Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec APA-316-T-D is a 16-contact IC socket with brass contacts and polyester housing. It features Tin over Nickel mating finish and Tin with Nickel termination finish. Ideal for DIP16 devices, this rectangular contact configuration chip carrier socket is suitable for various electronic applications.
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Netroflash
The use of polyester as housing material ensures durability and reliability for the chip carrier, making it suitable for long-lasting performance.
Specifically designed for DIP16 integrated circuits, ensuring a secure and proper fit for the intended devices.
Brass contacts offer excellent conductivity and corrosion resistance, providing a reliable connection for the integrated circuit.
With 16 contacts, this chip carrier socket can accommodate DIP16 ICs without any compatibility issues.
The tin over nickel finish ensures a strong and stable connection between the chip and socket, reducing the risk of signal interference or loss.
The tin with nickel barrier termination enhances the overall conductivity and reliability of the connection, ensuring optimal performance.
Designed specifically as an IC socket, this product is tailor-made for integrated circuit applications, providing a secure and stable connection.
The rectangular contact configuration helps in providing a precise and snug fit for the DIP16 IC, ensuring proper alignment and connection.
Chip Carrier IC & Component Sockets APA-316-T-D attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
APA-316-T-D Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
BAV99
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Dc Components
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
2N7002
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
LM555CN
Harris Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
2N2222A
M/a-com Technology Solutions
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Terminal Position: BOTTOM; Package Style (Meter): CYLINDRICAL;
BAT54SLT1G
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M12883/40-11
Amphenol
Amphenol's M12883/40-11 is a POLYETHERIMIDE chip carrier socket with 14 GOLD contacts for RELAY devices. It is designed as a RELAY SOCKET, suitable for various electronic applications requiring reliable connection and performance.
115-47-640-41-001000
Mill-max Mfg
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED;
832-AG11D-ESL-LF
TE Connectivity
TE Connectivity's 832-AG11D-ESL-LF is a DIP32 IC socket with 32 contacts, rated at 3A current. Featuring a PCB contact row spacing of 15.24mm and rectangular pattern, it has a housing made of polyethylene/polyester. With a temperature range from -55 to 105 °C, it uses solder termination and has an insulation resistance of 5G ohm.
214-99-308-01-670800
214-99-308-01-670800 by Mill-max Mfg is a DIP8 IC socket with NYLON46 housing and BERYLLIUM COPPER contacts. It has 8 contacts with TIN LEAD mating finish and Tin/Lead termination. Ideal for chip carrier applications requiring a rectangular contact configuration.
XR2A-2211-N
Omron
IC SOCKET; Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4;
1415035-1
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
150-10-640-00-018101
Preci-dip Sa
150-10-640-00-018101 by Preci-dip Sa is a DIP40 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. It features 40 gold-plated contacts for superior connectivity. Ideal for chip carrier applications requiring reliable connections in electronic devices.
APH-1508-G-T
Samtec
The Samtec APH-1508-G-T is a DIP8 IC socket with 8 brass contacts and gold over nickel finish. It features a polyethylene housing material and rectangular contact configuration. Ideal for chip carrier applications, this IC socket is designed to provide reliable connections in electronic devices.
4-1437508-0
TRANSISTOR SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
ICA-314-ZSTT
Samtec's ICA-314-ZSTT is a DIP14 IC socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It uses beryllium copper alloy for contacts and has a current rating of 1A. Ideal for applications requiring a chip carrier IC socket with solder termination and operating temperatures ranging from -65°C to 125°C.
8428-21B1-RK-TP
3m Electronic Products Division
8428-21B1-RK-TP by 3M is a PLCC28 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing material. Featuring 28 contacts, it has a temperature range of -40 to 105 °C and insulation resistance of 1G ohm. Ideal for surface mount applications requiring reliable connections in electronic devices.
QIT-314-S001-95
E-tec Interconnect
QIT-314-S001-95 by E-tec Interconnect is a Chip Carrier IC Socket with 14 contacts, 0.1" pitch, and FR4 housing material. It has a PCB contact row spacing of 7.62mm and is used on DIP14 devices. With a temperature range from -55°C to 125°C, it's suitable for various electronic applications requiring reliable solder termination and high insulation resistance.
