Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
134-10-328-00-020000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 GOLD OVER NICKEL contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$8.400
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
AZTECH Wire
$7.598
Continental Prestige Electronics
$8.232
Netroflash
Ampacity Inc.
$36.000
Argo Parts USA
Lightweight and durable material provides protection for the components inside, making it a reliable choice for long-term use.
Designed specifically for DIP28 devices, ensuring a perfect fit and stable connection for optimal performance.
Ample amount of contacts allows for versatile compatibility with a wide range of integrated circuits, accommodating various applications.
Gold over nickel finish provides excellent conductivity and corrosion resistance, ensuring a reliable and stable connection.
Specifically designed IC socket ensures secure placement and easy removal of the integrated circuit, making it convenient for troubleshooting and maintenance.
Rectangle contact configuration ensures proper alignment and contact with the pins of the integrated circuit, minimizing the risk of connectivity issues.
Chip Carrier IC & Component Sockets 134-10-328-00-020000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
134-10-328-00-020000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
BSS138
Diodes Incorporated
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Minimum DS Breakdown Voltage: 50 V; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
1N4148WS-7-F
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
SMBJ18CA
Protek Devices
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
STMicroelectronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Config: SINGLE; Terminal Finish: Tin/Lead (Sn/Pb);
LM317T
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Package Shape: RECTANGULAR; Minimum Input-Output Voltage Differential: 3 V;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
Silicon Transistor
NC7WZ07P6X
Onsemi
The Onsemi NC7WZ07P6X is a logic gate with 2 functions, featuring a propagation delay of 4.8 ns at 1.8V supply voltage. With open-drain output characteristics, it operates in industrial temperatures from -40 to 85°C. Ideal for applications requiring fast signal processing and low power consumption in compact designs.
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
XR2A-3221-N
Omron
IC SOCKET; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH;
PT11-0
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 11; Contact Finish (Termination): NOT APPLICABLE;
PT14QN
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
M12883/52-001
Esterline Technologies
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 8; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
TTD08
Taicom
TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
2-1393143-2
IC SOCKET; Device Type Used On: RELAY; Housing Material: POLYESTER; Termination Type: SOLDER LUG; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
828-AG12D-ES-LF
TE Connectivity's 828-AG12D-ES-LF is a chip carrier IC socket with 28 contacts and a rectangular PCB contact pattern. It has a body length of 1.4 inch, body width of 0.7 inch, and body depth of 0.18 inch. This socket is commonly used on DIP28 devices and can withstand temperatures ranging from -55 to 105 °C.
304-13-128-41-780000
Mill-max Mfg
Mill-max Mfg's 304-13-128-41-780000 is a POLYETHYLENE Chip Carrier IC Socket for SIP28 devices with 28 GOLD OVER NICKEL contacts. Ideal for applications requiring RECTANGLE contact configuration.
CQF100-158A
Texas Instruments
IC SOCKET; Device Type Used On: QFP100; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 100;
110-87-320-41-001101
Preci-dip Sa
110-87-320-41-001101 by Preci-dip Sa is a DIP20 IC socket with 20 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. With a PCB contact row spacing of 7.62mm, it is ideal for applications requiring high insulation resistance and dielectric voltage withstand capabilities up to 1400VAC.
236-6225-00-0602
3m Electronic Products Division
The 3M Electronic Products Division's 236-6225-00-0602 is a ZIP36 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 36 gold (Au) over nickel (Ni) mating contacts and gold (Au) termination finish. Ideal for chip carrier ICs, this socket ensures reliable connections in electronic applications.
P6B-26P
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6; Additional Features: STANDARDS: CSA; UL;
SS-104-TT-2-N
Samtec
SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
P7SA-10P
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 10; Contact Material: NOT SPECIFIED;
XR2A-2225
IC SOCKET; Manufacturer Series: XR2;
224-1275-00-0602J
The 3M Electronic Products Division's 224-1275-00-0602J is a DIP24 IC socket with 24 contacts. It features Beryllium Copper contact material and Gold (Au) finish for mating and termination. The housing material is Glass Filled Polysulfone, making it ideal for chip carrier applications.
818-22-024-10-002101
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Additional Features: STANDARD: UL 94V-0; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL;
3-1415043-1
IC SOCKET; Termination Type: SOLDER; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 4;
60431011
Aptiv
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
134-10-328-00-000000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; No. of Contacts: 28; Contact Finish (Mating): NOT SPECIFIED;
134-10-328-00-010000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
134-10-328-00-050000
The Mill-max Mfg 134-10-328-00-050000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
134-10-328-00-100000
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
134-10-308-00-100000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Material: NOT SPECIFIED; JESD-609 Code: e4;
134-10-328-00-000
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-010
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-020
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Mating): GOLD (10) OVER NICKEL; Contact Material: NOT SPECIFIED; Additional Features: DIP HEADER;
134-10-328-00-050
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Config: RECTANGLE;
134-10-328-00-100
IC SOCKET; Device Type Used On: DIP28; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: DIP HEADER; JESD-609 Code: e4;
134-10-328-00-000100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD (10) OVER NICKEL (150);
134-10-328-00-010100
IC SOCKET; Device Type Used On: DIP28; Additional Features: SOCKET HEADER; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); No. of Contacts: 28; JESD-609 Code: e4;
134-10-328-00-020100
IC SOCKET; Device Type Used On: DIP28; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (10) OVER NICKEL (150); Additional Features: SOCKET HEADER; Contact Config: RECTANGLE;
134-10-328-00-050100
IC SOCKET; Device Type Used On: DIP28; No. of Contacts: 28; JESD-609 Code: e4; Additional Features: SOCKET HEADER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
134-10-328-00-100100
IC SOCKET; Device Type Used On: DIP28; Contact Config: RECTANGLE; Additional Features: SOCKET HEADER; Contact Material: NOT SPECIFIED; No. of Contacts: 28;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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