Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec MPAS-036-ZSGG-10 is a 36-contact IC socket with Beryllium Copper contacts and Gold over Nickel finish. Designed for PGA36 devices, it offers reliable connections in chip carrier applications. The socket's Gold with Nickel termination ensures durability and performance in various electronic systems.
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PGA36 is a widely used standard for chip carrier ICs, ensuring compatibility and ease of integration.
Beryllium copper offers good conductivity and resilience, making it ideal for reliable and durable contacts in IC sockets.
Having 36 contacts allows for higher data transfer rates and more connectivity options in electronic devices.
Gold over nickel provides excellent conductivity and corrosion resistance, ensuring stable connections over time.
Gold termination with a nickel barrier offers optimal signal transfer and protection against oxidation, enhancing the longevity of the product.
The IC socket type ensures compatibility with various integrated circuits and facilitates easy replacement or upgrades.
Chip Carrier IC & Component Sockets MPAS-036-ZSGG-10 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
JESD-609 Code:
Compatible Device Type:
Special Features:
MPAS-036-ZSGG-10 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
2N2222A
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
BAV99
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
FDD5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
43025-0400
Molex
The Molex 43025-0400 is a board connector with 4 contacts, 2 rows, and a mating contact pitch of 0.118". It has a body length of 0.27", insulation resistance of 1Gohm, and operates b/w -40 to 105°C. Ideal for commercial applications requiring a female connector with crimp termination and UL94V-0 flammability rating.
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
MBRS3200T3G
Onsemi
MBRS3200T3G by Onsemi is a Schottky rectifier diode with a max output current of 3A and a max forward voltage of 0.59V. It operates in temperatures ranging from -65°C to 175°C, making it suitable for power applications. The diode has a peak repetitive reverse voltage of 200V and is designed for surface mount installation in electronic circuits.
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
LM7805CT
Texas Instruments
LM7805CT by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates b/w 0-125°C, has a dropout voltage of 2V, and offers excellent line/load regulation for various electronic applications.
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
CRGCQ0805F10K
TE Connectivity
TE Connectivity's CRGCQ0805F10K is a 10000 ohm fixed resistor with 1% tolerance. It operates b/w -55 to 155 °C and has a power dissipation of 0.125 W. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance.
0462-201-16141
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
BAV99WT1G
PY08QN2-Y1
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
2-640359-4
TE Connectivity's 2-640359-4 is a Chip Carrier IC Socket with 18 contacts, made of Phosphor Bronze with Gold finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for DIP18 devices, it features a rectangular contact pattern and glass-filled polyethylene housing material.
XR2T-2401-N
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
218-7223-55-1902
3m Electronic Products Division
218-7223-55-1902 by 3M Electronic Products Division is a SOIC18 IC socket with POLYETHERSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold-over-nickel contacts for mating and termination, making it ideal for chip carrier IC applications.
1SVR405652R0000
Abb
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
S421
TE Connectivity's S421 is a chip carrier IC socket with 18 contacts and a PCB contact row spacing of 7.62mm. It has a housing made of glass-filled PBT and can operate in temperatures ranging from -40 to 105 °C. This IC socket is commonly used for solder termination in various electronic applications.
XR2A-1415
IC SOCKET; Manufacturer Series: XR2;
788-103
Wago
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
614-43-964-31-012000
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP64; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; No. of Contacts: 64; JESD-609 Code: e3;
P7S-14F-END
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 14;
342-10-139-00-591000
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
2271484
Phoenix Contact
RELAY SOCKET;
SH1B-05
Idec
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
551-10-155-18-121005
Mill-max Mfg's 551-10-155-18-121005 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It is used on PGA155 devices and has 155 contacts with GOLD (10) mating finish over NICKEL (150). The IC socket type features Gold (Au) termination finish with Nickel (Ni) barrier.
