Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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YFS-20-03-H-08-SB-TR by Samtec is a Chip Carrier IC Socket with 160 contacts. It features Phosphor Bronze contact material and Gold over Nickel finish. Designed for BGA160 devices, it uses Liquid Crystal Polymer housing material for high performance in electronic applications.
Median Price
$12.690
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Argo Parts USA
Liquid crystal polymer is a high-performance material known for its excellent thermal and mechanical properties, making it ideal for chip carrier sockets that require durability and reliability.
Designed specifically for BGA160 devices, ensuring a precise and secure fit for the integrated circuits on these chips.
Phosphor bronze is a reliable and durable contact material that provides good electrical conductivity, making it suitable for high-performance chip carrier sockets.
With 160 contacts, this chip carrier socket can accommodate a wide range of integrated circuits, providing versatility and compatibility with various devices.
The gold and nickel coating on the contacts ensures reliable and low-resistance connections, reducing signal loss and enhancing overall performance.
The gold and nickel barrier termination provides excellent corrosion resistance and a stable connection, ensuring long-term reliability for the chip carrier socket.
This socket is specifically designed for integrated circuits, providing a secure and stable connection for the chips, enhancing overall performance and reliability of the system.
Chip Carrier IC & Component Sockets YFS-20-03-H-08-SB-TR attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
YFS-20-03-H-08-SB-TR Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Vicor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
LM555CMX
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Panjit International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
Weitron Technology
350766-1
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
MBR0540T1G
Onsemi
MBR0540T1G by Onsemi is a Schottky rectifier diode with max. forward voltage of 0.62V and max. output current of 0.5A, ideal for applications requiring high efficiency power conversion in small outline packages. Operating temp range: -55 to 150°C, with peak reflow temp at 260°C, making it suitable for various electronic devices needing reliable rectification performance in compact designs.
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Diodes Incorporated
Microchip Technology
DP83848IVVX/NOPB
Texas Instruments
Texas Instruments DP83848IVVX/NOPB is a 3.3V Ethernet transceiver with 100000 Mbps data rate, suitable for industrial applications. It features CMOS technology, operates b/w -40 to 85 °C, and comes in a low profile flatpack package with matte tin finish.
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
27E046
IC SOCKET; Housing Material: NYLON; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Termination Type: SOLDER;
115-47-432-41-001000
Mill-max Mfg
IC SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
4-1571552-8
TE Connectivity's 4-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and PCT-plastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55°C to 105°C.
3334485008
Robert Bosch
RELAY SOCKET; Device Type Used On: RELAY; Mounting Style: STRAIGHT; Body Width: 1.417 inch; No. of Contacts: 5; Body Depth: 1.433 inch;
PT14
Omron
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 14; Contact Finish (Termination): NOT APPLICABLE;
551-10-155-18-121005
Mill-max Mfg's 551-10-155-18-121005 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It is used on PGA155 devices and has 155 contacts with GOLD (10) mating finish over NICKEL (150). The IC socket type features Gold (Au) termination finish with Nickel (Ni) barrier.
95.05
Finder
Finder's 95.05 is a RELAY SOCKET with 8 SQ PIN-SKT contacts rated at 10A. It operates b/w -40°C to 70°C, featuring SNAP ON termination and a compact body measuring 3.09" x 0.622" x 2.965". Ideal for chip carrier IC applications due to its high current capacity and temperature range suitability.
XR2A-4025
IC SOCKET; Manufacturer Series: XR2;
1050281001
Molex
OTHER SOCKET; Device Type Used On: CAMERA; Housing Material: PLASTIC; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 32; Additional Features: STANDARD: UL 94V-0;
D01-9922046
Harwin Plc
IC SOCKET; Device Type Used On: SIP20; Housing Material: POLYAMIDE46; No. of Contacts: 20; Contact Material: NOT APPLICABLE; Additional Features: 94V-0;
A08-LC-TT
Assmann Wsw Components
A08-LC-TT by Assmann Wsw Components is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and polybutylene terephthalate housing material. It has a solder termination type, bellowed contact style, and can withstand temperatures from -55 to 85°C. Ideal for applications requiring a chip carrier socket with rectangular contact pattern on a 0.1-inch pitch.
XR2A-2205
415-43-236-41-001000
Mill-max Mfg's 415-43-236-41-001000 is a POLYETHYLENE chip carrier socket for SIP36 devices with 36 TIN contacts. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration and reliable termination finish.
2227MC-08-03-18-F1
Multicomp Pro
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; JESD-609 Code: e4; Additional Features: STANDARD: UL94-0;
XR2A-5001-N
IC SOCKET; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
XR2C-2011-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
818-22-012-10-001101
IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
8134-HC-6P2
Augat
IC SOCKET; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; No. of Contacts: 1; Maximum Operating Temperature: 125 Cel; Contact Material: NOT APPLICABLE;
264-4493-00-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 264-4493-00-0602J is a DIP64 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 64 gold (30) over nickel (50) contacts for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
326-93-109-41-002000
Mill-max Mfg 326-93-109-41-002000 is a PLASTIC IC SOCKET for SIP9 devices with 9 BERYLLIUM COPPER contacts. Features Tin/Lead finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
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YFS-20-03-H-05-SB-K
Samtec
YFS-20-03-H-05-SB-K by Samtec is a Chip Carrier IC Socket with 100 contacts. It features Phosphor Bronze contact material with Gold over Nickel finish. The housing material is Liquid Crystal Polymer, suitable for BGA100 devices.
YFS-20-03-E-08-SB-K
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 160; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
YFS-20-03-G-08-SB-K
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; No. of Contacts: 160;
YFS-20-03-G-08-SB-TR
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): GOLD; JESD-609 Code: e4; No. of Contacts: 160;
YFS-20-03-H-05-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: LOW PROFILE, TIGER EYE CONTACT; JESD-609 Code: e4;
YFS-20-03-H-08-SB-K
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 160; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); JESD-609 Code: e4;
YFS-20-03-H-10-SB-K
IC SOCKET; Device Type Used On: BGA200; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Contact Material: PHOSPHOR BRONZE; JESD-609 Code: e4;
YFS-20-03-H-10-SB-TR
IC SOCKET; Device Type Used On: BGA200; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: PHOSPHOR BRONZE; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30) OVER NICKEL (50);
Supply Digital Components
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