Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
Median Price
$10.380
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$9.139
Continental Prestige Electronics
$10.172
Netroflash
Ampacity Inc.
$38.000
Argo Parts USA
Provides lightweight and cost-effective construction, ensuring ease of handling and reducing production costs.
Accommodates DIP28 devices, enabling compatibility with a wide range of integrated circuits and components.
Offers ample connectivity options, allowing for versatile and comprehensive circuit configurations.
Delivers excellent electrical conductivity and corrosion resistance, ensuring reliable and long-lasting connections.
Designed specifically for integrated circuits, providing precise alignment and secure mounting for optimal performance.
Together, these specifications make this Chip Carrier IC & Component Socket an ideal choice as it incorporates a durable plastic housing, supports DIP28 devices, has a sufficient number of contacts, utilizes a reliable gold over nickel contact finish, features an IC socket design, and offers a space-saving rectangular contact configuration.
Chip Carrier IC & Component Sockets 134-10-328-00-050000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
134-10-328-00-050000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
1N4148WS
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
1N4148WT
Good-ark Electronics
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
1N4148
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
BSS123LT1G
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
International Components
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Terminal Finish: Tin/Lead (Sn/Pb); JESD-609 Code: e0; Maximum Reverse Recovery Time: .004 us;
Bytesonic Electronics
XR2A-2001-N
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A;
ICO-308-MGG
Samtec
Samtec's ICO-308-MGG is a DIP8 IC socket with 8 contacts, featuring rectangular contact pattern and 7.62mm PCB row spacing. It uses beryllium copper contacts with gold finish for solder termination, rated at 1A current. Ideal for applications requiring high insulation resistance and operating temperatures from -65 to 125°C.
XR2C-2005
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
MPAS-069-ZSST-11
Samtec's MPAS-069-ZSST-11 is a Chip Carrier IC Socket with 69 contacts, 2.54mm terminal pitch, and gold over nickel contact finish. It is used on PGA69 devices, has a body size of 1.1" x 1.1" x 0.175", and operates b/w -65°C to 125°C, making it ideal for high-performance electronic applications.
ICF-320-T-O-TR
Samtec's ICF-320-T-O-TR is a Chip Carrier IC Socket with 20 contacts, rated at 1A current. It features a rectangular contact pattern, liquid crystal polymer housing material, and surface mount termination type. Ideal for DIP20 devices, it has a mating contact pitch of 0.1 inches and operates b/w -55°C to 125°C.
27E892
TE Connectivity's 27E892 is a POLYAMIDE chip carrier socket with 11 BLADE PIN-SKT contacts for RELAY devices. Featuring SCREW termination, it is ideal for IC SOCKET applications.
1419106-2
IC SOCKET; Housing Material: NYLON; Contact Material: NOT SPECIFIED; Termination Type: SOLDER; Additional Features: STANDARDS: CSA; UL; Contact Finish (Mating): NOT APPLICABLE;
CQF208-168B
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
P2CF-11-E
Omron's P2CF-11-E chip carrier IC socket has 11 contacts, 5A current rating, and 1 billion ohm insulation resistance. It is used for relay devices with screw termination, offering a dielectric voltage of 2000VAC. Ideal for applications requiring a reliable and high-performance relay socket solution.
PY14QN-Y1
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-6402
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2A;
P2R-05A
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
540-88-044-17-400
Preci-dip Sa
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
214-44-308-01-670799
Mill-max Mfg
214-44-308-01-670799 by Mill-max Mfg is a NYLON46 IC SOCKET for DIP8 devices with 8 contacts. It features MATTE TIN OVER NICKEL finish, ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
XR2T-2461-N
IC SOCKET; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD (30);
JRE200111
Amphenol
RELAY SOCKET; Manufacturer Series: JRE2001;
SH3B-05
Idec
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
27E122
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
326-93-108-41-003000
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
816-22-057-10-000101
IC SOCKET; Device Type Used On: SIP57; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 57; Contact Finish (Termination): GOLD OVER NICKEL;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
134-10-328-00-000000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; No. of Contacts: 28; Contact Finish (Mating): NOT SPECIFIED;
134-10-328-00-010000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
134-10-328-00-020000
134-10-328-00-020000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 GOLD OVER NICKEL contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
134-10-328-00-100000
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
134-10-308-00-100000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
134-10-328-00-000
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-010
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-020
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): GOLD (10) OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: DIP HEADER;
134-10-328-00-050
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
134-10-328-00-100
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-000100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD (10) OVER NICKEL (150);
134-10-328-00-010100
IC SOCKET; Device Type Used On: DIP28; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); No. of Contacts: 28; JESD-609 Code: e4;
134-10-328-00-020100
IC SOCKET; Device Type Used On: DIP28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Additional Features: SOCKET HEADER; Contact Config: RECTANGLE;
134-10-328-00-050100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; JESD-609 Code: e4; Additional Features: SOCKET HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-100100
IC SOCKET; Device Type Used On: DIP28; Contact Config: RECTANGLE; Additional Features: SOCKET HEADER; Contact Material: NOT SPECIFIED; No. of Contacts: 28;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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