Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Aries Electronics 40-6508-311 is a DIP40 IC socket with 40 contacts, featuring rectangular PCB contact pattern spaced at 15.24mm. Made of glass-filled nylon46, it has wire wrap termination and uses round pin sockets. Ideal for applications requiring precise connections on a 2x0.7x0.19" board with 0.1" pitch mating contacts.
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This wide spacing allows for easy and secure connection with the PCB, reducing the chance of errors during assembly.
The use of glass filled nylon46 provides high strength and durability, making the socket suitable for long-term use in various environments.
The wire wrap termination type ensures a reliable and stable connection, making it ideal for applications where frequent changes or adjustments are required.
With 40 contacts, this socket can accommodate a wide range of IC chips, providing versatility and compatibility for different applications.
The straight mounting style simplifies the installation process and ensures a secure fit on the PCB, enhancing overall reliability.
Chip Carrier IC & Component Sockets 40-6508-311 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Aries Electronics
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40-6508-311 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Infineon Technologies
MBR0520L-T1
Won-top Electronics
MBR0520L-T1 by Won-top Electronics is a Schottky rectifier diode with 20V peak reverse voltage and 0.5A output current. It is a single-config, surface-mount diode in a small outline package, suitable for applications requiring high-speed switching and low forward voltage drop. Operating temperature range from -65°C to 125°C makes it ideal for various electronic circuits.
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317T/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-609 Code: e3; Package Shape: RECTANGULAR;
1N4148WS
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
FDC5614P
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Vishay Sprague
ULN2803ADW
Texas Instruments
ULN2803ADW by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85 °C and has a max supply voltage of 3 V. Ideal for applications requiring buffer or inverter-based peripheral drivers with sink current flow direction.
SMMBT3904LT1G
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
LM107H
Linear Technology
LM107H by Linear Technology is an Operational Amplifier with a max input offset voltage of 3000uV, common mode reject ratio of 96dB, and min voltage gain of 50000. It is used in military applications due to its MILITARY temperature grade and BIPOLAR technology for precise signal processing in harsh environments.
1552200168
Molex
WIRE AND CABLE;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
LM317TG
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
390261-2
TE Connectivity
TE Connectivity's 390261-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular contact pattern. It features glass-filled PBT housing, solder termination, and leaf contact style. Ideal for applications requiring a 1A current rating, it operates b/w -40°C to 105°C with a dielectric voltage of 1000VAC.
XR2A-2811-N
Omron
IC SOCKET; Device Type Used On: DIP28; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; No. of Contacts: 28; Contact Finish (Mating): NOT SPECIFIED;
ICF-624-T-O-TR
Samtec
Samtec's ICF-624-T-O-TR is a Chip Carrier IC Socket with 24 contacts, Beryllium Copper material, and Matte Tin finish. It has a 15.24mm PCB contact row spacing and operates b/w -55°C to 125°C. Ideal for DIP24 devices, it features a rectangular contact pattern for surface mount termination in electronic applications.
788-312
Wago
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
110-41-640-41-001000
Mill-max Mfg
Mill-max Mfg's 110-41-640-41-001000 is a POLYETHYLENE IC SOCKET for DIP40 devices with 40 contacts. Features MATTE TIN OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
A40-LC-TT
Assmann Wsw Components
A40-LC-TT by Assmann Wsw Components is a DIP40 IC socket with 40 phosphor bronze contacts and polybutylene terephthalate housing. Contacts have tin finish (80) for mating and termination. Ideal for chip carrier ICs, this rectangular contact configuration ensures secure connections in electronic applications.
ICF-308-T-I-TR
Samtec's ICF-308-T-I-TR is a Chip Carrier IC Socket with 8 contacts, rated at 1A current. It features a rectangular contact pattern on a 7.62mm PCB row spacing, suitable for DIP8 devices. With liquid crystal polymer housing and operating temperatures from -55°C to 125°C, it offers surface mount termination for various applications.
