Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 110-99-308-41-001000 is a DIP8 IC socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 8 contacts with TIN LEAD finish, it is ideal for chip carrier applications requiring reliable connections in electronic devices.
Median Price
$0.670
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1k+
Newark
1+ parts
$0.462
100+ parts
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1k+ parts
$0.405
10k+ parts
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PSC Electronics
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RS Americas
$0.737
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Mouser Electronics
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DigiKey
$0.750
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Arrow
$0.420
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Verical
$0.536
Chip1Stop
$7.103
Nova Conductors
$0.359
Vyrian
Semtec, LLC
Prism Electronics
Semi Source
EMSNET
Inventory MP
Bristol Electronics
VNN
Bisco
Continental Prestige Electronics
$0.352
Argo Parts USA
$0.348
Netroflash
$0.341
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Allen Electronics Distributors
$0.386
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Ampacity Inc.
$0.510
Perfect Parts
Polyethylene is a durable and cost-effective material, providing good protection to the components inside and ensuring longevity of the socket.
Compatible with DIP8 devices, making it versatile and suitable for a wide range of applications.
Beryllium copper offers excellent conductivity and durability, ensuring reliable connections and long-term performance.
Having 8 contacts allows for connection to a variety of components, making it versatile and adaptable to different circuit configurations.
The tin lead finish ensures a secure mating connection, reducing the risk of signal loss or interference.
The nickel barrier provides improved corrosion resistance and ensures a reliable termination connection, enhancing the socket's overall durability.
Specifically designed for integrated circuit components, providing a reliable and secure connection for your IC devices.
The rectangular contact configuration allows for easy alignment and insertion of components, making installation quick and straightforward.
Chip Carrier IC & Component Sockets 110-99-308-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
110-99-308-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
LM317T
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; JESD-609 Code: e0; Terminal Position: SINGLE; Adjustability: ADJUSTABLE; Maximum Load Regulation (%): 1.5 %;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
2902037
Phoenix Contact
MODULAR TERMINAL BLOCK;
SS14
Zowie Technology
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Operating Temperature: 125 Cel; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: 30 A;
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
ROHM
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Comset Semiconductors
1N4148
Gulf Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Comchip Technology
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
BSS138W-7-F
Multicomp Pro
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Transistor Element Material: SILICON; No. of Elements: 1;
XR2D-4001-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
27E127
TE Connectivity
IC SOCKET; Housing Material: PHENOLIC; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 22; Termination Type: SOLDER;
27E461
IC SOCKET; Housing Material: PHENOLIC; No. of Contacts: 16; Termination Type: SCREW; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
1-822473-7
TE Connectivity 1-822473-7 is a PLCC84 IC socket with POLYETHYLENE housing. Featuring 84 contacts, it has an insulation resistance of 1G ohm and dielectric voltage of 830VAC. Ideal for applications requiring a straight mounting style, this socket operates b/w -20°C to 85°C and can handle up to 1A current rating.
XR2D-0804
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au);
818-AG11D-ESL-LF
TE Connectivity's 818-AG11D-ESL-LF is a Chip Carrier IC Socket with 18 contacts, rated at 3A current. Featuring rectangular PCB contact pattern with 7.62mm row spacing, it uses solder termination and operates b/w -55°C to 105°C. Ideal for DIP18 devices, this socket has a dielectric voltage of 1000VAC and insulation resistance of 5G ohm.
1437540-3
IC SOCKET; Device Type Used On: DIP32; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin/Lead (Sn/Pb); No. of Contacts: 32;
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
XR3G-3201
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
304-13-128-41-780000
Mill-max Mfg
Mill-max Mfg's 304-13-128-41-780000 is a POLYETHYLENE Chip Carrier IC Socket for SIP28 devices with 28 GOLD OVER NICKEL contacts. Ideal for applications requiring RECTANGLE contact configuration.
