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232-1285-19-0602J

3m Electronic Products Division

232-1285-19-0602J by 3m Electronic Products Division

The 3M Electronic Products Division's 232-1285-19-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing, BERYLLIUM COPPER contacts, and GOLD (30) OVER NICKEL (50) finish. It is designed for DIP32 devices and has 32 contacts. Ideal for electronic applications requiring reliable connections in a compact form factor.

Median Price

$23.330

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 130 parts In-Stock

1+ parts

$11.600

100+ parts

$6.940

1k+ parts

-

10k+ parts

-

130

$11.600

$6.940

-

-

DigiKey

USA . 11 parts In-Stock

1+ parts

$35.060

100+ parts

$25.331

1k+ parts

$23.747

10k+ parts

-

11

$35.060

$25.331

$23.747

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Perfect Parts

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7

-

-

-

-

Overview

Enhance the performance and reliability of your electronic devices with the 232-1285-19-0602J by 3M Electronic Products Division. Crafted with top-of-the-line materials like beryllium copper and glass-filled polysulfone, this chip carrier IC socket offers unparalleled durability and conductivity. Whether you're working on a DIP32 device or need a secure connection for your integrated circuits, this product delivers exceptional quality and precision. Trust in 3M's reputation for excellence and innovation, and experience the difference that superior components can make in your projects. Elevate your electronics with the 232-1285-19-0602J today.

Feature Benefit Bullets

Housing Material: GLASS FILLED POLYSULFONE

The use of glass filled polysulfone provides high durability and resistance to heat, making this product suitable for long-term use in various environments.

Device Type: DIP32

Compatible with DIP32 devices, ensuring a secure and accurate connection for optimal performance.

Contact Material: BERYLLIUM COPPER

Beryllium copper offers excellent conductivity and durability, ensuring reliable electrical connections for the IC.

No. of Contacts: 32

With 32 contacts, this socket can accommodate a wide range of ICs, providing versatility and compatibility for different applications.

Contact Finish (Mating): GOLD (30) OVER NICKEL (50)

The gold over nickel finish on mating contacts offers superior corrosion resistance and conductivity, ensuring a stable connection over time.

Contact Finish (Termination): GOLD (30) OVER NICKEL (50)

The gold over nickel finish on termination contacts provides reliable soldering points for secure attachment to the circuit board.

IC Socket Type: IC SOCKET

Specifically designed as an IC socket, this product ensures proper alignment and connection for the integrated circuit, reducing the risk of errors or damage during installation.

Technical Specifications

Chip Carrier IC & Component Sockets 232-1285-19-0602J attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from 3m Electronic Products Division

Connectivity

Number of Positions or Pins:

32

Contact Finish - Mating:

Gold (30) over Nickel (50)

Contact Finish - Termination:

Gold (30) over Nickel (50)

Contact Material:

Beryllium Copper

Physical Characteristics

IC Socket Type:

Housing Material:

JESD-609 Code:

e4

Compatibility

Compatible Device Type:

Additional Features

Special Features:

Standard: UL 94V-0

Trade Compliance

232-1285-19-0602J Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.69.40.40

SB

8536.69.40.40

Manufacturer Highlights

3m Electronic Products Division

With over 60,000 products in our portfolio, 3M brands deliver science-based performance and extraordinary outcomes across almost any industry you can imagine.

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