Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
The Mill-max Mfg 360-90-142-00-001000 is a Chip Carrier IC & Component Socket made of POLYETHYLENE, designed for SIP42 devices with 42 contacts. It features TIN LEAD (200) mating finish over NICKEL (150), and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration.
Median Price
$9.382
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Suppliers In-Stock
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In-Stock Inventory
1k+
Adafruit Industries
1+ parts
$8.364
100+ parts
$7.945
1k+ parts
10k+ parts
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PSC Electronics
$10.400
Nova Conductors
$8.980
Vyrian
VNN
Semicontronic
$7.110
$6.932
$6.897
Advanced Electronics
Continental Prestige Electronics
$8.800
Ampacity Inc.
$15.470
AZTECH Wire
$17.356
Argo Parts USA
Aztec Data Supply Inc.
Robosynatics
Lucentia Tech
Netroflash
$8.531
$8.351
Polyethylene is a durable and cost-effective material that provides good protection for the components inside, making this chip carrier socket a reliable choice for long-term use.
Designed specifically for SIP42 devices, ensuring compatibility and secure connections for optimal performance.
With 42 contacts, this chip carrier socket can accommodate a wide range of components, making it versatile for various applications.
The Tin Lead finish over Nickel provides excellent conductivity and corrosion resistance, ensuring stable and reliable connections with components.
The Tin/Lead finish with Nickel barrier offers effective termination for components, enhancing the durability and longevity of the chip carrier socket.
Being an IC socket type, this chip carrier socket is specifically designed to securely hold integrated circuits in place, providing proper connections for efficient performance.
The rectangle contact configuration ensures secure and stable connections with components, reducing the risk of misalignment or disconnection during operation.
Chip Carrier IC & Component Sockets 360-90-142-00-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
360-90-142-00-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
2N2222A
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
MBRM140T1G
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Vicor
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
326-93-103-41-003000
Mill-max Mfg
Mill-max Mfg's 326-93-103-41-003000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
5-1393143-1
TE Connectivity
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
8428-21B1-RK-TP
3m Electronic Products Division
8428-21B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. Featuring 28 contacts, it has a temperature range of -40 to 105 °C and insulation resistance of 1G ohm. Ideal for surface mount applications requiring reliable connections in electronic devices.
2271028
Phoenix Contact
RELAY SOCKET;
110-44-328-41-001000
Mill-max Mfg's 110-44-328-41-001000 is a POLYETHYLENE IC SOCKET for DIP28 devices with 28 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
150-80-324-00-018101
Preci-dip Sa
150-80-324-00-018101 by Preci-dip Sa is a DIP24 IC socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing material and BRASS contact material. It has 24 contacts with TIN mating finish and Tin (Sn) termination finish. This IC socket is commonly used for chip carrier applications.
822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; JESD-609 Code: e0; Contact Finish (Mating): TIN LEAD;
110-87-314-41-001101
110-87-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts and 7.62mm PCB row spacing. It features Beryllium Copper contact material, Gold Flash finish, and POLYESTER housing material. Ideal for applications requiring a current rating of 1A, dielectric voltage of 1400VAC, and operating temperatures from -55 to 125°C.
MVAT-209-AG-17
Samtec
IC SOCKET; Device Type Used On: PGA209; No. of Contacts: 209; JESD-609 Code: e4; Additional Features: PGA SOCKET; Contact Finish (Termination): GOLD;
XR2T-2401-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
173-10-324-00-001000
173-10-324-00-001000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP24 devices. Featuring 24 contacts with GOLD OVER NICKEL finish, it is a RECTANGLE contact configuration ideal for integrated circuit applications.
350-10-164-00-001000
350-10-164-00-001000 by Mill-max Mfg is a chip carrier IC & component socket made of polyethylene. It is designed for use on SIP64 devices with 64 contacts and features gold over nickel contact finish. This IC socket has a rectangular contact configuration, making it suitable for various applications in electronics.
342-90-139-00-594000
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
2-382401-1
IC SOCKET; Device Type Used On: DIP8; Housing Material: GLASS FILLED POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; No. of Contacts: 8; Manufacturer Series: 382401;
2-1571552-5
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
173-10-306-00-001000
Mill-max Mfg's 173-10-306-00-001000 is a plastic IC socket for DIP6 devices with 6 gold over nickel contacts. It features a rectangular contact configuration, suitable for chip carrier IC applications.
ICF-316-T-O-TR
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
2-1571586-3
TE Connectivity's 2-1571586-3 is a chip carrier IC socket with a PCB contact row spacing of 7.62mm and rectangular contact pattern. It is made of polycyclohexyldimethylene terephthalate, suitable for DIP14 devices. With a rating of 3A, it has a max operating temperature of 105°C and insulation resistance of 5GΩ, making it ideal for various electronic applications.
3-1571552-0
TE Connectivity's 3-1571552-0 is a chip carrier IC socket with 32 contacts and a rectangular PCB contact pattern. It has a body length of 1.6 inches, a body width of 0.7 inches, and a body depth of 0.105 inches. This socket is commonly used on DIP32 devices and can withstand temperatures ranging from -55 to 105°C.
IC51-0484-806
Yamaichi Electronics
Yamaichi Electronics' IC51-0484-806 is a QFP48 chip carrier socket with staggered PCB contact pattern, polysulfone housing, and solder termination. Featuring 48 Be-Cu contacts with AU ON NI finish, it has a mating pitch of 0.02" and dielectric strength of 700VAC. Ideal for applications requiring high insulation resistance and reliable connection in electronic devices.
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360-90-142-00-001100
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; JESD-609 Code: e0; Contact Material: NOT SPECIFIED;
360-90-142-00-001
IC SOCKET; Device Type Used On: SIP42; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Contact Finish (Termination): TIN LEAD OVER NICKEL; Contact Material: NOT SPECIFIED;
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