.

Maximum Transmit Delay: 2000 ns

Ensures quick transmission of data, improving overall performance.

Power Supplies (V): 5

Operates efficiently with a common power supply voltage, simplifying system design.

No. of Terminals: 14

Offers multiple connection points for interfacing with other components, enhancing versatility.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, suitable for use in various environments.

Output Characteristics: 3-STATE

Provides flexibility in signal output, allowing for multiple output states.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, improving overall performance.

Interface Standard: EIA-422; EIA-485

Complies with industry standards, ensuring compatibility with a wide range of devices.

Technical Specifications

Chip Carrier IC & Component Sockets 822472-3 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity

Connectivity

Number of Positions or Pins:

32

Contact Finish - Mating:

TIN LEAD

Contact Finish - Termination:

Tin Lead

Contact Material:

Phosphor Bronze

Contact Configuration:

7 x 9

Contact Style:

Installation Type:

Surface Mount

Mounting Style:

Physical Characteristics

IC Socket Type:

Housing Material:

Length:

0.813 in (20.65 mm)

Width:

0.713 in (18.11 mm)

Depth:

0.181 in (4.597 mm)

JESD-609 Code:

e0

Electrical Characteristics

Current Rating:

1 A

Dielectric Withstanding Voltage:

Insulation Resistance:

5 GΩ

Thermal Characteristics

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Compatibility

Compatible Device Type:

Additional Features

Special Features:

Standard: UL 94V-0, Low Profile

Trade Compliance

822472-3 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

TE Connectivity

TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Terrence R. Curtin

Executive VP, CFO

Heath A. Mitts

Senior VP, Principal Accounting Officer

Robert J. Ott

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