Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity's 7-1437529-5 is a DIP8 IC socket with 8 contacts and a contact pitch of 0.1 inch. It has a housing made of polyester and can operate in temperatures ranging from -55 to 125 °C. This socket is commonly used for chip carrier ICs and components, offering a current rating of 3A and gold termination finish.
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Nova Conductors
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VNN
Vyrian
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Argo Parts USA
$2.668
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$2.614
Perfect Parts
Modulus Dynamics
Aztec Data Supply Inc.
SIE Connect GmbH (Excess)
Allows for easy and secure connection to the PCB, ensuring reliable performance.
Provides excellent durability and electrical insulation, ensuring long-lasting and safe usage.
Specifically designed for DIP8 devices, ensuring a perfect fit and compatibility.
Suitable for extreme environments, making it reliable in harsh conditions.
Offers a reliable and secure method of terminating connections, ensuring strong and lasting solder joints.
Compatible with standard contact pitch, allowing for compatibility with a wide range of components.
Designed to accommodate 8 pins, suitable for various integrated circuits and components.
Ensures high insulation properties, preventing unwanted electrical leakage or shorts.
Provides a straightforward and easy mounting process, simplifying assembly.
Can handle a maximum current of 3 A, making it suitable for a variety of applications.
Utilizes gold contact finish, offering excellent conductivity and corrosion resistance.
Compact body design allows for space-saving installations, ideal for compact electronic devices.
Specifically designed as an IC socket, ensuring a reliable and secure connection for integrated circuits.
Able to withstand high operating temperatures, ensuring stable performance even in challenging conditions.
Standard terminal pitch size, ensuring compatibility with a wide range of components and devices.
Chip Carrier IC & Component Sockets 7-1437529-5 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
Number of Positions or Pins:
Contact Finish - Termination:
Installation Type:
Mating Contact Pitch:
PCB Contact Row Spacing:
Terminal Pitch:
Mounting Style:
IC Socket Type:
Housing Material:
Depth:
JESD-609 Code:
Current Rating:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
Special Features:
7-1437529-5 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMBJ18CA
Transpro Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; JESD-609 Code: e0; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Breakdown Voltage: 21.1 V; Maximum Clamping Voltage: 29.2 V;
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20Z
Maxim Integrated
DS18B20Z by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring precise temperature monitoring in compact spaces.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M24308/2-1F
TE Connectivity
TE Connectivity's M24308/2-1F D-Sub Connector features 9 contacts, 2 rows, and a shell size of 1/E. With a rated current of 7.5A, it operates b/w -55°C to 125°C. Ideal for cable mounting applications, this connector has a steel shell with cadmium finish and uses crimp termination for female contact pins.
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WT
Onsemi
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
SS14
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
Bytesonic Electronics
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
1N4148WSF-7
Diodes Incorporated
1N4148WSF-7 by Diodes Inc. is a single silicon rectifier diode with max output current of 0.25A and max reverse voltage of 100V. It operates b/w -55 to 150°C, has a small outline package style, and is suitable for surface mount applications in various electronic circuits.
2N2222A
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
9-1437514-0
TE Connectivity's 9-1437514-0 is a Chip Carrier IC Socket with PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. It operates b/w -65°C to 125°C, making it suitable for various electronic applications requiring reliable connections.
CQF024-165B
IC SOCKET; Device Type Used On: QFP24; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 24; Manufacturer Series: CQF;
XR2A-4002
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
HLT-1507-T-R
Samtec
The Samtec HLT-1507-T-R is a plastic IC socket with 105 brass contacts, featuring Tin over Nickel mating finish. Designed for use on PGA105 devices, it offers reliable connectivity and durability in chip carrier applications.
110-87-328-41-001101
Preci-dip Sa
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
XR2T-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
818-22-012-10-001101
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP12; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 12; Contact Finish (Termination): GOLD OVER NICKEL;
XR2A-4801-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
P2CF-08-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
XR2A-3201-N
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e4; No. of Contacts: 32; Contact Finish (Mating): NOT SPECIFIED;
XR2A-2202
IC SOCKET; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
XR2T-0821-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2T; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
1-2199298-6
TE Connectivity 1-2199298-6 is a Chip Carrier IC Socket with 20 contacts, 7.62mm PCB row spacing, and GLASS FILLED PBT housing material. It has a solder termination type and operates b/w -40°C to 105°C. Ideal for applications requiring a current rating of 1A in straight mounting style.
27E894
TE Connectivity 27E894 is a GLASS FILLED POLYESTER IC SOCKET with SCREW termination, suitable for RELAY devices. Featuring 14 RND PIN-SKT contacts with Tin finish (Sn), it offers reliable connectivity in chip carrier applications.
HLT-1910-G-T
The Samtec HLT-1910-G-T is a 190-contact IC socket with brass contacts and gold over nickel finish. It is designed for use on PGA190 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections and durability.
614-87-964-31-012101
614-87-964-31-012101 by Preci-dip Sa is a DIP64 IC socket with 64 contacts. It features Beryllium Copper contact material with Gold Flash mating finish and Tin termination. The housing material is PCT Polyester, making it ideal for use in chip carrier applications.
5-1437539-3
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
6-1415034-1
IC SOCKET; No. of Contacts: 2; Additional Features: STANDARDS: CUL; VDE; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
5-1437536-2
TE Connectivity 5-1437536-2 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and polyester housing material. Suitable for applications requiring a current rating of 3A, it has solder termination and operates b/w -55°C to 125°C.
XR2A-1621-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
7-1437539-0
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
7-1437539-6
Supply Digital Components
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12,000 In-Stock
Total price ≈ $80,197.29
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