Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
8484-11B1-RK-TP by 3M is a PLCC84 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 84 contacts made of PHOSPHOR BRONZE, it has an insulation resistance of 1G ohm. With a temperature range from -40°C to 105°C, it is ideal for chip carrier applications.
Median Price
$2.796
Lifecycle Status
Suppliers In-Stock
22
In-Stock Inventory
1k+
Farnell
1+ parts
$2.990
100+ parts
$2.090
1k+ parts
$1.670
10k+ parts
-
Mouser Electronics
$3.250
$2.260
$1.990
$1.860
DigiKey
$3.430
$2.553
$2.205
Newark
$3.540
$2.550
$2.080
Element14
$3.578
$2.937
$2.147
$1.983
Chip1Stop
$2.743
$1.980
TTI
$2.360
$2.110
TTI Europe
$1.857
Master Electronics
$2.320
$2.020
Verical
$2.729
$2.459
Arrow
$0.400
Nova Conductors
$1.994
VNN
LIBRA Elektronik GmbH
IBS Electronics
$3.310
$2.791
$2.525
Vyrian
Bristol Electronics
Flex Direct, LLC
A&K Electronics
Electronics Depot
LWI Electronics Inc
Prism Electronics
Ampacity Inc.
$1.390
Argo Parts USA
Semicontronic
$3.020
$2.944
$2.929
Continental Prestige Electronics
$3.140
$2.240
$1.820
Authorized Procurement Solutions
Aztec Data Supply Inc.
Glotronic Ltd.
Bastille Electronics
Corohmni
The use of glass-filled polyphenylene sulfide provides high strength and thermal resistance, making the product durable and suitable for a wide range of operating temperatures.
The compatibility with PLCC84 devices ensures a secure fit and reliable connection for the intended components.
With a minimum operating temperature of -40°C, this product can function effectively in harsh environments or low-temperature conditions.
Solder termination provides a reliable electrical connection and easy installation of the chip carrier IC or component socket.
The specific body length of 1.419 inches ensures compatibility with devices designed for this size, offering a secure fit.
The use of phosphor bronze as the contact material ensures good electrical conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.
With 84 contacts, this product can accommodate a wide range of connections, providing versatility and compatibility with various devices.
The high insulation resistance of 1,000,000,000 ohms ensures minimal signal loss and interference, contributing to the reliability of the product.
The matte tin finish over nickel provides a durable and low-resistance contact surface, improving the overall conductivity and reliability of the connections.
The straight mounting style facilitates easy installation and alignment of the chip carrier IC or component socket, ensuring a secure and stable connection.
The bellowed contact style allows for flexibility and resilience, accommodating variations in device dimensions and ensuring a secure fit.
The specific body width of 1.419 inches ensures compatibility with devices designed for this size, offering a secure fit.
The specific body depth of 0.315 inches ensures compatibility with devices designed for this size, offering a secure fit.
The IC socket type ensures compatibility with integrated circuits, providing a reliable connection for electronic components.
With a configuration of 21x21 contacts, this product offers a high contact density and compatibility with devices requiring this specific layout.
With a maximum operating temperature of 105°C, this product can withstand high temperatures, ensuring reliable performance in demanding applications.
Chip Carrier IC & Component Sockets 8484-11B1-RK-TP attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from 3m Electronic Products Division
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8484-11B1-RK-TP Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
With over 60,000 products in our portfolio, 3M brands deliver science-based performance and extraordinary outcomes across almost any industry you can imagine.
1N4148WS
Vishay Intertechnology
Vishay Intertechnology's 1N4148WS is a single rectifier diode with a max forward voltage of 1V and output current of 0.15A. With a fast reverse recovery time of 0.004us, it operates up to 150°C. Ideal for applications requiring high-speed switching and low power consumption in surface mount configurations.
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM358N
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
LL4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
Unitrode
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
Formosa Microsemi
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
Sangdest Microelectronics (Nanjing)
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
614-83-964-31-012101
Preci-dip Sa
614-83-964-31-012101 by Preci-dip Sa is a PCT POLYESTER Chip Carrier IC Socket with 64 BERYLLIUM COPPER contacts. It features GOLD (30) mating finish and Tin termination, suitable for DIP64 devices. Ideal for electronic applications requiring reliable connections in IC components.
XR2A-2211-N
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
150-10-640-00-106101
150-10-640-00-106101 by Preci-dip Sa is a DIP40 chip carrier socket with 40 contacts, rated at 1A current. Featuring surface mount termination, it has a contact pitch of 0.1" and operates b/w -55°C to 125°C. Ideal for IC applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
PYFZ-14
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2D-1401-N
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
P2CF-08
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
XR2A-4202
IC SOCKET; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30);
115-47-432-41-001000
Mill-max Mfg
IC SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
8134-HC-8P2
Augat
IC SOCKET; Manufacturer Series: 8134-HC;
150-80-316-00-006101
150-80-316-00-006101 by Preci-dip Sa is a DIP16 IC socket with POLYESTER housing and BRASS contacts. It features 16 contacts with TIN finish for mating and termination. Ideal for chip carrier applications requiring reliable connections in electronic devices.
HLT-0716-G-H
Samtec
Samtec's HLT-0716-G-H is a 112-contact IC socket with brass contacts and gold finish. It is designed for use on PGA112 devices, featuring a plastic housing material. Ideal for chip carrier applications requiring reliable connections in electronic systems.
XR2T-1621-N
IC SOCKET; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD FLASH; Contact Finish (Mating): NOT SPECIFIED;
CQF024-165B
Texas Instruments
IC SOCKET; Device Type Used On: QFP24; Housing Material: GLASS FILLED POLYETHERIMIDE; No. of Contacts: 24; Manufacturer Series: CQF;
HLS-0116-T-10
Samtec's HLS-0116-T-10 is a 16-contact IC socket with gold finish for SIP16 devices. It features a plastic housing and rectangular contact configuration. Ideal for chip carrier applications, this component offers reliable connectivity in electronic systems.
XR2A-0801-N
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
27E122
TE Connectivity
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
XR2A-2472
IC SOCKET; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Manufacturer Series: XR2A;
08-3518-10H
Aries Electronics
Aries Electronics 08-3518-10H is a DIP18 IC socket with 8 brass contacts, gold finish, and solder termination. It has a 7.62mm PCB contact row spacing and rectangular pattern for applications requiring a current rating of 3A at up to 105°C operating temperature.
1-1415526-1
IC SOCKET; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Additional Features: STANDARDS: CUL; VDE; No. of Contacts: 4;
XR2A-0821-N
Omron's XR2A-0821-N is a DIP8 IC socket with 8 contacts, rated for 1A current. It features gold flash contact finish, Beryllium Copper material, and polybutylene terephthalate housing. With a PCB contact row spacing of 7.62mm and rectangular pattern, it is ideal for applications requiring a dielectric voltage withstand of 1000VAC.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
8484-21B1-RK-TP
3m Electronic Products Division
IC SOCKET; Device Type Used On: PLCC84; Housing Material: GLASS FILLED POLYPHENYLENE SULFIDE; Insulation Resistance: 1000000000 ohm; Contact Material: PHOSPHOR BRONZE; Minimum Operating Temperature: -40 Cel;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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