Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Amphenol's RSE116685 is a RELAY SOCKET with 8 GOLD contacts. Made of POLYETHERIMIDE, it operates b/w -65°C to 125°C. Ideal for Chip Carrier ICs, this socket ensures reliable connections in various electronic applications.
Median Price
$138.815
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Argo Parts USA
Perfect Parts
POLYETHERIMIDE material provides excellent thermal and chemical resistance, ensuring the durability and reliability of the chip carrier IC and component socket.
With a minimum operating temperature of -65°C, this product is suitable for use in extreme cold environments without any performance issues.
Having 8 contacts allows for multiple connections, making this socket versatile and capable of accommodating various chip configurations.
GOLD contact finish ensures excellent conductivity and reliability in mating connections, reducing the risk of signal loss or interference.
GOLD termination contact finish provides long-term durability and stable connections, ensuring consistent performance over time.
RELAY SOCKET type offers secure and reliable connections for the chip, enhancing signal transmission and minimizing the risk of data loss or errors.
Capable of operating at temperatures up to 125°C, this socket is suitable for high-temperature applications without compromising performance.
Chip Carrier IC & Component Sockets RSE116685 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Amphenol
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Minimum Operating Temperature:
Maximum Operating Temperature:
Special Features:
RSE116685 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market, including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks. Founded in 1932, Amphenol trades on the New York Stock Exchange under the ticker APH and is headquartered in Wallingford, Connecticut, USA.
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NE555D
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
1N4148
General Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20Z+
Analog Devices
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM358M
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
2N7002
Formosa Microsemi
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Maximum Drain Current (Abs) (ID): .115 A;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
Rectron
Electronic Devices
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
Diodes Incorporated
CRCW080510R0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510R0FKEA is a fixed resistor with 10 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to its AEC-Q200 reference standard and operating voltage of 150 V. Operating temperature range from -55 to 155 °C ensures reliability in various environments.
Philips Semiconductors
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
134-10-328-00-000000
Mill-max Mfg
134-10-328-00-000000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
4-1571552-4
TE Connectivity
TE Connectivity 4-1571552-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The housing material is thermoplastic, ensuring reliable performance in temperatures ranging from -55°C to 105°C.
840-AG12D-ES-LF
TE Connectivity's 840-AG12D-ES-LF is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for DIP40 devices. The socket has a PCT plastic polyester housing material and operates b/w -55°C to 105°C, making it ideal for various electronic applications.
XR2A-1415
Omron
IC SOCKET; Manufacturer Series: XR2;
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
HLT-1712-T-T
Samtec
The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
XR2A-2221-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH; Contact Material: BERYLLIUM COPPER;
350-10-117-00-001000
350-10-117-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP17 devices with 17 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
XR2T-0811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; JESD-609 Code: e4;
214-99-308-01-670800
214-99-308-01-670800 by Mill-max Mfg is a DIP8 IC socket with NYLON46 housing and BERYLLIUM COPPER contacts. It has 8 contacts with TIN LEAD mating finish and Tin/Lead termination. Ideal for chip carrier applications requiring a rectangular contact configuration.
ZPD11XA
Carlo Gavazzi Holding Ag
ZPD11XA by Carlo Gavazzi Holding Ag is a 11-contact relay socket with GLASS FILLED POLYAMIDE66 housing. It has a current rating of 10A, suitable for -25 to 70°C operations. Ideal for chip carrier IC & component sockets in various applications.
XR2A-2825
203-2737-55-1102
3m Electronic Products Division
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
110-93-308-41-001000
110-93-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing and Beryllium Copper contacts. It is designed for DIP8 devices, featuring 8 contacts with Tin/Lead finish. Ideal for applications requiring reliable connection in electronic circuits.
114-87-316-41-117101
Preci-dip Sa
IC SOCKET; Device Type Used On: DIP16; Housing Material: PCT POLYESTER; No. of Contacts: 16; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
HLS-1820-T-22
The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
173-10-310-00-001000
173-10-310-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP10 devices with 10 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
SS5-20-3.50-L-D-K-TR
IC SOCKET;
27E125
IC SOCKET; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 10; Contact Finish (Mating): NOT APPLICABLE;
08-3518-10
Aries Electronics
Aries Electronics 08-3518-10 is a DIP8 IC socket with 0.1" contact pitch, suitable for surface mount termination. It features brass contacts with gold finish, rated at 3A current. Ideal for applications requiring chip carrier sockets on PCBs with rectangular contact pattern and 7.62mm row spacing.
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RSE120159
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
RSE116166
RELAY SOCKET;
RSE116627
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 11; Manufacturer Series: RSE11662; Additional Features: LOW PROFILE;
RSE116631
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; JESD-609 Code: e4; No. of Contacts: 11; Additional Features: LOW PROFILE;
RSE116635
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 13; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD;
RSE116661
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSE; JESD-609 Code: e4; No. of Contacts: 14; Additional Features: LOW PROFILE;
RSE116663
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD; No. of Contacts: 14; JESD-609 Code: e4;
RSE116665
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; No. of Contacts: 14; Contact Finish (Mating): GOLD;
RSE116667
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; Manufacturer Series: RSE; No. of Contacts: 14; JESD-609 Code: e4;
RSE116669
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Manufacturer Series: RSE;
RSE116675
RSE116677
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; No. of Contacts: 14; JESD-609 Code: e4; Manufacturer Series: RSE;
RSE116681
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSE; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE; JESD-609 Code: e4;
RSE116683
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; No. of Contacts: 16; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD;
RSE116687
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; No. of Contacts: 8; JESD-609 Code: e4; Minimum Operating Temperature: -65 Cel;
RSE116691
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSE; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE; No. of Contacts: 8;
RSE116693
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Additional Features: LOW PROFILE; Manufacturer Series: RSE;
RSE116695
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 8; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Manufacturer Series: RSE;
RSE116697
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD; No. of Contacts: 8;
RSE116699
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD; Manufacturer Series: RSE; JESD-609 Code: e4;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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