Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
134-10-328-00-000000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$17.580
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Nova Conductors
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Vyrian
VNN
Continental Prestige Electronics
$17.228
Netroflash
AZTECH Wire
$19.637
Ampacity Inc.
$44.000
Argo Parts USA
Plastic housing material is lightweight and durable, making the chip carrier IC socket easy to handle and resistant to physical damage.
Designed specifically for DIP28 devices, ensuring a secure and proper fit for the integrated circuit.
With 28 contacts, this IC socket can accommodate a wide range of chips and components, making it versatile for various applications.
The gold over nickel finish on the contacts provides excellent conductivity and corrosion resistance, ensuring reliable connections with minimal signal loss.
Being an IC socket type, this product is interchangeable and allows for easy replacement of integrated circuits, making maintenance and upgrades convenient.
With a rectangular contact configuration, this chip carrier IC socket ensures proper alignment and secure connections, reducing the risk of misalignment or damage during installation.
Chip Carrier IC & Component Sockets 134-10-328-00-000000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
134-10-328-00-000000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
2N7002
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIC
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
LL4148
Semtech Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
Diodes Incorporated
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SBAV99LT1G
SBAV99LT1G by Onsemi is a rectifier diode with a max repetitive peak reverse voltage of 100V. It has a small outline package style and a fast max reverse recovery time of 0.006 us. It is commonly used in applications requiring low power dissipation and high operating temperatures.
1N4148WS
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
3-1415043-1
TE Connectivity
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 4;
114-87-322-41-117101
Preci-dip Sa
114-87-322-41-117101 by Preci-dip Sa is a Chip Carrier IC Socket with PCT Polyester housing, DIP22 device type, and 22 contacts. It features Gold Flash mating contact finish and Tin termination. Ideal for applications requiring reliable connections in electronic devices.
27000000
RELAY SOCKET; JESD-609 Code: e3; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT APPLICABLE; Contact Finish (Termination): TIN;
2-1419106-5
TE Connectivity 2-1419106-5 is a NYLON chip carrier socket with 11 RND PIN-SKT contacts. It is designed for use on RELAY devices, featuring SCREW termination type. Ideal for IC SOCKET applications.
1-1415526-1
IC SOCKET; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Additional Features: STANDARDS: CUL; VDE; No. of Contacts: 4;
XR2A-2205
Omron
IC SOCKET; Manufacturer Series: XR2;
1-2199298-6
TE Connectivity 1-2199298-6 is a Chip Carrier IC Socket with 20 contacts, 7.62mm PCB row spacing, and GLASS FILLED PBT housing material. It has a solder termination type and operates b/w -40°C to 105°C. Ideal for applications requiring a current rating of 1A in straight mounting style.
169-PRS13001-16
Aries Electronics
Aries Electronics 169-PRS13001-16 is a PGA169 IC socket with 169 contacts, made of POLYPHENYLENE SULPHIDE. It has a contact pitch of 0.1" and operates b/w -65°C to 200°C. Ideal for chip carrier ICs, it features solder termination and a rectangular PCB contact pattern.
2-1571552-5
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
M12883/45-01
Amphenol
Amphenol's M12883/45-01 is a POLYETHERIMIDE chip carrier socket with 8 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various relay applications due to its high-quality contact finish and durable housing material.
8-1415035-1
RELAY SOCKET; Device Type Used On: RELAY; Termination Type: SOLDER; No. of Contacts: 5; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
AW122-20/G-T
Assmann Wsw Components
Sockets and Chip Carriers; Contact Finish (Termination): GOLD FLASH OVER NICKEL;
18364
Vicor
IC SOCKET; Device Type Used On: SIP5; Maximum Operating Temperature: 120 Cel; No. of Contacts: 5; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
3-1393310-7
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 1; Termination Type: SOLDER;
22-1508-30
Aries Electronics 22-1508-30 is a DIP32 IC socket with 22 contacts, rated at 3A current. It features wire wrap termination, gold finish over nickel mating contact, and nylon46 housing material. Used for chip carrier components on PCBs with rectangular contact pattern and 2.54mm pitch row spacing.
27390
Struthers-dunn
RELAY SOCKET; Manufacturer Series: 27390; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 12; Additional Features: POLARIZED;
P2CF-08-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
441-PRS21001-12
441-PRS21001-12 by Aries Electronics is a PGA441 IC socket with 441 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It features a rectangular PCB contact pattern and polyphenylene sulfide housing material. Ideal for applications requiring high-density chip carrier components on printed circuit boards.
SFS4-SFD-R
Panasonic
RELAY SOCKET; Manufacturer Series: SF;
8444-11B1-RK-TP
3m Electronic Products Division
8444-11B1-RK-TP by 3m Electronic Products Division is a chip carrier IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. It is used on PLCC44 devices and has a min operating temperature of -40°C and max operating temperature of 105°C. The socket has 44 contacts, PHOSPHOR BRONZE contact material, and a bellowed type contact style.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
134-10-328-00-010000
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
134-10-328-00-020000
134-10-328-00-020000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 GOLD OVER NICKEL contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
134-10-328-00-050000
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
134-10-328-00-100000
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
134-10-308-00-100000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
134-10-328-00-000
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-010
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-020
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): GOLD (10) OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: DIP HEADER;
134-10-328-00-050
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
134-10-328-00-100
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-000100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD (10) OVER NICKEL (150);
134-10-328-00-010100
IC SOCKET; Device Type Used On: DIP28; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); No. of Contacts: 28; JESD-609 Code: e4;
134-10-328-00-020100
IC SOCKET; Device Type Used On: DIP28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Additional Features: SOCKET HEADER; Contact Config: RECTANGLE;
134-10-328-00-050100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; JESD-609 Code: e4; Additional Features: SOCKET HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-100100
IC SOCKET; Device Type Used On: DIP28; Contact Config: RECTANGLE; Additional Features: SOCKET HEADER; Contact Material: NOT SPECIFIED; No. of Contacts: 28;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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