Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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IC SOCKET; No. of Contacts: 5; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
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Advanced Electronics
Chip Carrier IC & Component Sockets 27E1064 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
Number of Positions or Pins:
Installation Type:
IC Socket Type:
27E1064 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
NC7WZ07P6X
Fairchild Semiconductor
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
2N2222A
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
FDD5614P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 42 W; Terminal Position: SINGLE; Terminal Form: GULL WING;
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
1N4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
Shenzhen Yixinsemi Electronics
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
1552200253
Molex
WIRE AND CABLE;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
BAV99WT1G
BAV99WT1G by Onsemi is a series connected diode with 0.006 us reverse recovery time. It is a small outline rectifier diode with 70V peak reverse voltage, ideal for surface mount applications in electronics requiring fast switching and low forward voltage drop.
BSS138
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
LM2931Z-5.0RPG
LM2931Z-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V Nominal Output Voltage, 0.1A Max Output Current, and 6V Min Input Voltage. It operates in temperatures ranging from -40 to 125 °C and is ideal for applications requiring stable voltage regulation in electronic circuits.
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Kec
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
95.15.2SMA
Finder
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED;
KSS100-85TG
Advanced Interconnections
IC SOCKET; Device Type Used On: SIP100; Housing Material: POLYIMIDE; Additional Features: SIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
P7S-14F
Omron
RELAY SOCKET; No. of Contacts: 14;
PT11-0
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE;
832-AG11D-ESL-LF
TE Connectivity's 832-AG11D-ESL-LF is a DIP32 IC socket with 32 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it has a housing made of polyethylene/polyester. With a temperature range from -55 to 105 °C, it uses solder termination and has an insulation resistance of 5G ohm.
27E937
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE;
134-10-328-00-050000
Mill-max Mfg
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
614-83-964-31-012101
Preci-dip Sa
614-83-964-31-012101 by Preci-dip Sa is a PCT POLYESTER Chip Carrier IC Socket with 64 BERYLLIUM COPPER contacts. It features GOLD (30) mating finish and Tin termination, suitable for DIP64 devices. Ideal for electronic applications requiring reliable connections in IC components.
4-1571552-4
TE Connectivity 4-1571552-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and rectangular pattern, suitable for applications requiring a mating contact pitch of 0.1 inch. The housing material is thermoplastic, ensuring reliable performance in temperatures ranging from -55°C to 105°C.
DILB8P-223TLF
Amphenol Communications Solutions
DILB8P-223TLF by Amphenol is a chip carrier IC socket with 8 contacts, copper alloy material, and matte tin finish. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. This socket is ideal for applications requiring a dielectric voltage withstand of 1400VAC and operating temperatures ranging from -55 to 105°C.
ICF-640-S-O
Samtec
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
1437538-3
IC SOCKET; Device Type Used On: DIP28; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 28;
173-10-318-00-001000
173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
540-88-044-17-400-TR
IC SOCKET; Device Type Used On: PLCC44; Housing Material: PPS THERMOPLASTIC; Additional Features: STANDARD: UL 94V-0, LOW PROFILE; No. of Contacts: 44; Contact Material: NOT SPECIFIED;
P2R-05P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 5; Contact Finish (Termination): NOT APPLICABLE;
551-10-155-18-121004
Mill-max Mfg's 551-10-155-18-121004 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni) and termination finish, housed in POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. Ideal for chip carrier applications.
XR2T-2801-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER;
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
110-13-308-41-001000
110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.
XR2A-1601-N
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
27E129
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Material: NOT APPLICABLE; No. of Contacts: 16;
27E130
IC SOCKET; Device Type Used On: RELAY; Housing Material: PHENOLIC; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER LUG;
27E123
IC SOCKET; Device Type Used On: RELAY; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Rating (Current): 10 A; Contact Finish (Mating): NOT APPLICABLE;
27E128
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; No. of Contacts: 10; Contact Material: NOT APPLICABLE; Termination Type: SOLDER LUG;
27E152
TE Connectivity's 27E152 is a RECTANGULAR Chip Carrier IC Socket with POLYESTER housing. It has 16 BLADE PIN-SKT contacts, rated for 10A current on RELAY devices. With 1400VAC dielectric voltage and high insulation resistance, it is ideal for straight mounting on PCBs.
27E122
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
27E127
IC SOCKET; Housing Material: PHENOLIC; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 22; Termination Type: SOLDER;
27E121
TE Connectivity's 27E121 is a Chip Carrier IC Socket with NYLON housing. It features 11 RND PIN-SKT contacts, rated for 15A current, and SCREW termination. Ideal for use on RELAY devices, this IC SOCKET measures 3.15" x 1.7" x 0.895", making it suitable for various electronic applications.
27E125
IC SOCKET; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; Termination Type: SOLDER; No. of Contacts: 10; Contact Finish (Mating): NOT APPLICABLE;
27E166
TE Connectivity's 27E166 is a GLASS FILLED POLYESTER Chip Carrier IC Socket with SCREW termination. It features 14 RND PIN-SKT contacts and is designed for use on RELAY devices. Ideal for high-performance electronic applications.
27E126
IC SOCKET; Housing Material: POLYESTER; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; No. of Contacts: 16; Contact Finish (Mating): NOT APPLICABLE;
27E162
IC SOCKET; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 10; Termination Type: SOLDER;
27E163
IC SOCKET; Housing Material: POLYESTER; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 16;
27E164
IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 22; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
27E193
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Contact Material: NOT APPLICABLE; No. of Contacts: 11; Contact Finish (Mating): NOT APPLICABLE;
27E194
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 16; Termination Type: SOLDER LUG;
27E168
IC SOCKET; Housing Material: NYLON; No. of Contacts: 11; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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