410-93-220-10-001000
Mill-max Mfg 410-93-220-10-001000 is a Chip Carrier IC Socket with 20 contacts, staggered pattern, and 2.54mm pitch. It uses beryllium copper contacts for DIP20 devices, rated at 3A current. Ideal for PCBs with straight mounting style and operating temperatures from -55 to 125°C.
P7S-14F
RELAY SOCKET; No. of Contacts: 14;
342-90-139-00-594000
Mill-max Mfg's 342-90-139-00-594000 is a Chip Carrier IC Socket with Polyethylene housing material. It has 39 contacts with Tin/Lead finish for mating and termination. Designed for SIP39 devices, it features a rectangular contact configuration ideal for various electronic applications.
CQF208-168B
Texas Instruments
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
PY14QN
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
PGA-280
3m Electronic Products Division
IC SOCKET; Device Type Used On: PGA280; Housing Material: POLYESTER; Manufacturer Series: PGA; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 280;
315-43-103-41-001000
The Mill-max Mfg 315-43-103-41-001000 is a PLASTIC IC SOCKET for SIP3 devices with 3 TIN contacts. It features RECTANGLE contact configuration and is ideal for Chip Carrier IC & Component Sockets applications.
7-1437539-0
TE Connectivity's 7-1437539-0 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular contact pattern, suitable for applications requiring a dielectric voltage withstand of 1400VAC. The socket has a housing made of polyester and operates within -55 to 105°C temperature range, terminated by soldering with mating pitch of 0.1 inch.
510-93-169-17-101002
510-93-169-17-101002 by Mill-max Mfg is a Chip Carrier IC Socket with 169 contacts, PCB contact row spacing of 2.54mm, and rectangular contact pattern. It is used on PGA169 devices, has a solder termination type, and operates b/w -55°C to 125°C.
27E121
TE Connectivity's 27E121 is a Chip Carrier IC Socket with NYLON housing. It features 11 RND PIN-SKT contacts, rated for 15A current, and SCREW termination. Ideal for use on RELAY devices, this IC SOCKET measures 3.15" x 1.7" x 0.895", making it suitable for various electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
110-93-308-41-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT POLYESTER; Additional Features: DIP SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
110-93-320-41-801000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Material: BERYLLIUM COPPER; Contact Config: RECTANGLE;
110-93-628-41-801000
IC SOCKET; Device Type Used On: DIP28; Housing Material: PLASTIC; Additional Features: LOW PROFILE; Contact Config: RECTANGLE; Contact Material: NOT SPECIFIED;
110-99-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-93-314-10-001000
RELAY SOCKET; Device Type Used On: DIP4; Housing Material: PCT POLYESTER; JESD-609 Code: e0; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-91-322-41-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: POLYETHYLENE; Additional Features: DIP SOCKET; Contact Config: RECTANGLE; JESD-609 Code: e0;
110-93-632-41-001000
IC SOCKET; Device Type Used On: DIP32; Housing Material: POLYETHYLENE; No. of Contacts: 32; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e0;
110-93-308-41-605000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; No. of Contacts: 8; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier;
110-99-308-41-001
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER;
110-99-308-41-001100
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Finish (Termination): Tin/Lead (Sn/Pb); Additional Features: DIP SOCKET; No. of Contacts: 8;
110-99-308-41-361100
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Config: RECTANGLE; No. of Contacts: 8; Contact Material: NOT SPECIFIED;
110-99-308-41-361
IC SOCKET; Device Type Used On: DIP8; Housing Material: POLYBUTYLENE TEREPHTHALATE-POLYESTER; Contact Finish (Mating): TIN LEAD (200); Contact Finish (Termination): Tin/Lead (Sn/Pb); No. of Contacts: 8;
110-99-308-41-361000
IC SOCKET; Device Type Used On: DIP8; Contact Finish (Mating): TIN LEAD (200); Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier; Additional Features: DIP SOCKET; No. of Contacts: 8;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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