390261-6
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Mounting Style: STRAIGHT; Contact Style: LEAF; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE;
MT78745
IC SOCKET; Housing Material: POLYAMIDE; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
228-1290-09-0602J
3m Electronic Products Division
The 3M Electronic Products Division's 228-1290-09-0602J is a DIP28 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 28 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier applications requiring secure component sockets.
YFS-20-03-H-08-SB-TR
YFS-20-03-H-08-SB-TR by Samtec is a Chip Carrier IC Socket with 160 contacts. It features Phosphor Bronze contact material and Gold over Nickel finish. Designed for BGA160 devices, it uses Liquid Crystal Polymer housing material for high performance in electronic applications.
12-823-90C
Aries Electronics
Aries Electronics 12-823-90C is a chip carrier IC socket with 12 contacts, rectangular PCB pattern, and nylon46 housing. It features a mating contact pitch of 0.1 inch and solder termination type. Ideal for DIP12 devices, this socket has a right-angle mounting style for easy installation in electronic circuits.
PLCC-32-AT-SMT
Adam Tech
PLCC-32-AT-SMT by Adam Tech is a Chip Carrier IC Socket with GLASS FILLED POLYPHENYLENE SULPHIDE housing. Featuring 32 P-CUSN contacts, it has -55 to 105 °C operating range and 1A current rating. Ideal for PLCC32 devices, this surface mount socket offers high insulation resistance and dielectric voltage withstand capability of 500VAC.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
224-1275-00-0602J
The 3M Electronic Products Division's 224-1275-00-0602J is a DIP24 IC socket with 24 contacts. It features Beryllium Copper contact material and Gold (Au) finish for mating and termination. The housing material is Glass Filled Polysulfone, making it ideal for chip carrier applications.
150-10-640-00-106161
Preci-dip Sa
150-10-640-00-106161 by Preci-dip Sa is a DIP40 IC socket with 40 brass contacts, gold finish, and surface mount termination. It has a contact pitch of 0.1 inch and operates b/w -55°C to 125°C. Ideal for chip carrier ICs, this socket offers high insulation resistance and dielectric voltage withstand capabilities.
XR2D-1601-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
9-1437539-2
TE Connectivity 9-1437539-2 is a DIP28 IC socket with 28 contacts, rated at 3A current. It features a PCB contact row spacing of 15.24mm and rectangular pattern, suitable for applications requiring a housing material of polyester. The socket has a min operating temperature of -55°C and max of 125°C, with solder termination type.
XR2T-2201-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD;
95.05SPA
Finder
RELAY SOCKET; Housing Material: PLASTIC; No. of Contacts: 8;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
40-6554-10
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYPHENYLENE SULFIDE;
40-6552-11
Aries Electronics 40-6552-11 is a DIP42 IC socket with 40 contacts made of beryllium copper. The housing material is polyphenylene sulfide, and the contact finish includes gold over nickel. Ideal for chip carrier applications requiring reliable connections in electronic devices.
40-6552-18
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYETHERETHERKETONE;
40-6518-102HE
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYBUTYLENE TEREPHTHALATE; Termination Type: SOLDER;
40-6518-111E
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; No. of Contacts: 40;
40-6518-111H
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Length: 2 inch;
40-6518-111
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: THERMOPLASTIC POLYESTER; Body Depth: .162 inch;
40-6508-201
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Body Depth: .19 inch;
40-6508-202
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Additional Features: STACKABLE;
40-6508-211
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Contact Finish (Mating): NOT SPECIFIED;
40-6508-212
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Contact Material: NOT SPECIFIED;
40-6508-301
40-6508-302
40-6508-312
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Terminal Pitch (mm): 2.54;
40-6518-10H
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Maximum Operating Temperature: 105 Cel;
40-6508-20
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Material: BE-CU;
40-6508-21
40-6508-30
40-6508-31
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; JESD-609 Code: e4;
40-6513-10HV0
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYAMIDE; Body Width: .7 inch;
Supply Digital Components
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