Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The 3M Electronic Products Division's 218-3341-00-0602J is a DIP18 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 18 gold (30) over nickel (50) contacts for reliable connections. Ideal for chip carrier IC applications requiring a durable and high-quality socket solution.
Median Price
$26.390
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$26.380
100+ parts
$18.610
1k+ parts
$17.880
10k+ parts
-
DigiKey
$26.400
$19.076
$17.031
Chip1Stop
$29.200
Verical
$10.361
$10.039
Vyrian
VNN
Nova Conductors
Euro-Tech
Sogenti Electronics
SPM Sales
AZTECH Wire
$6.635
Ampacity Inc.
$8.810
CoreStaff
$13.265
$7.703
Semicontronic
$19.170
$18.691
$18.595
Aztec Data Supply Inc.
Argo Parts USA
Perfect Parts
Corohmni
Bastille Electronics
The use of glass-filled polysulfone provides durability and resistance to high temperatures, making this chip carrier socket suitable for various applications.
Designed specifically for DIP18 devices, ensuring a secure and compatible fit for the intended components.
Beryllium copper offers excellent conductivity and spring-like properties, ensuring reliable connections with the ICs placed in the socket.
With 18 contacts, this chip carrier socket is suitable for DIP18 devices that require multiple connections for proper functionality.
The gold and nickel finish provides corrosion resistance and ensures a reliable mating connection between the socket and the IC, reducing signal loss and improving performance.
The same gold and nickel finish on the termination side ensures a durable and consistent connection with the PCB, enhancing the overall reliability of the socket.
Designed specifically as an IC socket, this product is tailored for integrated circuit applications, providing a secure and stable platform for DIP18 devices.
Chip Carrier IC & Component Sockets 218-3341-00-0602J attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from 3m Electronic Products Division
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
218-3341-00-0602J Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
With over 60,000 products in our portfolio, 3M brands deliver science-based performance and extraordinary outcomes across almost any industry you can imagine.
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
BAV99
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
DS18B20U
Maxim Integrated
DS18B20U by Maxim Integrated is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
C1210C104K5RACTU
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
LM317D2TG
Onsemi
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
LM2931Z-5.0G
LM2931Z-5.0G by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V output voltage, 0.6V dropout voltage, and 0.1A output current. It is ideal for applications requiring stable power supply in temperature-sensitive environments due to its operating range of -40°C to 125°C.
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Texas Instruments
LM555CM by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 4.5V to 16V and max operating temperature of 70°C. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveform outputs. With surface mount capability and low supply current of 15mA, it is ideal for commercial-grade electronic circuits.
Shenzhen Yixinsemi Electronics
ABS06-32.768KHZ-T
Abracon
Abracon's ABS06-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 90000 ohm series resistance, and -40 to 85 °C operating temperature range. Ideal for applications requiring precise timing in compact designs like IoT devices and wearables.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
M39029/56-351
Defense Logistics Agency
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Mating Contacts: M39029/58-363; Removal Tool Sources: MILITARY; Alternate Contact Sources: MILITARY;
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2-345832-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
203-2737-55-1102
3m Electronic Products Division
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
M12883/52-001
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
60431011
Fci
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Additional Features: POLARIZED;
110-87-328-41-001101
Preci-dip Sa
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
27E893
TE Connectivity
IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SCREW; No. of Contacts: 11;
110-87-316-41-001101
110-87-316-41-001101 by Preci-dip Sa is a DIP16 IC socket with 16 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a temperature range of -55 to 125°C, it's ideal for chip carrier applications requiring reliable connections at high temperatures.
PF083A-E
Omron
RELAY SOCKET; Device Type Used On: RELAY; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
XR2A-0801-N
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
510-93-169-17-101003
Mill-max Mfg
Mill-max Mfg's 510-93-169-17-101003 is a PGA169 IC socket with 169 contacts. It features gold over nickel mating finish and tin/lead termination. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier IC applications.
P2RF-05-E
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Maximum Operating Temperature: 70 Cel; Contact Material: NOT APPLICABLE; No. of Contacts: 5; Minimum Operating Temperature: -40 Cel;
232-1285-09-0602J
232-1285-09-0602J by 3M is a DIP32 IC socket with GLASS FILLED POLYSULFONE housing and BERYLLIUM COPPER contacts. It features 32 gold-over-nickel contacts for reliable connections. Ideal for chip carrier ICs, this socket ensures secure component mounting in electronic devices.
8501NR51
Schneider Electric Sa
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
390261-6
TE Connectivity's 390261-6 is a Chip Carrier IC Socket with 20 contacts, PCB contact row spacing of 7.62mm, and housing material made of glass-filled PBT. It is used for DIP20 devices, has a solder termination type, and operates b/w -40°C to 105°C.
818-22-016-10-000101
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
28-351000-11-RC
Aries Electronics
28-351000-11-RC by Aries Electronics is a 28-contact IC socket for SSOP28-DIP28 devices. It features brass contacts with gold over nickel finish for mating and termination. Ideal for chip carrier IC applications requiring reliable connections in electronic circuits.
SY4S-05C
Idec
RELAY SOCKET;
173-10-318-00-001000
173-10-318-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP18 devices with 18 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
828-AG12D-ES-LF
TE Connectivity's 828-AG12D-ES-LF is a chip carrier IC socket with 28 contacts and a rectangular PCB contact pattern. It has a body length of 1.4 inch, body width of 0.7 inch, and body depth of 0.18 inch. This socket is commonly used on DIP28 devices and can withstand temperatures ranging from -55 to 105 °C.
208-7391-55-1902
208-7391-55-1902 by 3m Electronic Products Division is a Chip Carrier IC & Component Socket made of POLYETHERSULFONE. It is used for SOIC8 devices and has 8 BERYLLIUM COPPER contacts with GOLD (30) OVER NICKEL (50) mating finish. This IC socket is suitable for various electronic applications.
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218-3341-09-0602J
IC SOCKET; Device Type Used On: DIP18; Housing Material: GLASS FILLED POLYSULFONE; Contact Material: BERYLLIUM COPPER; No. of Contacts: 18; JESD-609 Code: e4;
218-3341-19-0602J
IC SOCKET; Device Type Used On: DIP18; Housing Material: GLASS FILLED POLYSULFONE; No. of Contacts: 18; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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