Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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IC SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
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3
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Vyrian
VNN
Aranea Global
$7.855
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$8.000
Continental Prestige Electronics
AZTECH Wire
$15.910
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Aztec Data Supply Inc.
Argo Parts USA
Chip Carrier IC & Component Sockets 115-47-432-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
IC Socket Type:
115-47-432-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
2N7002
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
FT232RL-TUBE
FTDI
FTDI's FT232RL-TUBE is a bus controller with 28 terminals, operating at 3.3-5.25V. It supports USB, VBUS, and UART interfaces with a data transfer rate of 60MBps. Ideal for industrial applications requiring RS232/RS422/RS485 compatibility in compact designs due to its small outline package style.
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
LM358AN
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
SMBJ18CA
Changzhou Galaxy Century Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
MMBT2907ALT1G
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Meritek Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
TTD08
Taicom
TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
XR2D-1401-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
XR2T-4011-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD;
SS5-15-3.50-L-D-K-TR
Samtec
IC SOCKET;
2271484
Phoenix Contact
RELAY SOCKET;
APA-320-G-A1
Samtec APA-320-G-A1 is a 20-contact IC socket with brass contacts finished in gold over nickel. Its polyester housing makes it suitable for DIP20 devices. The rectangular contact configuration and gold termination enhance its performance in chip carrier applications.
1-1415526-1
TE Connectivity
IC SOCKET; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Additional Features: STANDARDS: CUL; VDE; No. of Contacts: 4;
110-13-308-41-001000
Mill-max Mfg
110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.
XR2A-2825
IC SOCKET; Manufacturer Series: XR2;
PYF08M
342-90-156-00-593000
Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
116-43-314-41-008000
116-43-314-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP14 devices with 14 contacts. Featuring MATTE TIN OVER NICKEL finish, it is ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
200-6311-9UN-1900
3m Electronic Products Division
The 3M Electronic Products Division's 200-6311-9UN-1900 is a Chip Carrier IC Socket with POLYETHERSULFONE housing. It features 121 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) finish for PGA121 devices. Ideal for high-performance electronic applications requiring reliable connections.
2-1571552-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
HLT-0919-G-R
Samtec's HLT-0919-G-R is a plastic chip carrier socket with 171 brass contacts. It features gold over nickel contact finish for mating and termination, suitable for PGA171 devices. This IC socket type is ideal for high-performance applications requiring reliable connections.
415-13-228-41-003000
The Mill-max Mfg 415-13-228-41-003000 is a POLYETHYLENE IC SOCKET for SIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
P7SA-10F
Omron's P7SA-10F chip carrier IC socket is designed for relay devices, with 10 contacts and a current rating of 6A. Featuring screw termination, it has a wide operating temperature range (-40 to 85°C) and high insulation resistance (1G ohm). Ideal for relay applications requiring reliable connections in harsh environments.
XR2A-1401-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2A-2463-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
840-AG12D-ES-LF
TE Connectivity's 840-AG12D-ES-LF is a Chip Carrier IC Socket with 40 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for DIP40 devices. The socket has a PCT plastic polyester housing material and operates b/w -55°C to 105°C, making it ideal for various electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
115-47-632-41-001000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): TIN; Contact Material: NOT SPECIFIED;
115-47-632-41-003000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e3; Contact Material: NOT SPECIFIED; Contact Finish (Termination): TIN;
115-47-636-41-001000
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
115-47-636-41-003000
115-47-640-41-001000
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
115-47-640-41-003000
IC SOCKET; Contact Finish (Termination): TIN; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED;
115-43-308-41-003000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 8; JESD-609 Code: e3;
Supply Digital Components
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12,000 In-Stock
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