315-43-120-41-003000
315-43-120-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for SIP20 devices with 20 contacts. It features MATTE TIN OVER NICKEL finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
SS-104-G-2-N
SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
PLS-032-H105-99
PLS-032-H105-99 by E-tec Interconnect is a PLCC32 IC socket with 32 contacts, rated for 1A current. It has surface mount termination, bellowed contact style, and operates b/w -40°C to 105°C. Ideal for chip carrier IC applications requiring high insulation resistance and reliable contact finish.
VCF4-1001
IC SOCKET; Termination Type: SOLDER; No. of Contacts: 1; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
P2R-08A
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
A-CCS-84-Z-T
Assmann Wsw Components
A-CCS-84-Z-T by Assmann Wsw Components is a PLCC84 IC socket with PBT housing, 84 contacts, and solder termination. It features bellowed contact style, 1A current rating, and 1000VAC dielectric voltage. Ideal for applications requiring high insulation resistance and operating temperatures from -40°C to 105°C.
510-93-169-17-101003
Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
551-90-022-05-001005
Mill-max Mfg 551-90-022-05-001005 is a PGA22 IC socket with 22 contacts. It features TIN LEAD (200) mating finish and Tin/Lead termination with Nickel barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it's ideal for Chip Carrier applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
APA-320-G-A1
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Contact Material: BRASS; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APA-316-G-A1
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; No. of Contacts: 16; Contact Finish (Mating): GOLD (20) OVER NICKEL (50); Contact Material: BRASS;
APA-316-G-A
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; No. of Contacts: 16; Contact Material: BRASS; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
APA-316-G-D
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; Contact Config: RECTANGLE; JESD-609 Code: e4; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
APA-316-G-K
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Material: BRASS;
APA-316-G-P
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; No. of Contacts: 16; Contact Material: BRASS/PHOSPHOR BRONZE; Contact Finish (Mating): GOLD (20) OVER NICKEL (50);
APA-316-T-A
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; JESD-609 Code: e3; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 16;
APA-316-T-F
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; JESD-609 Code: e3; Contact Config: RECTANGLE;
APA-316-T-K
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; JESD-609 Code: e3; Contact Finish (Mating): TIN OVER NICKEL (50);
APA-316-T-M
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 16;
APA-316-T-N
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; PCB Contact Pattern: RECTANGULAR;
APA-316-T-P
IC SOCKET; Device Type Used On: DIP16; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 16; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APA-316-T-Q
IC SOCKET; Device Type Used On: DIP16; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; JESD-609 Code: e3;
APA-316-T-B1
IC SOCKET; Device Type Used On: DIP16; JESD-609 Code: e3; Contact Config: RECTANGLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS;
APA-316-T-B3
IC SOCKET; Device Type Used On: DIP16; Contact Material: BRASS; Contact Config: RECTANGLE; No. of Contacts: 16; JESD-609 Code: e3;
APA-316-T-C1
IC SOCKET; Device Type Used On: DIP16; Contact Finish (Mating): TIN OVER NICKEL (50); No. of Contacts: 16; Contact Config: RECTANGLE; Contact Material: BRASS;
APA-316-T-C2
IC SOCKET; Device Type Used On: DIP16; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BRASS; Contact Config: RECTANGLE; JESD-609 Code: e3;
APA-316-T-D2-1
IC SOCKET; Device Type Used On: DIP16; Contact Material: BRASS; No. of Contacts: 16; Contact Finish (Mating): TIN OVER NICKEL (50); Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
APA-316-T-D3-1
IC SOCKET; Device Type Used On: DIP16; No. of Contacts: 16; JESD-609 Code: e3; Contact Config: RECTANGLE; Contact Material: BRASS;
APA-316-T-D4-2
IC SOCKET; Device Type Used On: DIP16; Contact Config: RECTANGLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): TIN OVER NICKEL (50); JESD-609 Code: e3;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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