Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
110-43-328-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, suitable for DIP28 devices. Featuring 28 contacts with Matte Tin over Nickel finish, it has a rectangular contact configuration ideal for integrated circuit applications.
Median Price
$5.160
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DigiKey
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Element14
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Future Electronics
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Arrow
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Chip1Stop
$5.750
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Verical
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Aranea Global
PCT polyester offers good mechanical and thermal properties, making this chip carrier socket durable and reliable.
Designed specifically for DIP28 devices, ensuring a secure and accurate fit for the integrated circuits.
With 28 contacts, this socket can accommodate a wide range of integrated circuit chips, providing versatility in use.
Matte tin over nickel finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for the ICs.
This IC socket type is specifically designed for integrated circuit chips, offering a secure and stable connection for the components.
The rectangular contact configuration ensures a precise alignment with the pins on the integrated circuit chips, minimizing the risk of connection errors.
Chip Carrier IC & Component Sockets 110-43-328-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-43-328-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
SMBJ18CA
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NDT2955
Onsemi
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
Tt Electronics Plc
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Qualification Status: Not Qualified; JESD-30 Code: R-PSFM-T3;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
2N2222A
Solid State Devices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
2N7002
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LAN8720A-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
Semitron
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Formosa Microsemi
8-1393163-3
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SOLDER; No. of Contacts: 3; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
XR2T-1811-N
Omron
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
XR2A-4211-N
IC SOCKET; Device Type Used On: DIP42; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); No. of Contacts: 42;
220-3342-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 220-3342-00-0602J is a DIP20 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 20 gold-plated contacts for mating and termination, suitable for chip carrier applications.
PA1A-PS-H
Panasonic
RELAY SOCKET; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED;
XR2P-1041
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2P;
28-351000-11-RC
Aries Electronics
28-351000-11-RC by Aries Electronics is a 28-contact IC socket for SSOP28-DIP28 devices. It features brass contacts with gold over nickel finish for mating and termination. Ideal for chip carrier IC applications requiring reliable connections in electronic circuits.
PR2-BSP3/4X21
Phoenix Contact
RELAY SOCKET;
XR2A-1811-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
27E891
TE Connectivity's 27E891 is a POLYAMIDE chip carrier socket with SCREW termination, suitable for RELAY devices. Featuring 8 BLADE PIN-SKT contacts, it is an IC SOCKET type ideal for relay applications.
1-2199299-2
TE Connectivity 1-2199299-2 is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and glass-filled PBT housing material. It has a mating contact pitch of 0.1", solder termination, and operates b/w -40°C to 105°C. Ideal for applications requiring a reliable chip carrier socket with rectangular contact pattern and straight mounting style.
RSL116091
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Manufacturer Series: RSL; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD;
PT08QN
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE;
116-93-314-41-008000
Mill-max Mfg
116-93-314-41-008000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP14 devices with 14 contacts. It features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for applications requiring reliable connections in electronic circuits.
APH-1016-T-R
Samtec
APH-1016-T-R by Samtec is a Chip Carrier IC Socket with POLYETHYLENE housing and BRASS contacts. Featuring 16 contacts with TIN OVER NICKEL finish, it is designed for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in electronic assemblies.
5-1437539-3
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
8468-21B1-RK-TP
8468-21B1-RK-TP by 3M is a PLCC68 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It has 68 contacts, matte tin finish over nickel, and operates b/w -40°C to 105°C. Ideal for surface mount applications requiring high insulation resistance and reliable connections.
PY14-02
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Termination): NOT APPLICABLE;
D01-997.2042
Harwin Plc
Sockets and Chip Carriers;
95.15.2SMA
Finder
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-43-308-41-001000
110-43-308-41-001000 by Mill-max Mfg is a DIP8 IC socket with 0.1" contact pitch, suitable for chip carrier ICs. Featuring polyethylene housing, matte tin over nickel termination, and 3A current rating, it operates b/w -55°C to 125°C. Ideal for applications requiring reliable connections in electronic devices.
110-44-628-41-001000
110-44-628-41-001000 by Mill-max Mfg is a POLYETHYLENE chip carrier IC socket with 28 contacts, matte tin over nickel finish. It is designed for DIP28 devices, featuring a rectangular contact configuration. Ideal for applications requiring reliable connections in electronic circuits.
110-43-628-41-001000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PCT POLYESTER; No. of Contacts: 28; JESD-609 Code: e3; Additional Features: DIP SOCKET;
110-44-328-41-001000
Mill-max Mfg's 110-44-328-41-001000 is a POLYETHYLENE IC SOCKET for DIP28 devices with 28 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
110-41-640-41-001000
IC SOCKET; Device Type Used On: DIP40; Housing Material: POLYETHYLENE; Contact Finish (Termination): MATTE TIN OVER NICKEL; JESD-609 Code: e3; Additional Features: DIP SOCKET;
110-43-328-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; Additional Features: LOW PROFILE; JESD-609 Code: e3;
110-43-328-41-105000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; Contact Finish (Mating): NOT SPECIFIED; Additional Features: DIP SOCKET;
110-43-328-41-801100
IC SOCKET; Device Type Used On: DIP28; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); JESD-609 Code: e3; Additional Features: LOW PROFILE; No. of Contacts: 28;
110-43-328-43-001000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; No. of Contacts: 28; Contact Material: NOT SPECIFIED; JESD-609 Code: e3;
Supply Digital Components
$106.00
$54.25
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$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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