Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 326-93-103-41-001000 is a PLASTIC IC SOCKET for SIP3 devices with 3 contacts. Features GOLD (30) OVER NICKEL (100) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$1.860
Lifecycle Status
Suppliers In-Stock
3
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
-
1k+ parts
10k+ parts
Vyrian
VNN
Aranea Global
$1.823
$1.750
Continental Prestige Electronics
Argo Parts USA
AZTECH Wire
$5.611
Ampacity Inc.
$14.000
Modulus Dynamics
$42.186
Semicontronic
$45.000
$43.875
$43.650
PLASTIC housing provides insulation and protection to the components inside, ensuring their longevity and stability.
Designed specifically for SIP3 devices, ensuring a precise and secure fit for optimal performance.
3 contacts provide connectivity for multiple components, suitable for a variety of applications.
Gold mating contacts provide excellent conductivity and corrosion resistance, while nickel adds durability and reliability.
Tin/lead termination ensures a secure and stable connection to the circuit board, preventing signal loss and ensuring reliability.
IC socket design allows for easy insertion and removal of the integrated circuit, making it convenient for testing and replacement.
Rectangle contact configuration provides a secure and stable connection between the socket and the component, minimizing the risk of signal interference or loss.
Chip Carrier IC & Component Sockets 326-93-103-41-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
326-93-103-41-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
SS14
Vishay Intertechnology
Vishay Intertechnology's SS14 is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 1A. Operating at up to 125°C, it has a repetitive peak reverse voltage of 40V. Ideal for surface mount applications, it suits various electronic circuits requiring efficient rectification and low forward voltage drop.
LL4148
Promax-johnton
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
First Components International
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Weitron Technology
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
DS18B20Z+
DS18B20Z+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
2N7002
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
1N4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
Rfe International
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Forward Voltage (VF): 1 V; Config: SINGLE;
Mde Semiconductor
LM358AN
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BSS138BK,215
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
110-83-314-41-001101
Preci-dip Sa
110-83-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts, rated for 1A current. It features Beryllium Copper contact material, Gold mating finish, and Tin termination finish. With a PCB contact row spacing of 7.62mm, it has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for chip carrier IC applications due to its high insulation resistance and durable housing material.
150-10-640-00-018101
150-10-640-00-018101 by Preci-dip Sa is a DIP40 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. It features 40 gold-plated contacts for superior connectivity. Ideal for chip carrier applications requiring reliable connections in electronic devices.
XR3G-2801
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
MT78755
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SOLDER; Contact Material: NOT SPECIFIED;
614-43-964-31-012000
Mill-max Mfg
IC SOCKET; Device Type Used On: DIP64; Housing Material: PLASTIC; Contact Finish (Termination): MATTE TIN OVER NICKEL; No. of Contacts: 64; JESD-609 Code: e3;
551-10-081-09-000004
Mill-max Mfg's 551-10-081-09-000004 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It has 81 contacts with GOLD (10) over NICKEL (150) mating finish and Gold (Au) termination finish. This IC socket is used on PGA81 devices.
XR2A-1601-N
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
2-1571552-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP8; Housing Material: PCT PLASTIC POLYESTER; Contact Finish (Termination): TIN OVER NICKEL; Contact Finish (Mating): GOLD FLASH OVER NICKEL (100); JESD-609 Code: e3;
60431011
Delphi Connection Systems
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
TE Connectivity's 2-1571552-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing, RECTANGULAR pattern, and THERMOPLASTIC POLYESTER housing. It has 8 contacts, -55 to 105°C operating temp range, and 3A current rating. Ideal for applications requiring reliable solder termination in electronic circuits.
ICF-316-T-O-TR
Samtec
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
326-93-103-41-001000
IC160Z-0204-240
Yamaichi Electronics
Yamaichi Electronics' IC160Z-0204-240 is a POLYAMIDE chip carrier socket for PLCC20 devices with 20 contacts. Featuring COPPER ALLOY contacts, it has an insulation resistance of 500MΩ and dielectric voltage of 350VAC. Ideal for surface mount applications, this socket has a current rating of 1A and bellowed contact style.
XR2A-1421-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER;
ZPD11XA
Carlo Gavazzi Holding Ag
ZPD11XA by Carlo Gavazzi Holding Ag is a 11-contact relay socket with GLASS FILLED POLYAMIDE66 housing. It has a current rating of 10A, suitable for -25 to 70°C operations. Ideal for chip carrier IC & component sockets in various applications.
SH2B-05
Idec
SH2B-05 by Idec is a chip carrier IC socket with 8 blade pin-skt contacts, rated for 10A current. It is designed for use on relays with screw termination, measuring 2.736" L x 1.181" W x 0.984" D. Ideal for applications requiring reliable connection and secure mounting in industrial settings.
1415035-1
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
XR2T-0811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; JESD-609 Code: e4;
311-99-113-41-001000
Mill-max Mfg 311-99-113-41-001000 is a PLASTIC IC SOCKET for SIP13 devices with 13 contacts. Features TIN LEAD (200) mating finish and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
1437540-3
IC SOCKET; Device Type Used On: DIP32; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin/Lead (Sn/Pb); No. of Contacts: 32;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
326-93-101-41-003000
IC SOCKET; Device Type Used On: SIP1; Housing Material: PLASTIC; No. of Contacts: 1; JESD-609 Code: e0; Additional Features: SIP SOCKET;
326-93-103-41-003000
IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; No. of Contacts: 3; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-105-41-001000
IC SOCKET; Device Type Used On: SIP5; Housing Material: PLASTIC; No. of Contacts: 5; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-107-41-002000
IC SOCKET; Device Type Used On: SIP7; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-108-41-003000
IC SOCKET; Device Type Used On: SIP8; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb); Contact Config: RECTANGLE; JESD-609 Code: e0;
326-93-109-41-002000
Mill-max Mfg 326-93-109-41-002000 is a PLASTIC IC SOCKET for SIP9 devices with 9 BERYLLIUM COPPER contacts. Features Tin/Lead finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
326-93-103-41-001
IC SOCKET; Device Type Used On: SIP3; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Contact Finish (Mating): GOLD (30) OVER NICKEL; Contact Material: NOT SPECIFIED;
326-93-103-41-002
IC SOCKET; Device Type Used On: SIP3; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: SIP SOCKET; JESD-609 Code: e0;
326-93-103-41-003
IC SOCKET; Device Type Used On: SIP3; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 3; Contact Finish (Mating): GOLD (30) OVER NICKEL; Contact Material: NOT SPECIFIED;
326-93-103-41-002000
IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; Additional Features: SIP SOCKET; No. of Contacts: 3; Contact Config: RECTANGLE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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