Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
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$69.230
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$80.860
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Nova Conductors
$55.272
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$139.333
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Vyrian
Sunrise Surplus Inc.
AZTECH Wire
$0.460
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Semicontronic
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Chip Carrier IC & Component Sockets RSE120159 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Amphenol
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Special Features:
RSE120159 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
NSN
5935-01-582-6510, 5935015826510
NIIN
015826510
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market, including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks. Founded in 1932, Amphenol trades on the New York Stock Exchange under the ticker APH and is headquartered in Wallingford, Connecticut, USA.
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
SS14
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
M39029/58-360
Glenair
CONNECTOR ACCESSORY; Contact Gender: MALE; Material: COPPER ALLOY; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT; MIL Conformity: YES;
SMBJ18CA
Pro-an Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Polarity: BIDIRECTIONAL; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V;
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Dc Components
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Littelfuse
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
STMicroelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
Diodes Incorporated
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
110-13-314-10-001000
Mill-max Mfg
110-13-314-10-001000 by Mill-max Mfg is a PCT POLYESTER Chip Carrier IC Socket for DIP4 devices with 4 GOLD OVER NICKEL contacts. It features a RECTANGLE contact configuration and is commonly used in relay socket applications.
08-6501-21
Aries Electronics
Aries Electronics 08-6501-21 is a DIP8 IC socket with 15.24mm PCB contact row spacing and rectangular pattern. It features wire wrap termination, gold over nickel mating finish, and P-CUSN contact material. Ideal for applications requiring a current rating of 1.5A at temperatures up to 125°C.
VCF4-1001
TE Connectivity
IC SOCKET; Termination Type: SOLDER; No. of Contacts: 1; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
27E152
TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.
214-99-318-01-670800
The Mill-max Mfg 214-99-318-01-670800 is a Chip Carrier IC Socket with NYLON46 housing and BERYLLIUM COPPER contacts. It has 18 contacts, TIN LEAD mating finish, and Tin/Lead termination with Nickel barrier. Ideal for DIP18 devices in electronic applications.
9-1437539-2
TE Connectivity 9-1437539-2 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a housing material of polyester. The socket has a min operating temperature of -55°C and max of 125°C, with solder termination type.
PT11-0
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE;
DIL16SMDM
Fischer Elektronik & Kg
IC SOCKET; Device Type Used On: DIP16; Contact Finish (Termination): Tin (Sn); No. of Contacts: 16; Contact Finish (Mating): GOLD; JESD-609 Code: e3;
1415044-1
TE Connectivity's 1415044-1 is a Chip Carrier IC Socket with 11 contacts, rated for 10A current. It has a dielectric voltage of 2121VAC and operates b/w -40°C to 70°C. Ideal for use on relays due to its blade pin-skt contact style and solder termination.
334-90-142-00-020000
Mill-max Mfg 334-90-142-00-020000 is a PLASTIC IC SOCKET for SIP42 devices with 42 contacts. Features TIN LEAD (200) OVER NICKEL (150) finish, ideal for Chip Carrier IC & Component Sockets applications.
XR2A-2011-N
IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
XR2T-1801-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2T-2811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
2227MC-16-03-09-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYBUTYLENE TEREPHTHALATE; Additional Features: STANDARD: UL94-0; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
XR2A-1805
IC SOCKET; Manufacturer Series: XR2;
27E121
TE Connectivity's 27E121 is a Chip Carrier IC Socket with NYLON housing. It features 11 RND PIN-SKT contacts, rated for 15A current, and SCREW termination. Ideal for use on RELAY devices, this IC SOCKET measures 3.15" x 1.7" x 0.895", making it suitable for various electronic applications.
4-1571551-4
TE Connectivity 4-1571551-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for applications requiring a mating contact pitch of 0.1 inch, such as chip carrier ICs.
110-13-308-41-001000
110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.
2-1571552-2
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
SJG022100
Amphenol
Amphenol SJG022100 is a 20-contact relay socket with gold mating and tin termination finish. Made of polyetherimide, it's designed for SJG20 devices. Ideal for chip carrier ICs & components, this socket offers reliable connectivity in various electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
RSE116166
RELAY SOCKET;
RSE116685
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD; No. of Contacts: 8; JESD-609 Code: e4;
RSE112063
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 11; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
RSE112065
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; No. of Contacts: 11; Contact Finish (Mating): GOLD; JESD-609 Code: e4;
RSE116631
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; JESD-609 Code: e4; No. of Contacts: 11; Additional Features: LOW PROFILE;
RSE116661
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSE; JESD-609 Code: e4; No. of Contacts: 14; Additional Features: LOW PROFILE;
RSE116697
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD; No. of Contacts: 8;
RSE116701
RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Additional Features: LOW PROFILE; Manufacturer Series: RSE;
RSE120020
RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; No. of Contacts: 8;
RSE120070
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Manufacturer Series: RSE; Contact Finish (Mating): GOLD;
RSE120074
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 8; JESD-609 Code: e4; Manufacturer Series: RSE; Contact Finish (Mating): GOLD;
RSE120151
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 14; Contact Finish (Mating): GOLD; Additional Features: LOW PROFILE; JESD-609 Code: e4;
RSE120153
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
RSE120155
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSE; No. of Contacts: 16; Additional Features: LOW PROFILE; JESD-609 Code: e4;
RSE120157
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD; No. of Contacts: 16;
RSE120161
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; No. of Contacts: 8; Additional Features: LOW PROFILE; Contact Finish (Mating): GOLD;
RSE120163
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 8; Contact Finish (Mating): GOLD; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD;
RSE120165
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
RSE120167
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
RSE120169
RELAY SOCKET; Housing Material: POLYETHERIMIDE; No. of Contacts: 10; Additional Features: LOW PROFILE; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
Supply Digital Components
$106.00
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12,000 In-Stock
Total price ≈ $80,197.29
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