Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's YFS-20-03-H-05-SB-TR is a Chip Carrier IC Socket with Liquid Crystal Polymer housing. Featuring 100 contacts with Gold over Nickel finish, it is designed for BGA100 devices. Ideal for high-performance applications requiring reliable connections in compact spaces.
Median Price
$190.850
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
DigiKey
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
Nova Conductors
AZTECH Wire
$10.400
Aranea Global
Liquid Crystal Polymer provides high dimensional stability, excellent strength and stiffness, and resistance to chemicals, making it a durable and reliable housing material for the chip carrier IC.
Specifically designed for BGA100 devices, ensuring compatibility and secure connection for your integrated circuits.
With 100 contacts, this chip carrier IC socket provides a high level of connectivity for your components, allowing for complex electronic designs.
The gold over nickel contact finish ensures a reliable and low-resistance mating connection, reducing signal loss and improving overall performance of the component socket.
The gold termination with nickel barrier provides excellent corrosion resistance and durability, ensuring a long-lasting and stable connection for your IC components.
Designed specifically as an IC socket, this product is optimized for securely holding and connecting integrated circuits, providing a reliable platform for your electronic applications.
Chip Carrier IC & Component Sockets YFS-20-03-H-05-SB-TR attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
YFS-20-03-H-05-SB-TR Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
LL4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
LM107H
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Nominal Common Mode Reject Ratio: 96 dB;
TM4C1294NCPDTI3
TM4C1294NCPDTI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 8KB data EEPROM, 20-Ch 12-Bit ADC channels, and 32 DMA channels. Ideal for industrial applications requiring high-speed processing, it offers connectivity options like CAN, Ethernet, I2C, SPI, UART, and USB.
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Siemens
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
Microsemi
Bytesonic Electronics
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
LIS2DH12TR
STMicroelectronics
LIS2DH12TR by STMicroelectronics is a 3-axis accelerometer with digital voltage output. It operates b/w -40 to 85°C, with supply voltage range of 1.71-3.6V. Ideal for applications requiring precise motion sensing in compact spaces like wearables and IoT devices.
MBR0520LT3G
Onsemi
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
ICF-624-TM-O
Samtec
Samtec's ICF-624-TM-O is a Chip Carrier IC Socket with 24 contacts, using Beryllium Copper Alloy. It has a PCB contact row spacing of 15.24mm and operates b/w -55°C to 125°C. Ideal for DIP24 devices, it features a rectangular contact pattern and liquid crystal polymer housing material.
RT78726
TE Connectivity's RT78726 is an 8-contact IC socket with a current rating of 16A. With a dielectric voltage of 7070VAC, it is used on relays in applications requiring a temperature range from -40°C to 70°C. The socket features blade pin-skt contacts and screw terminations, measuring 3.031" L x 0.622" W x 2.717" D for chip carrier ICs.
4-1571552-3
TE Connectivity 4-1571552-3 is a DIP8 IC SOCKET with 8 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The housing material is thermoplastic polyester, ensuring reliable performance in temperatures ranging from -55 to 105°C.
115-47-632-41-003000
Mill-max Mfg
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Material: NOT SPECIFIED; Contact Finish (Termination): TIN;
326-93-101-41-003000
Mill-max Mfg's 326-93-101-41-003000 is a PLASTIC IC SOCKET for SIP1 devices. Features GOLD (30) OVER NICKEL (100) contact finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets with RECTANGLE contact config.
8-1415034-1
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
XR2A-2468
Omron
IC SOCKET; Manufacturer Series: XR2;
ST5-10-1.50-L-D-P-TR
IC SOCKET;
2-1419106-5
TE Connectivity 2-1419106-5 is a NYLON chip carrier socket with 11 RND PIN-SKT contacts. It is designed for use on RELAY devices, featuring SCREW termination type. Ideal for IC SOCKET applications.
5-1415043-1
IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
173-10-328-00-001000
The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
XR2T-2421-N
IC SOCKET; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH;
PF113A-E
RELAY SOCKET; Device Type Used On: RELAY; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
441-PRS21001-12
Aries Electronics
441-PRS21001-12 by Aries Electronics is a PGA441 IC socket with 441 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It features a rectangular PCB contact pattern and polyphenylene sulfide housing material. Ideal for applications requiring high-density chip carrier components on printed circuit boards.
PYF08A-E
RELAY SOCKET;
IC160Z-0204-240
Yamaichi Electronics
Yamaichi Electronics' IC160Z-0204-240 is a POLYAMIDE chip carrier socket for PLCC20 devices with 20 contacts. Featuring COPPER ALLOY contacts, it has an insulation resistance of 500MΩ and dielectric voltage of 350VAC. Ideal for surface mount applications, this socket has a current rating of 1A and bellowed contact style.
XR2T-1611-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
XR2A-2201-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
8PFA
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
1437538-3
IC SOCKET; Device Type Used On: DIP28; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 28;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
YFS-20-03-H-08-SB-TR
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e4; Contact Material: PHOSPHOR BRONZE; Additional Features: LOW PROFILE, TIGER EYE CONTACT;
YFS-20-03-H-05-SB-K
YFS-20-03-H-05-SB-K by Samtec is a Chip Carrier IC Socket with 100 contacts. It features Phosphor Bronze contact material with Gold over Nickel finish. The housing material is Liquid Crystal Polymer, suitable for BGA100 devices.
YFS-20-03-E-05-MSB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: NOT SPECIFIED; No. of Contacts: 100; Contact Finish (Termination): GOLD;
YFS-20-03-E-05-MSB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
YFS-20-03-E-05-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; No. of Contacts: 100;
YFS-20-03-G-05-MSB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e4; No. of Contacts: 100; Contact Finish (Termination): GOLD;
YFS-20-03-G-05-MSB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD;
YFS-20-03-G-05-SB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; No. of Contacts: 100;
YFS-20-03-G-05-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
YFS-20-03-H-05-MSB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e4; No. of Contacts: 100; Contact Finish (Mating): NOT SPECIFIED;
YFS-20-03-H-05-MSB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 100;
YFS-20-03-H-08-SB-K
IC SOCKET; Device Type Used On: BGA160; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 160; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); JESD-609 Code: e4;
YFS-20-03-H-10-SB-K
IC SOCKET; Device Type Used On: BGA200; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): GOLD (30) OVER NICKEL (50); Contact Material: PHOSPHOR BRONZE; JESD-609 Code: e4;
YFS-20-03-H-10-SB-TR
IC SOCKET; Device Type Used On: BGA200; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: PHOSPHOR BRONZE; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30) OVER NICKEL (50);
YFS-20-03-E-F-SB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD; No. of Contacts: 100;
YFS-20-03-E-F-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 100; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
YFS-20-03-G-F-SB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
YFS-20-03-G-F-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
YFS-20-03-H-F-SB-K
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): GOLD; No. of Contacts: 100; JESD-609 Code: e4;
YFS-20-03-H-F-SB-TR
IC SOCKET; Device Type Used On: BGA100; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 100; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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