Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
Median Price
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1k+
Vyrian
1+ parts
100+ parts
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Nova Conductors
AZTECH Wire
$5.010
Continental Prestige Electronics
Argo Parts USA
Corohmni
Aztec Data Supply Inc.
Bastille Electronics
Plastic housing provides a lightweight and durable option for the chip carrier, making it easy to handle and resistant to damage.
Designed specifically for use on PGA171 devices, ensuring compatibility and secure connection.
Conductivity of brass ensures optimal signal transmission and reliability in the connection.
With a high number of contacts, this chip carrier socket can accommodate complex and high-density circuit designs.
Gold and nickel finishes provide excellent conductivity and corrosion resistance, ensuring a reliable connection over time.
The gold over nickel termination finish further enhances the durability and performance of the socket.
Specifically designed as an IC socket, providing a secure and stable connection for the integrated circuit.
Chip Carrier IC & Component Sockets HLT-0919-G-R attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLT-0919-G-R Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
LD1117S33TR
STMicroelectronics
LD1117S33TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It has a small outline package style, operates at an adjustable temperature range from 0 to 125°C, and is ideal for applications requiring stable voltage regulation in compact electronic devices.
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1552200168
Molex
WIRE AND CABLE;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
Vicor
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
Formosa Microsemi
Toshiba
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CC0603KRX7R9BB103
Yageo
Yageo CC0603KRX7R9BB103 is a 0603 SMT ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
1571541-1
TE Connectivity
TE Connectivity's 1571541-1 is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 copper alloy contacts, it has a dielectric voltage of 600VAC and insulation resistance of 10^10 ohm. With a current rating of 1A, it operates b/w -55°C to 125°C, making it ideal for chip carrier applications.
342-10-139-00-591000
Mill-max Mfg
Mill-max Mfg's 342-10-139-00-591000 is a POLYETHYLENE chip carrier IC socket with GOLD OVER NICKEL contacts. It features 39 contacts for SIP39 devices and rectangular contact configuration. Ideal for electronic applications requiring reliable connections in IC components.
QIT-314-S001-95
E-tec Interconnect
QIT-314-S001-95 by E-tec Interconnect is a Chip Carrier IC Socket with 14 contacts, 0.1" pitch, and FR4 housing material. It has a PCB contact row spacing of 7.62mm and is used on DIP14 devices. With a temperature range from -55°C to 125°C, it's suitable for various electronic applications requiring reliable solder termination and high insulation resistance.
540-44-032-17-400004
IC SOCKET; Device Type Used On: PLCC32; Housing Material: POLYPHENYLENE SULFIDE; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): MATTE TIN;
2-1437506-0
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; No. of Contacts: 1; Termination Type: PRESS FIT;
XR2A-0811-N
Omron
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYBUTYLENE TEREPHTHALATE;
XR2A-4025
IC SOCKET; Manufacturer Series: XR2;
304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
XR2A-4202
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
PF113A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
XR2D-0804
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
93.01.7.024
Finder
RELAY SOCKET; Device Type Used On: RELAY;
390261-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
XR2A-4205
XR2D-1804
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
XR2A-5011-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4;
150-90-314-00-001000
150-90-314-00-001000 by Mill-max Mfg is a PLASTIC chip carrier IC socket for DIP14 devices with 14 contacts. It features TIN LEAD (200) over NICKEL (150) contact finish for mating and Tin/Lead (Sn/Pb) with Nickel (Ni) barrier for termination. Ideal for rectangular ICs, this socket is commonly used in electronic applications requiring reliable connections.
PTFZ-14-E
RELAY SOCKET; Device Type Used On: RELAY; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 2500VAC; Additional Features: STANDARDS: CE; CSA; TUV; UL;
XR2A-4002
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLT-0716-G-H
Samtec
IC SOCKET; Device Type Used On: PGA112; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 112; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0910-G-H
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0910-G-R
IC SOCKET; Device Type Used On: PGA90; Housing Material: PLASTIC; JESD-609 Code: e4; No. of Contacts: 90; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
HLT-0911-G-H
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Material: BRASS; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0911-G-R
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4;
HLT-0911-G-T
IC SOCKET; Device Type Used On: PGA99; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 99;
HLT-0913-G-H
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; No. of Contacts: 117;
HLT-0913-G-R
IC SOCKET; Device Type Used On: PGA117; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Material: BRASS; No. of Contacts: 117;
HLT-0914-G-H
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); No. of Contacts: 126;
HLT-0914-G-T
IC SOCKET; Device Type Used On: PGA126; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0915-G-T
IC SOCKET; Device Type Used On: PGA135; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 135;
HLT-0916-G-R
IC SOCKET; Device Type Used On: PGA144; Housing Material: PLASTIC; No. of Contacts: 144; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0917-G-R
IC SOCKET; Device Type Used On: PGA153; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
HLT-0918-G-H
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0918-G-R
IC SOCKET; Device Type Used On: PGA162; Housing Material: PLASTIC; No. of Contacts: 162; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-G-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
HLT-0919-G-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; No. of Contacts: 171; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Material: BRASS;
HLT-0919-T-H
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-R
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 171;
HLT-0919-T-T
IC SOCKET; Device Type Used On: PGA171; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Material: BRASS; Contact Finish (Mating): TIN OVER NICKEL (50);
Supply Digital Components
$106.00
$54.25
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12,000 In-Stock
Total price ≈ $80,197.29
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