Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SS-104-G-22-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. This socket is used on SIP4 devices and operates b/w -65°C to 125°C, making it ideal for various electronic applications.
Median Price
$0.760
Lifecycle Status
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2
In-Stock Inventory
1k+
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1+ parts
100+ parts
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10k+ parts
Vyrian
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$0.745
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$0.722
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$18.945
This PCB contact pattern allows for a secure and stable connection, ensuring reliability in the performance of the chip carrier IC & component sockets.
The use of glass filled polyester as the housing material provides durability and excellent electrical insulation properties, making this product suitable for various applications.
Designed specifically for SIP4 devices, this chip carrier IC & component socket is tailored to provide a precise and secure fit for optimal performance.
With a minimum operating temperature of -65°C, this product is suitable for use in extremely low-temperature environments without compromising functionality.
The solder termination type ensures a strong and reliable connection, allowing for efficient signal transmission and minimal interference.
The 0.1-inch mating contact pitch enables easy and precise connection with compatible components, ensuring seamless integration with existing systems.
The body length of 0.4 inches provides ample space for the SIP4 device to be securely housed within the chip carrier IC & component socket.
Beryllium Copper (Be-Cu) contact material offers excellent conductivity and durability, ensuring long-lasting performance and optimal signal transmission.
With 4 contacts, this chip carrier IC & component socket is designed to accommodate SIP4 devices with precision and stability.
The gold (Au) plating with nickel (Ni) barrier on the mating contacts provides corrosion resistance and smooth mating surfaces, enhancing the longevity of the product.
The straight mounting style offers ease of installation and ensures a secure attachment to the PCB, contributing to the overall stability of the chip carrier IC & component socket.
The round pin socket contact style enables efficient signal transmission and low contact resistance, maintaining signal integrity and reliability.
With a current rating of 1A, this chip carrier IC & component socket can handle moderate electrical loads effectively and safely.
The body width of 0.1 inches provides a compact and space-saving design, ideal for applications where size constraints are a consideration.
The gold plating with nickel barrier on the termination contacts ensures robust and reliable solder connections, enhancing the overall performance and longevity of the product.
The body depth of 0.175 inches offers sufficient space for the SIP4 device to be securely housed within the chip carrier IC & component socket, ensuring proper alignment and connectivity.
The IC socket type design ensures compatibility and secure fitting for SIP4 devices, allowing for easy insertion and removal when needed.
The rectangular contact configuration provides a stable and secure connection with the SIP4 device, minimizing the risk of signal loss or interference.
With a maximum operating temperature of 125°C, this chip carrier IC & component socket can withstand high-temperature environments without compromising performance.
The 2.54mm terminal pitch allows for easy compatibility with standard PCB layouts and components, facilitating seamless integration into various electronic systems.
Chip Carrier IC & Component Sockets SS-104-G-22-N attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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SS-104-G-22-N Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
2N2222A
Philips Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Capar Components
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Forward Voltage (VF): 1 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Output Current: .15 A;
2N7002
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Operating Mode: ENHANCEMENT MODE; Maximum Drain Current (ID): .115 A;
Shenzhen Socay Electronics
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
Bkc Semiconductors
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Goodwork Semiconductor
BSS138NH6327XTSA2
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
KSZ9031RNXIC
Microchip Technology
KSZ9031RNXIC by Microchip Technology is a network interface chip with 1 transceiver. It operates at a data rate of 1000 Mbps and has a nominal voltage of 1.2V. This chip is commonly used in industrial applications requiring Ethernet connectivity.
Texas Instruments
NE555D by Texas Instruments is an 8-terminal IC with a supply voltage range of 4.5V to 16V, suitable for analog waveform generation applications. It operates at temperatures from 0°C to 70°C and has a max supply current of 15mA. The package style is small outline, making it ideal for compact electronic designs.
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Diotec Semiconductor Ag
XR2D-1601-N
Omron
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
ICF-624-T-O-TR
Samtec
Samtec's ICF-624-T-O-TR is a Chip Carrier IC Socket with 24 contacts, Beryllium Copper material, and Matte Tin finish. It has a 15.24mm PCB contact row spacing and operates b/w -55°C to 125°C. Ideal for DIP24 devices, it features a rectangular contact pattern for surface mount termination in electronic applications.
232-1285-09-0602J
3m Electronic Products Division
232-1285-09-0602J by 3M is a DIP32 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 32 gold-over-nickel contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
XR2A-4011-N
IC SOCKET; Device Type Used On: DIP40; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 40;
5-1437539-3
TE Connectivity
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: VERTICAL MOUNT DIP SOCKET; No. of Contacts: 20;
GFZ-30-01-G-10-AD
The Samtec GFZ-30-01-G-10-AD is a Chip Carrier IC Socket with 300 contacts. It features Beryllium Copper contact material and Gold over Nickel finish for mating. Designed for LGA300 devices, it utilizes Liquid Crystal Polymer housing material for high performance in electronic applications.
