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232-1285-09-0602J

3m Electronic Products Division

232-1285-09-0602J by 3m Electronic Products Division

232-1285-09-0602J by 3M is a DIP32 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 32 gold-over-nickel contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.

Median Price

$14.570

Lifecycle Status

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12

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1k+

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PEI Genesis

USA . 26 parts In-Stock

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Chip1Stop

Japan . 26 parts In-Stock

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$15.000

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Master Electronics

USA . 26 parts In-Stock

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$14.140

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$12.690

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Verical

USA . 10 parts In-Stock

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Rapid Electronics

USA . 26 parts In-Stock

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$12.130

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$12.130

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Nova Conductors

Japan . 25 parts In-Stock

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$19.040

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$19.040

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Vyrian

USA . 12,826 parts In-Stock

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VNN

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IBS Electronics

USA . 26 parts In-Stock

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$12.482

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TME

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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AZTECH Wire

Italy . 684 parts In-Stock

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$9.986

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$12.750

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Continental Prestige Electronics

USA . 1,333 parts In-Stock

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$19.040

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$18.659

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$19.040

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$18.659

Netroflash

USA . 50 parts In-Stock

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$19.040

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$18.088

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$17.707

50

$19.040

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$17.707

Argo Parts USA

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Aztec Data Supply Inc.

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Corohmni

South Africa . 276 parts In-Stock

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Perfect Parts

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Overview

Experience the superior quality and precision engineering of the 232-1285-09-0602J by 3M Electronic Products Division. This chip carrier IC & component socket offers unmatched reliability and durability, thanks to its GLASS FILLED POLYSULFONE housing material and BERYLLIUM COPPER contact material. Ideal for DIP32 devices, this IC socket boasts GOLD (30) over NICKEL (50) contact finish for optimal performance. Trust in 3M's reputation for excellence in electronic products and elevate your projects with the 232-1285-09-0602J.

Feature Benefit Bullets

Housing Material: GLASS FILLED POLYSULFONE

The use of glass filled polysulfone as the housing material provides excellent strength and durability, ensuring the longevity of the chip carrier IC & component sockets.

Device Type Used On: DIP32

Designed specifically for DIP32 devices, ensuring a perfect fit and secure connection for reliable performance.

Contact Material: BERYLLIUM COPPER

Beryllium copper contacts offer excellent conductivity and high durability, ensuring a stable and reliable connection between the socket and the device.

No. of Contacts: 32

With 32 contacts, this socket can accommodate a wide range of IC devices, making it versatile and suitable for various applications.

Contact Finish (Mating): GOLD (30) OVER NICKEL (50)

The gold over nickel contact finish provides excellent conductivity and corrosion resistance, ensuring a reliable and long-lasting connection with the inserted device.

Contact Finish (Termination): GOLD (30) OVER NICKEL (50)

The gold over nickel contact finish on the termination side further enhances the durability and performance of the socket by providing a high-quality surface for soldering or connection.

IC Socket Type: IC SOCKET

Being specifically designed as an IC socket, this product is optimized for use with integrated circuit devices, ensuring compatibility and optimal performance.

Technical Specifications

Chip Carrier IC & Component Sockets 232-1285-09-0602J attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from 3m Electronic Products Division

Connectivity

Number of Positions or Pins:

32

Contact Finish - Mating:

Gold (30) over Nickel (50)

Contact Finish - Termination:

Gold (30) over Nickel (50)

Contact Material:

Beryllium Copper

Physical Characteristics

IC Socket Type:

Housing Material:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

Standard: UL 94V-0

Trade Compliance

232-1285-09-0602J Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

PCN

Manufacturer Highlights

3m Electronic Products Division

With over 60,000 products in our portfolio, 3M brands deliver science-based performance and extraordinary outcomes across almost any industry you can imagine.

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