Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
Median Price
$2.388
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Toby Electronics
1+ parts
$1.729
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$1.588
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$1.332
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$0.904
Mouser Electronics
$2.150
$1.740
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$2.560
$1.770
$1.330
Powell Electronics
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Samtec
$0.930
DigiKey
$2.830
$2.045
$1.576
$1.416
Verical
$1.686
RS (Exports)
$2.216
$1.739
Nova Conductors
Vyrian
Prism Electronics
Netroflash
Continental Prestige Electronics
$1.303
Argo Parts USA
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Perfect Parts
The 7.62mm spacing allows for easy integration into various PCB layouts, providing flexibility in design.
The rectangular contact pattern ensures a secure and reliable connection between the IC socket and the PCB, reducing the risk of signal loss.
The use of liquid crystal polymer as the housing material offers high strength and excellent thermal properties, ensuring durability and reliability in various operating conditions.
Specifically designed for DIP16 devices, this socket ensures a precise fit and compatibility, reducing the risk of incorrect connections.
With a minimum operating temperature of -55°C, this IC socket is suitable for use in extreme environmental conditions, providing reliable performance in harsh environments.
The surface mount termination type allows for easy and efficient installation on the PCB, saving time and effort during assembly.
The 0.1-inch pitch ensures compatibility with standard IC packages, making this socket a versatile choice for various applications.
The 0.8-inch body length provides ample space for the IC device, ensuring a secure fit and proper alignment within the socket.
The use of beryllium copper as the contact material offers high conductivity and excellent durability, ensuring long-term reliability and performance.
With 16 contacts, this IC socket is suitable for DIP16 devices, providing a secure connection for all pins and reducing the risk of signal interference.
The matte tin over nickel finish on the mating contacts offers corrosion resistance and low contact resistance, ensuring reliable signal transmission.
The straight mounting style provides a secure and stable installation on the PCB, reducing the risk of loosening or misalignment during operation.
The round pin socket contact style ensures a reliable and stable connection, reducing the risk of signal loss or intermittent connections.
With a width of 0.375 inches, this IC socket is compact yet spacious enough to accommodate the DIP16 device securely, optimizing space on the PCB.
The matte tin finish with nickel barrier on the termination contacts provides excellent solderability and resistance to oxidation, ensuring long-term performance and reliability.
The 0.18-inch body depth offers sufficient space for the IC device, ensuring proper alignment and a secure fit within the socket.
This IC socket is specifically designed for integrated circuits, providing a reliable and efficient connection between the IC device and the PCB.
The rectangular contact configuration ensures a secure and stable connection, minimizing the risk of signal interference or loss.
With a maximum operating temperature of 125°C, this IC socket is suitable for a wide range of applications, providing reliable performance in varying temperature conditions.
The 2.54mm terminal pitch offers compatibility with standard PCB layouts, making this IC socket a versatile choice for different electronic designs.
Chip Carrier IC & Component Sockets ICF-316-T-O-TR attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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ICF-316-T-O-TR Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
SMBJ18CA
Shenzhen Socay Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
STM32H753IIT6
STMicroelectronics
STM32H753IIT6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs and 2-Ch 12-Bit DACs, suitable for industrial applications requiring high-speed data processing and connectivity via CAN, ETHERNET, USB, and more.
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
LM78L05ACMX/NOPB
Texas Instruments
LM78L05ACMX/NOPB by Texas Instruments is a fixed positive single output standard regulator with an output voltage of 5V and max current of 0.1A. It operates b/w 0-125°C, has a dropout voltage of 1.6V, and can handle input voltages up to 30V making it ideal for various electronic applications requiring stable power supply.
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
LM358MX
ROHM
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR;
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
PIC18F4550T-I/PT
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
2N2222A
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
232-1285-09-0602J
3m Electronic Products Division
232-1285-09-0602J by 3M is a DIP32 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 32 gold-over-nickel contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
808-AG11D
TE Connectivity
TE Connectivity's 808-AG11D is a DIP8 IC socket with 8 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 7.62mm row spacing and polyester housing material. Suitable for applications requiring a mating contact pitch of 0.1 inch, it operates b/w -55°C to 125°C temperature range.
2271028
Phoenix Contact
RELAY SOCKET;
1SVR405652R0000
Abb
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
PTF14A-E
Omron
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 14;
PY11-02
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
M12883/40-24
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; JESD-609 Code: e4; Manufacturer Series: M12883; Contact Finish (Termination): GOLD;
264-1300-29-0602J
The 3M Electronic Products Division's 264-1300-29-0602J is a Chip Carrier IC Socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features DIP64 device compatibility, GOLD (30) OVER NICKEL (50) mating finish, and Gold (Au) - with Nickel (Ni) termination finish. Ideal for applications requiring reliable connections in electronic circuits.
XR2A-2473-N
IC SOCKET; Device Type Used On: DIP24; JESD-609 Code: e4; No. of Contacts: 24; Contact Finish (Termination): Gold (Au); Contact Finish (Mating): NOT SPECIFIED;
XR2A-6402
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A;
27390
Struthers-dunn
RELAY SOCKET; Manufacturer Series: 27390; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 12; Additional Features: POLARIZED;
342-90-156-00-593000
Mill-max Mfg
Mill-max Mfg's 342-90-156-00-593000 is a POLYETHYLENE chip carrier IC socket for SIP56 devices with 56 contacts. Features TIN LEAD (200) mating finish over NICKEL (150) and Tin/Lead termination with Nickel barrier. Ideal for rectangular contact configuration in electronic applications.
PR2-BSP3/4X21
2-1571552-2
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
TTD08
Taicom
TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
XR2T-2411-N
IC SOCKET; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T;
M12883/45-01
Amphenol's M12883/45-01 is a POLYETHERIMIDE chip carrier socket with 8 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various relay applications due to its high-quality contact finish and durable housing material.
CQF100M-155A
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 100; Manufacturer Series: CQF;
304-13-142-41-770000
The Mill-max Mfg 304-13-142-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP42 devices with 42 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for electronic applications requiring reliable connections.
APH-1508-G-T
The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
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ICF-324-F-O
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-308-T-O
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-308-T-I-TR
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-320-T-O-TR
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
ICF-316-T-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Mating Contact Pitch (inch): 0.1;
ICF-328-T-O-TR
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .375 inch;
ICF-316-S-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-316-F-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-316-F-I
ICF-316-T-I
ICF-316-T-O
ICF-316-TL-I-TR
ICF-316-TL-I
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Terminal Pitch (mm): 2.54;
ICF-316-TL-O-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY;
ICF-316-TL-O
ICF-316-T
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
ICF-316-TM-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .375 inch;
ICF-316-TM-I
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 16;
ICF-316-TM-O-TR
ICF-316-TM-O
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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