Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
Median Price
$3.310
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Suppliers In-Stock
3
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1k+
Nova Conductors
1+ parts
100+ parts
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1k+ parts
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Vyrian
VNN
Continental Prestige Electronics
$3.244
Argo Parts USA
Netroflash
AZTECH Wire
$12.750
Semicontronic
$27.000
$26.325
$26.190
Ampacity Inc.
$43.000
The use of plastic housing material makes this chip carrier socket lightweight and durable, perfect for various electronic applications.
Designed to be used on SIP8 devices, providing a secure and reliable connection for integrated circuits in a compact form factor.
With 8 contacts, this chip carrier socket can accommodate a wide range of electronic components, offering versatility and flexibility in circuit design.
The gold over nickel contact finish ensures excellent conductivity and corrosion resistance, maintaining reliable connections over time.
The tin/lead termination provides easy soldering and secure attachment to the circuit board, ensuring stable connections for the integrated circuit.
Designed specifically as an IC socket, this product is optimized for integrated circuit applications, providing a secure and reliable socket for the chip carrier.
The rectangular contact configuration allows for easy alignment and insertion of the integrated circuit, ensuring a proper and secure fit within the socket.
Chip Carrier IC & Component Sockets 326-93-108-41-003000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
326-93-108-41-003000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
BAV99
Secos
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Sensitron Semiconductor
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
1N4148
Diotec Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
Baneasa S A
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
Rectron
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
BAV99-7-F
Synsemi
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; Qualification: Not Qualified;
110-87-314-41-001101
Preci-dip Sa
110-87-314-41-001101 by Preci-dip Sa is a DIP14 IC socket with 14 contacts and 7.62mm PCB row spacing. It features Beryllium Copper contact material, Gold Flash finish, and POLYESTER housing material. Ideal for applications requiring a current rating of 1A, dielectric voltage of 1400VAC, and operating temperatures from -55 to 125°C.
114-87-624-41-117101
IC SOCKET; Device Type Used On: DIP24; Housing Material: PCT POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 24; Contact Finish (Mating): NOT SPECIFIED;
1393824-8
TE Connectivity
IC SOCKET; Housing Material: PHENOLFORMALDEHYDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
110-13-308-41-001000
Mill-max Mfg
110-13-308-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and gold over nickel termination. It has a PCB contact row spacing of 7.62mm and is used on DIP8 devices. Ideal for applications requiring a mating contact pitch of 2.54mm in temperature ranges from -55°C to 125°C.
360-90-142-00-001000
The Mill-max Mfg 360-90-142-00-001000 is a Chip Carrier IC & Component Socket made of POLYETHYLENE, designed for SIP42 devices with 42 contacts. It features TIN LEAD (200) mating finish over NICKEL (150), and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration.
1-2199299-5
TE Connectivity 1-2199299-5 is a Chip Carrier IC Socket with 40 contacts, 0.1" pitch, and bellowed contact style. It has a PCB contact row spacing of 15.24mm and operates b/w -40°C to 105°C. Ideal for applications requiring high insulation resistance and dielectric voltage withstand capability.
HLS-1820-T-22
Samtec
The Samtec HLS-1820-T-22 is a plastic IC socket with 360 gold contacts for PGA360 devices. It offers gold contact finish for mating and termination, suitable for chip carrier applications. This component is designed to provide reliable connections in electronic assemblies.
3-822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): TIN LEAD;
123-83-308-41-001101
123-83-308-41-001101 by Preci-dip Sa is a DIP8 IC SOCKET with 8 contacts, BE-CU material, and AU finish. It has a 7.62mm PCB row spacing for RECTANGULAR pattern on PCBs. Ideal for applications requiring -55 to 125 °C operating temperatures and wire wrap terminations.
304-13-128-41-770000
The Mill-max Mfg 304-13-128-41-770000 is a POLYETHYLENE chip carrier IC socket with 28 contacts, GOLD OVER NICKEL finish. It is designed for SIP28 devices, featuring RECTANGLE contact configuration. Ideal for high-performance electronic applications requiring reliable and durable component sockets.
40-6508-311
Aries Electronics
Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
289-PRS17001-12
Aries Electronics 289-PRS17001-12 is a PGA289 IC socket with 289 contacts, gold over nickel finish. It has a body size of 2.294" x 2.075" x 0.265", suitable for PCBs with rectangular contact pattern and 2.54mm row spacing. Ideal for applications requiring high reliability in extreme temperature environments from -65°C to 125°C.
XR2A-2471-N
Omron
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Manufacturer Series: XR2A; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4;
110-87-324-41-001101
110-87-324-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. Suitable for chip carrier ICs, it has a PCB contact row spacing of 7.62mm and Polycyclohexydimethylene Terephthalate-Polyester housing material.
XR2A-2811-N
IC SOCKET; Device Type Used On: DIP28; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; No. of Contacts: 28; Contact Finish (Mating): NOT SPECIFIED;
2955425
Phoenix Contact
RELAY SOCKET;
27E305
IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
XR2A-4801-N
IC SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
ICA-203-S-TG30
Robinson Nugent
IC SOCKET; Device Type Used On: DIP20; Housing Material: POLYESTER; Manufacturer Series: ICE; Additional Features: STANDARD: UL 94V-0; No. of Contacts: 20;
27E166
TE Connectivity's 27E166 is a GLASS FILLED POLYESTER Chip Carrier IC Socket with SCREW termination. It features 14 RND PIN-SKT contacts and is designed for use on RELAY devices. Ideal for high-performance electronic applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
326-93-101-41-003000
IC SOCKET; Device Type Used On: SIP1; Housing Material: PLASTIC; No. of Contacts: 1; JESD-609 Code: e0; Additional Features: SIP SOCKET;
326-93-103-41-001000
IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; No. of Contacts: 3; Contact Finish (Mating): GOLD (30) OVER NICKEL (100); Contact Config: RECTANGLE;
326-93-103-41-003000
IC SOCKET; Device Type Used On: SIP3; Housing Material: PLASTIC; No. of Contacts: 3; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-105-41-001000
IC SOCKET; Device Type Used On: SIP5; Housing Material: PLASTIC; No. of Contacts: 5; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-107-41-002000
IC SOCKET; Device Type Used On: SIP7; Housing Material: PLASTIC; JESD-609 Code: e0; Contact Config: RECTANGLE; Contact Finish (Termination): Tin/Lead (Sn/Pb);
326-93-109-41-002000
Mill-max Mfg 326-93-109-41-002000 is a PLASTIC IC SOCKET for SIP9 devices with 9 BERYLLIUM COPPER contacts. Features Tin/Lead finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
326-93-108-41-001
IC SOCKET; Device Type Used On: SIP8; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; No. of Contacts: 8; JESD-609 Code: e0; Additional Features: SIP SOCKET;
326-93-108-41-002
IC SOCKET; Device Type Used On: SIP8; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Additional Features: SIP SOCKET;
326-93-108-41-003
IC SOCKET; Device Type Used On: SIP8; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; JESD-609 Code: e0; Contact Finish (Termination): TIN LEAD OVER NICKEL; Contact Material: NOT SPECIFIED;
326-93-108-41-001000
IC SOCKET; Device Type Used On: SIP8; Housing Material: PLASTIC; Contact Finish (Termination): Tin/Lead (Sn/Pb); Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
326-93-108-41-002000
IC SOCKET; Device Type Used On: SIP8; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Additional Features: SIP SOCKET; Contact Finish (Termination): Tin/Lead (Sn/Pb);
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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