Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's ICF-316-T-I-TR is a Chip Carrier IC Socket with 16 contacts, rated at 1A. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP16 devices. With liquid crystal polymer housing and surface mount termination, it operates b/w -55°C to 125°C, making it ideal for various electronic applications.
Median Price
$1.877
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Master Electronics
1+ parts
$1.914
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1k+ parts
$1.400
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$1.140
DigiKey
$6.980
PEI Genesis
Newark
$1.840
Chip1Stop
$1.690
Vyrian
Rapid Electronics
$1.380
IBS Electronics
$1.510
Nova Conductors
Authorized Procurement Solutions
Netroflash
The 7.62mm spacing allows for ample room for connections on the PCB, making it easy to install and connect the chip carrier IC.
Liquid crystal polymer is a high-performance material known for its durability and resistance to heat, making this product suitable for various operating environments.
With a minimum operating temperature of -55°C, this chip carrier IC socket can function reliably in extreme cold conditions.
Beryllium copper offers excellent conductivity and durability, ensuring a reliable connection between the IC and the socket.
With a current rating of 1A, this IC socket can handle moderate power requirements, suitable for a variety of applications.
The high maximum operating temperature of 125°C allows this IC socket to operate in harsh environments without any performance degradation.
Chip Carrier IC & Component Sockets ICF-316-T-I-TR attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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ICF-316-T-I-TR Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Positronic Industries
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Body or Shell Style: RECEPTACLE;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
NE555/D
General Electric Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; Maximum Operating Temperature: 70 Cel; Technology: BIPOLAR; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified;
2N2222A
Vpt Components
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Maximum Power Dissipation Ambient: .5 W;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1554216002
Molex
WIRE AND CABLE;
Secos
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .6 A; JEDEC-95 Code: TO-92;
Infinex
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Sensitron Semiconductor
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
214-44-308-01-670800
Mill-max Mfg
214-44-308-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing material and MATTE TIN finish. It is designed for DIP8 devices, featuring 8 contacts in RECTANGLE configuration. Ideal for secure connection of integrated circuits in various electronic applications.
27E1064
TE Connectivity
IC SOCKET; No. of Contacts: 5; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
M12883/52-001
Esterline Technologies
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Contact Finish (Mating): GOLD; No. of Contacts: 8; Contact Finish (Termination): GOLD; Additional Features: LOW PROFILE;
316-43-144-41-008000
The Mill-max Mfg 316-43-144-41-008000 is a PLASTIC IC SOCKET for SIP44 devices with 44 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
8501NR52B
Schneider Electric Sa
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2D-3204
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
XR2A-4002
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
173-10-324-00-001000
173-10-324-00-001000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for DIP24 devices. Featuring 24 contacts with GOLD OVER NICKEL finish, it is a RECTANGLE contact configuration ideal for integrated circuit applications.
PY08QN
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
ICA-308-JGG
Samtec
Samtec's ICA-308-JGG is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It features wire wrap termination, gold over nickel finish, and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring a mating pitch of 0.1 inch and dielectric voltage of 1400VAC.
8134-HC5P2-B
TE Connectivity's 8134-HC5P2-B chip carrier socket features PRESS FIT termination, RND PIN-SKT contact style, and 5A current rating. With a wide temperature range (-55 to 125°C), it is ideal for IC applications requiring high insulation resistance (1G ohm).
PTF14A
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Material: NOT SPECIFIED;
PY11QN2
RELAY SOCKET;
304-13-142-41-770000
The Mill-max Mfg 304-13-142-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP42 devices with 42 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for electronic applications requiring reliable connections.
ICF-324-F-O
Samtec's ICF-324-F-O is a Chip Carrier IC Socket with 24 contacts, 0.1" pitch, and gold flash over nickel finish. It has a body size of 1.2"x0.375"x0.18" and operates b/w -55°C to 125°C. Ideal for DIP24 devices in applications requiring high insulation resistance and dielectric voltage withstand capabilities.
APH-1016-T-T
The Samtec APH-1016-T-T is a Chip Carrier IC Socket with 16 contacts made of brass and tin over nickel finish. It features a polyethylene housing material, suitable for DIP16 devices. Ideal for applications requiring reliable rectangular contact configuration in IC sockets.
540-44-032-17-400004
IC SOCKET; Device Type Used On: PLCC32; Housing Material: POLYPHENYLENE SULFIDE; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): MATTE TIN;
4-1571551-4
TE Connectivity 4-1571551-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for applications requiring a mating contact pitch of 0.1 inch, such as chip carrier ICs.
228-1290-09-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 228-1290-09-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier applications requiring secure component sockets.
2-1571552-5
TE Connectivity's 2-1571552-5 is a DIP18 IC socket with 18 contacts, rated at 3A current. Featuring a rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and has a thermoplastic polyester housing. Ideal for applications requiring a dielectric voltage of 1000VAC and operating temperatures ranging from -55 to 105°C.
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ICF-316-T-O-TR
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
IC SOCKET; Device Type Used On: DIP24; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-308-T-O
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-308-T-I-TR
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-320-T-O-TR
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
ICF-328-T-O-TR
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .375 inch;
ICF-316-F-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 600VAC; Housing Material: LIQUID CRYSTAL POLYMER;
ICF-316-F-O
ICF-316-T-I
ICF-316-T-O
ICF-316-TL-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; PCB Contact Pattern: RECTANGULAR;
ICF-316-TL-I
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Terminal Pitch (mm): 2.54;
ICF-316-TL-O-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY;
ICF-316-TL-O
ICF-316-T
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
ICF-316-SM-I
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Mating Contact Pitch (inch): 0.1;
ICF-316-TM-I-TR
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .375 inch;
ICF-316-TM-I
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 16;
ICF-316-TM-O-TR
ICF-316-TM-O
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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