Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
Median Price
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Vyrian
1+ parts
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Nova Conductors
AZTECH Wire
$5.010
Continental Prestige Electronics
Argo Parts USA
Corohmni
Aztec Data Supply Inc.
Bastille Electronics
Plastic housing provides a lightweight and durable option for the chip carrier, making it easy to handle and resistant to damage.
Designed specifically for use on PGA171 devices, ensuring compatibility and secure connection.
Conductivity of brass ensures optimal signal transmission and reliability in the connection.
With a high number of contacts, this chip carrier socket can accommodate complex and high-density circuit designs.
Gold and nickel finishes provide excellent conductivity and corrosion resistance, ensuring a reliable connection over time.
The gold over nickel termination finish further enhances the durability and performance of the socket.
Specifically designed as an IC socket, providing a secure and stable connection for the integrated circuit.
Chip Carrier IC & Component Sockets HLT-0919-G-R attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLT-0919-G-R Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
ULN2803ADWRG4
Texas Instruments
ULN2803ADWRG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output, and built-in transient protection. It operates b/w -40 to 85 °C with a max supply voltage of 3 V. Ideal for applications requiring sink current flow direction in a small outline package style.
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Vishay Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE; Package Shape: RECTANGULAR; Transistor Application: SWITCHING;
SN65HVD234DR
SN65HVD234DR by Texas Instruments is an 8-terminal interface circuit with a data rate of 1 Mbps. Operating temperature ranges from -40 to 125 °C, making it ideal for automotive applications. With a supply voltage of 3.3 V and low current draw of 6 mA, it's suitable for network interfaces in compact designs.
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
NE555D
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
LL4148
Lite-on Semiconductor
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
SS14
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
ABS25-32.768KHZ-T
Abracon
Abracon's ABS25-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal frequency, such as IoT devices and precision timing systems in industrial settings.
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
PT14-0
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
XR2T-2201-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
PF083A-D
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
2271015
Phoenix Contact
RELAY SOCKET; Device Type Used On: SIP1; Housing Material: POLYAMIDE; No. of Contacts: 1; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
540-88-044-17-400
Preci-dip Sa
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
60431011
Delphi Connection Systems
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
P2RF-08
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2A-1405
IC SOCKET; Manufacturer Series: XR2;
214-3339-00-0602
3m Electronic Products Division
IC SOCKET; Device Type Used On: ZIP14-DIP14; Housing Material: POLYSULFONE AND TORLON; No. of Contacts: 14;
PLCC-032-T-N
Samtec
Samtec's PLCC-032-T-N is a 32-contact IC socket with Liquid Crystal Polymer housing. Featuring bellowed contact style, it operates b/w -55°C to 105°C. Ideal for PLCC32 devices, it has surface mount termination and measures 0.7" x 0.8" x 0.2".
TTD08
Taicom
TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
PY11QN
RELAY SOCKET;
PF083A
2271031
XR2A-1625
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
342-40-156-00-593000
Mill-max Mfg
Mill-max Mfg's 342-40-156-00-593000 is a POLYETHYLENE IC SOCKET for SIP56 devices with 56 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
XR2T-0821-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
ST5-10-1.00-L-D-P-TR
IC SOCKET; Contact Finish (Termination): MATTE TIN OVER NICKEL;
214-3339-00-0602J
The 3M Electronic Products Division's 214-3339-00-0602J is a DIP14 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 14 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier IC applications requiring a secure and durable component socket solution.
PR1-BSC3/2X21
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLT-0716-G-H
IC SOCKET; Device Type Used On: PGA112; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 112; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0910-G-H
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0910-G-R
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 90; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0911-G-H
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Material: BRASS; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0911-G-R
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4;
HLT-0911-G-T
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 99;
HLT-0913-G-H
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 117;
HLT-0913-G-R
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 117;
HLT-0914-G-H
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 126;
HLT-0914-G-T
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0915-G-T
IC SOCKET; Device Type Used On: PGA135; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 135;
HLT-0916-G-R
IC SOCKET; Device Type Used On: PGA144; Housing Material: PLASTIC; No. of Contacts: 144; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0917-G-R
IC SOCKET; Device Type Used On: PGA153; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0918-G-H
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0918-G-R
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; No. of Contacts: 162; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-G-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0919-G-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; No. of Contacts: 171; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-T-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-R
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50);
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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