XR2T-4001-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
PY14-02
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Termination): NOT APPLICABLE;
P2RF-05-E
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Maximum Operating Temperature: 70 Cel; Contact Material: NOT APPLICABLE; No. of Contacts: 5; Minimum Operating Temperature: -40 Cel;
410-83-220-10-001101
Preci-dip Sa
410-83-220-10-001101 by Preci-dip Sa is a chip carrier IC & component socket with a GLASS FILLED POLYESTER housing material. It is used on DIP20 devices and has a min operating temperature of -55°C. With 20 contacts, it has an insulation resistance of 10^10 ohm and can handle a current rating of 1A.
XR2C-2005
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
264-1300-29-0602J
The 3M Electronic Products Division's 264-1300-29-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features DIP64 device compatibility, GOLD (30) OVER NICKEL (50) mating finish, and Gold (Au) - with Nickel (Ni) termination finish. Ideal for applications requiring reliable connections in electronic circuits.
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MPAS-069-ZSST-11
Samtec
IC SOCKET; Device Type Used On: PGA69; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: BRASS;
MPAS-069-ZHGT-11
IC SOCKET; Device Type Used On: PGA69; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
MPAS-036-ZAGG-10
IC SOCKET; Device Type Used On: PGA36; Additional Features: PGA SOCKET; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (50);
MPAS-036-ZBGG-10
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Additional Features: PGA SOCKET; Contact Material: BERYLLIUM COPPER; No. of Contacts: 36;
MPAS-036-ZHGG-10
IC SOCKET; Device Type Used On: PGA36; No. of Contacts: 36; Additional Features: PGA SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30) OVER NICKEL (50);
MPAS-036-ZLGT-10
IC SOCKET; Device Type Used On: PGA36; Additional Features: PGA SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); No. of Contacts: 36;
MPAS-036-ZSEE-10
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Termination): Gold (Au); Additional Features: PGA SOCKET; Contact Finish (Mating): GOLD; JESD-609 Code: e4;
MPAS-036-ZSEG-10
IC SOCKET; Device Type Used On: PGA36; Additional Features: PGA SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4;
MPAS-036-ZSGE-10
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Termination): Gold (Au); Contact Material: NOT SPECIFIED; No. of Contacts: 36; JESD-609 Code: e4;
MPAS-036-ZSGT-10-L
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); No. of Contacts: 36; Contact Material: BERYLLIUM COPPER; Additional Features: PGA SOCKET;
MPAS-036-ZSST-10
IC SOCKET; Device Type Used On: PGA36; JESD-609 Code: e4; No. of Contacts: 36; Contact Material: BERYLLIUM COPPER; Additional Features: PGA SOCKET;
MPAS-036-ZSTE-10
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Additional Features: PGA SOCKET; No. of Contacts: 36;
MPAS-036-ZSTT-10
IC SOCKET; Device Type Used On: PGA36; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 36; Additional Features: PGA SOCKET;
MPAS-036-ZUGG-10
IC SOCKET; Device Type Used On: PGA36; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Contact Material: BERYLLIUM COPPER; No. of Contacts: 36;
MPAS-036-ZUGT-10
IC SOCKET; Device Type Used On: PGA36; No. of Contacts: 36; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Additional Features: PGA SOCKET; JESD-609 Code: e3;
MPAS-036-ZWGG-10-2
IC SOCKET; Device Type Used On: PGA36; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); JESD-609 Code: e4; Additional Features: PGA SOCKET; No. of Contacts: 36;
MPAS-036-ZWGG-10-3
IC SOCKET; Device Type Used On: PGA36; No. of Contacts: 36; JESD-609 Code: e4; Additional Features: PGA SOCKET; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
MPAS-036-ZWGT-10-3
IC SOCKET; Device Type Used On: PGA36; No. of Contacts: 36; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Additional Features: PGA SOCKET;
MPAS-036-ZWGT-10
IC SOCKET; Device Type Used On: PGA36; Additional Features: PGA SOCKET; No. of Contacts: 36; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
MPAS-036-ZWTT-10-2
IC SOCKET; Device Type Used On: PGA36; Contact Material: BERYLLIUM COPPER; Additional Features: PGA SOCKET; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 36;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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