Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
Median Price
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2
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1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Nova Conductors
AZTECH Wire
$5.010
Continental Prestige Electronics
Argo Parts USA
Corohmni
Aztec Data Supply Inc.
Bastille Electronics
Plastic housing provides a lightweight and durable option for the chip carrier, making it easy to handle and resistant to damage.
Designed specifically for use on PGA171 devices, ensuring compatibility and secure connection.
Conductivity of brass ensures optimal signal transmission and reliability in the connection.
With a high number of contacts, this chip carrier socket can accommodate complex and high-density circuit designs.
Gold and nickel finishes provide excellent conductivity and corrosion resistance, ensuring a reliable connection over time.
The gold over nickel termination finish further enhances the durability and performance of the socket.
Specifically designed as an IC socket, providing a secure and stable connection for the integrated circuit.
Chip Carrier IC & Component Sockets HLT-0919-G-R attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLT-0919-G-R Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
LM358AN
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Secos
Rochester Electronics
LM2931AZ-5.0RAG
Onsemi
LM2931AZ-5.0RAG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage, 0.1A max output current, and 0.6V max dropout voltage. Ideal for applications requiring stable voltage regulation in temperature-sensitive environments up to 150°C.
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
2N7002DWH6327XTSA1
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
Invensys Sensor Systems
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Repetitive Peak Reverse Voltage: 100 V;
SS14
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW04020000Z0ED
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0ED is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating b/w -55 to 155 °C, it suits SMT applications in automotive electronics due to AEC-Q200 compliance and 0.063 W power dissipation.
1N4148WT
Taitron Components
8452-21B1-RK-TP
3m Electronic Products Division
8452-21B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with a housing made of glass-filled polyphenylene sulfide. It is used on PLCC52 devices and has a surface mount termination type. With 52 contacts and insulation resistance of 1G ohm, it operates in temperatures ranging from -40 to 105 °C.
94.04SMA
Finder
RELAY SOCKET; No. of Contacts: 14;
828-AG11D-ESL
TE Connectivity
TE Connectivity's 828-AG11D-ESL is a DIP28 IC SOCKET with 28 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and polyester housing material. Ideal for applications requiring a solder termination type, it operates b/w -55°C to 125°C temperature range.
XR2A-2001-N
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A;
PT14-0
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
22-3
Grayhill
TRANSISTOR SOCKET; Housing Material: PLASTIC; Contact Finish (Mating): GOLD; No. of Contacts: 4; Manufacturer Series: 22; JESD-609 Code: e4;
4-1419106-0
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
7-1437539-0
TE Connectivity's 7-1437539-0 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular contact pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has a housing made of polyester and operates within -55 to 105°C temperature range, terminated by soldering with mating pitch of 0.1 inch.
XR2D-4004
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
1-390261-4
TE Connectivity 1-390261-4 is a Chip Carrier IC Socket with 16 contacts, 7.62mm PCB row spacing, and glass-filled PBT housing material. It is used for DIP16 devices, has a solder termination type, and operates b/w -40°C to 105°C. Ideal for applications requiring a mating contact pitch of 0.1 inch and insulation resistance of 1 Gohm at 1000VAC dielectric voltage withstand.
SS5-15-3.50-L-D-K-TR
Samtec
IC SOCKET;
PY11-Y1
RELAY SOCKET;
IC51-0844-401-1
Yamaichi Electronics
Yamaichi Electronics IC51-0844-401-1 is a PLCC84 socket with POLYETHERIMIDE housing, BE-CU contacts, and 1000000000 ohm insulation resistance. It operates b/w -55°C to 170°C, making it ideal for high-temp applications in electronics manufacturing. The socket has 84 contacts with AU ON NI finish and dielectric voltage of 700VAC.
110-43-628-41-001000
Mill-max Mfg
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
8PFA
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
2-1571552-4
TE Connectivity's 2-1571552-4 is a Chip Carrier IC Socket with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for DIP16 devices, it has a temperature range from -55°C to 105°C and dielectric voltage withstand of 1400VAC.
1-2199299-5
TE Connectivity 1-2199299-5 is a Chip Carrier IC Socket with 40 contacts, 0.1" pitch, and bellowed contact style. It has a PCB contact row spacing of 15.24mm and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and dielectric voltage withstand capability.
27E121
TE Connectivity's 27E121 is a Chip Carrier IC Socket with NYLON housing. It features 11 RND PIN-SKT contacts, rated for 15A current, and SCREW termination. Ideal for use on RELAY devices, this IC SOCKET measures 3.15" x 1.7" x 0.895", making it suitable for various electronic applications.
PL15
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLT-0716-G-H
IC SOCKET; Device Type Used On: PGA112; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 112; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0910-G-H
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0910-G-R
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 90; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0911-G-H
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Material: BRASS; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0911-G-R
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4;
HLT-0911-G-T
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 99;
HLT-0913-G-H
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 117;
HLT-0913-G-R
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 117;
HLT-0914-G-H
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 126;
HLT-0914-G-T
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0915-G-T
IC SOCKET; Device Type Used On: PGA135; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 135;
HLT-0916-G-R
IC SOCKET; Device Type Used On: PGA144; Housing Material: PLASTIC; No. of Contacts: 144; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0917-G-R
IC SOCKET; Device Type Used On: PGA153; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0918-G-H
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0918-G-R
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; No. of Contacts: 162; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-G-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0919-G-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; No. of Contacts: 171; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-T-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-R
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50);
Supply Digital Components
$106.00
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