Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Mill-max Mfg 304-13-104-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP4 devices with 4 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for various electronic applications.
Median Price
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Polyethylene is a durable and lightweight material, making this chip carrier socket easy to handle and resistant to damage during handling and use.
SIP4 devices are commonly used in various applications, and this chip carrier socket is specifically designed to accommodate SIP4 devices, ensuring compatibility and proper functionality.
With 4 contacts, this chip carrier socket can securely connect the SIP4 device, providing a reliable electrical connection for optimal performance.
The gold over nickel contact finish ensures excellent conductivity and corrosion resistance, maintaining a stable connection between the SIP4 device and the socket.
This chip carrier socket is specifically designed for ICs, providing a secure and reliable connection for the SIP4 device, ensuring proper functionality.
The rectangle contact configuration allows for easy and accurate insertion of the SIP4 device into the socket, ensuring a snug fit and minimizing the risk of connection errors.
Chip Carrier IC & Component Sockets 304-13-104-41-770000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
304-13-104-41-770000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
LM555CMX
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Space Power Electronics
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
EU2B-YS2J03F
Idec
ROTARY SWITCH;
Multicomp Pro
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
Eic Semiconductor
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
6-1415035-1
TE Connectivity
TE Connectivity's 6-1415035-1 is an IC socket with 8 contacts, rated for 16A current. With a body size of 3.031" x 0.622" x 2.421", it operates b/w -40°C to 70°C and uses screw termination. Ideal for chip carrier ICs on relays.
PTF14A
Omron
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
16-350000-11-RC
Aries Electronics
IC SOCKET; Device Type Used On: SOIC16-DIP16; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD OVER NICKEL; Additional Features: SOCKET ADAPTER; No. of Contacts: 16;
XR2A-1801-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2D-1404
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30);
HLT-1712-T-T
Samtec
The Samtec HLT-1712-T-T is a plastic IC socket with 204 brass contacts, featuring tin over nickel mating finish. It is designed for use on PGA204 devices and offers reliable connection termination with tin (Sn) and nickel (Ni) barrier. Ideal for chip carrier applications requiring secure component sockets.
XR2B-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
XR3G-3211
IC SOCKET; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
7-1393161-3
IC SOCKET; Housing Material: POLYAMIDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
RSE120159
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; JESD-609 Code: e4; Contact Finish (Mating): GOLD; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
S421
TE Connectivity's S421 is a chip carrier IC socket with 18 contacts and a PCB contact row spacing of 7.62mm. It has a housing made of glass-filled PBT and can operate in temperatures ranging from -40 to 105 °C. This IC socket is commonly used for solder termination in various electronic applications.
342-90-139-00-594000
Mill-max Mfg
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
XR2C-1011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10);
110-13-628-41-001000
110-13-628-41-001000 by Mill-max Mfg is a PCT POLYESTER Chip Carrier IC Socket for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for electronic applications requiring reliable connections in integrated circuits.
XR2B-2801-N
IC SOCKET; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
5-1437539-3
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
510-13-076-11-041001
510-13-076-11-041001 by Mill-max Mfg is a Chip Carrier IC Socket with 76 contacts, gold finish, and 2.54mm terminal pitch. It is used on PGA76 devices for PCBs with rectangular contact pattern and 2.54mm row spacing, ideal for applications requiring a current rating of 1A in temperatures ranging from -55 to 125°C.
326-93-103-41-003000
Mill-max Mfg's 326-93-103-41-003000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
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304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
304-13-128-41-780000
Mill-max Mfg's 304-13-128-41-780000 is a POLYETHYLENE Chip Carrier IC Socket for SIP28 devices with 28 GOLD OVER NICKEL contacts. Ideal for applications requiring RECTANGLE contact configuration.
304-13-142-41-770000
IC SOCKET; Device Type Used On: SIP42; Housing Material: POLYETHYLENE; JESD-609 Code: e4; Additional Features: UL 94V-0; Contact Finish (Mating): NOT SPECIFIED;
304-13-104-41-780000
IC SOCKET; Device Type Used On: SIP4; Housing Material: POLYETHYLENE; Contact Finish (Termination): GOLD OVER NICKEL; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
304-13-104-41-770100
IC SOCKET; Device Type Used On: SIP4; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Material: NOT SPECIFIED; Additional Features: SIP SOCKET;
304-13-104-41-780100
IC SOCKET; Device Type Used On: SIP4; Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Finish (Mating): GOLD (30) OVER NICKEL (100);
Supply Digital Components
$106.00
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12,000 In-Stock
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