Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
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Gateway Technologies
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$51.343
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Chip Carrier IC & Component Sockets RSE120165 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Amphenol
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Special Features:
RSE120165 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Amphenol is one of the world’s largest providers of high-technology interconnect, sensor and antenna solutions. Our products Enable the Electronics Revolution across virtually every end market, including Automotive, Broadband Communications, Commercial Aerospace, Industrial, Information Technology and Data Communications, Military, Mobile Devices and Mobile Networks. Founded in 1932, Amphenol trades on the New York Stock Exchange under the ticker APH and is headquartered in Wallingford, Connecticut, USA.
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Fairchild Semiconductor
OPA2277UA/2K5E4
Texas Instruments
OPA2277UA/2K5E4 by Texas Instruments is a dual operational amplifier with low-offset and micropower features. It has a max input offset voltage of 100uV, nominal common mode reject ratio of 140dB, and min slew rate of 0.8V/us. Ideal for industrial applications requiring precise signal amplification in compact designs.
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
1N4148
Leshan Radio
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NC7WZ07P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
LL4148
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
BAV99
Toshiba
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
NE555D
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
LM317T
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
ST5-10-1.50-L-D-P-TR
Samtec
IC SOCKET;
D01-9923246
Harwin Plc
IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
264-4493-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 264-4493-00-0602J is a DIP64 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 64 gold (30) over nickel (50) contacts for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
SH2B-05
Idec
SH2B-05 by Idec is a chip carrier IC socket with 8 blade pin-skt contacts, rated for 10A current. It is designed for use on relays with screw termination, measuring 2.736" L x 1.181" W x 0.984" D. Ideal for applications requiring reliable connection and secure mounting in industrial settings.
416-43-260-41-003000
Mill-max Mfg
416-43-260-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP60 devices with 60 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
HLT-1905-G-H
The Samtec HLT-1905-G-H is a plastic chip carrier IC socket with 95 brass contacts. It is designed for use on PGA95 devices, featuring gold over nickel contact finish for mating and termination. Ideal for applications requiring reliable connections in electronic components.
PLE08-0
Omron
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8;
XR2A-6405
IC SOCKET; Manufacturer Series: XR2;
251-5949-01-0602
The 3m Electronic Products Division's 251-5949-01-0602 is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing. It has 51 BERYLLIUM COPPER contacts finished in GOLD over NICKEL for ZIP51 devices. Ideal for applications requiring reliable connections and durability.
3-1393310-8
TE Connectivity
IC SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 1; Termination Type: SOLDER;
PT14
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;
7-1437539-6
TE Connectivity 7-1437539-6 is a DIP24 IC SOCKET with 24 contacts, rated at 3A current. It has a PCB contact row spacing of 7.49mm and uses SOLDER termination. Ideal for applications requiring a RECTANGULAR PCB contact pattern and POLYESTER housing material.
XR2B-4011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
ICF-320-T-O-TR
Samtec's ICF-320-T-O-TR is a Chip Carrier IC Socket with 20 contacts, rated at 1A current. It features a rectangular contact pattern, liquid crystal polymer housing material, and surface mount termination type. Ideal for DIP20 devices, it has a mating contact pitch of 0.1 inches and operates b/w -55°C to 125°C.
SS5-20-3.50-L-D-K-TR
551-10-155-18-121003
Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.
GFZ-30-01-G-30-AD
The Samtec GFZ-30-01-G-30-AD is a Chip Carrier IC Socket with 900 contacts. It features Beryllium Copper contact material and Liquid Crystal Polymer housing. Designed for LGA900 devices, it has Gold over Nickel finish for mating and termination. Ideal for high-performance electronic applications.
PY11-02
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
3-1571552-2
TE Connectivity's 3-1571552-2 is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It has a PCB contact row spacing of 15.24mm and uses POLYETHYLENE/POLYESTER housing material. Ideal for DIP40 devices, it operates b/w -55 to 105°C and features solder termination for reliable connections.
XR2A-2015
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Amphenol
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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