69802-044LF
Amphenol's 69802-044LF is a PLCC44 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 44 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for surface mount applications, it offers high insulation resistance and dielectric voltage withstand capabilities.
169-PRS13001-16
Aries Electronics
Aries Electronics 169-PRS13001-16 is a PGA169 IC socket with 169 contacts, made of POLYPHENYLENE SULPHIDE. It has a contact pitch of 0.1" and operates b/w -65°C to 200°C. Ideal for chip carrier ICs, it features solder termination and a rectangular PCB contact pattern.
9-1437514-4
TE Connectivity 9-1437514-4 is a Chip Carrier IC Socket with 7.62mm PCB contact spacing, -55 to 105°C temp range, and 3A current rating. Ideal for PRESS FIT termination in electronic applications requiring high insulation resistance and precise mating contact pitch of 0.1 inch.
ICF-628-T-O-TR
Samtec's ICF-628-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a rectangular contact pattern and liquid crystal polymer housing. It has a mating contact pitch of 0.1", suitable for DIP28 devices. With surface mount termination, it operates b/w -55°C to 125°C, ideal for various electronic applications.
110-13-628-41-001000
Mill-max Mfg
110-13-628-41-001000 by Mill-max Mfg is a PCT POLYESTER Chip Carrier IC Socket for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for electronic applications requiring reliable connections in integrated circuits.
ICA-628-SST
Samtec's ICA-628-SST is a DIP28 IC socket with 28 contacts, rated at 1A current. It features gold over nickel contact finish, polyester housing material, and operates b/w -65 to 125°C. Ideal for chip carrier applications with rectangular PCB contact pattern and 15.24mm row spacing.
QIT-314-S001-95
E-tec Interconnect
QIT-314-S001-95 by E-tec Interconnect is a Chip Carrier IC Socket with 14 contacts, 0.1" pitch, and FR4 housing material. It has a PCB contact row spacing of 7.62mm and is used on DIP14 devices. With a temperature range from -55°C to 125°C, it's suitable for various electronic applications requiring reliable solder termination and high insulation resistance.
2-1904045-4
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 5; Termination Type: SOLDER; Contact Material: NOT SPECIFIED;
16-350000-11-RC
IC SOCKET; Device Type Used On: SOIC16-DIP16; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD OVER NICKEL; Additional Features: SOCKET ADAPTER; No. of Contacts: 16;
111-91-964-41-001000
Mill-max Mfg's 111-91-964-41-001000 is a Chip Carrier IC Socket with 64 contacts. It features Beryllium Copper contact material, Gold over Nickel mating finish, and Tin/Lead termination. Ideal for DIP64 devices, this socket has a Polyethylene housing and rectangular contact configuration.
134-10-328-00-100000
134-10-328-00-100000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
ICO-308-NGG
The Samtec ICO-308-NGG is a Chip Carrier IC Socket with 8 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It uses beryllium copper for contacts, gold finish over nickel for mating, and operates b/w -65°C to 125°C. Ideal for DIP8 devices, it has a current rating of 1A and dielectric voltage withstand of 1000VAC.
228-1290-09-0602J
The 3M Electronic Products Division's 228-1290-09-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier applications requiring secure component sockets.
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SS-104-G-2-N
SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
SS-104-TT-2-N
SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
SS-104-G-1A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; PCB Contact Pattern: RECTANGULAR;
SS-104-G-1B-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Width: .1 inch;
SS-104-G-1C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Length: .4 inch;
SS-104-G-21A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Config: RECTANGLE;
SS-104-G-21B-N
SS-104-G-21C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Mating Contact Pitch (inch): 0.1;
SS-104-G-28-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Rating (Current): 1 A;
SS-104-G-28
SS-104-G-29-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Maximum Operating Temperature: 125 Cel;
SS-104-G-29
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Finish (Mating): AU ON NI;
SS-104-G-38-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; No. of Contacts: 4;
SS-104-G-5A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Terminal Pitch (mm): 2.54;
SS-104-G-5
IC SOCKET; Device Type Used On: SIP4; Mounting Style: RIGHT ANGLE; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; PCB Contact Pattern: RECTANGULAR;
SS-104-G-7-N
SS-104-T-1B-N
SS-104-T-38-N
SS-104-TT-21C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Finish (Mating): SN;
SS-104-TT-22-N
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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