Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IC SOCKET; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER;
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Chip Carrier IC & Component Sockets XR2B-2801-N attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Omron
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
JESD-609 Code:
Product Series:
XR2B-2801-N Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
As a global leader in the field of automation, OMRON’s business fields cover a broad spectrum, ranging from industrial automation and electronic components to social systems including automated ticket gates and solar power conditioners, healthcare. At present, OMRON provides products and services in around 120 countries and regions.
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
1N4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
SMBJ18CA
General Instrument
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
Littelfuse
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
Fagor Electronica S Coop
Cheng-yi Electronic
New England Semiconductor
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM2675M-ADJ/NOPB
National Semiconductor
SWITCHING REGULATOR; Temperature Grade: AUTOMOTIVE; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
Pro-an Electronic
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
XR2C-3225
Omron
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH; Manufacturer Series: XR2; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH;
2955425
Phoenix Contact
RELAY SOCKET;
350-10-164-00-001000
Mill-max Mfg
350-10-164-00-001000 by Mill-max Mfg is a chip carrier IC & component socket made of polyethylene. It is designed for use on SIP64 devices with 64 contacts and features gold over nickel contact finish. This IC socket has a rectangular contact configuration, making it suitable for various applications in electronics.
214-44-318-01-670800
214-44-318-01-670800 by Mill-max Mfg is a NYLON46 Chip Carrier IC Socket for DIP18 devices with 18 contacts and MATTE TIN finish. It features RECTANGLE contact configuration, ideal for connecting integrated circuits in electronic applications.
40-6554-10
Aries Electronics
Aries Electronics 40-6554-10 is a DIP42 IC socket with 40 contacts, PCB contact spacing of 15.24mm, and housing made of polyphenylene sulfide. It has a mating contact pitch of 0.1 inch and is used for chip carrier applications requiring a current rating of 1A at temperatures up to 105°C.
8420-21B1-RK-TP
3m Electronic Products Division
8420-21B1-RK-TP by 3M Electronic Products Division is a PLCC20 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 20 contacts made of PHOSPHOR BRONZE with MATTE TIN finish over NICKEL. Operating temperature ranges from -40°C to 105°C, ideal for chip carrier applications.
D01-9923246
Harwin Plc
IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
8134-HC-8P2
Augat
IC SOCKET; Manufacturer Series: 8134-HC;
M12883/45-01
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; No. of Contacts: 8; Additional Features: LOW PROFILE;
08-3518-10
Aries Electronics 08-3518-10 is a DIP8 IC socket with 0.1" contact pitch, suitable for surface mount termination. It features brass contacts with gold finish, rated at 3A current. Ideal for applications requiring chip carrier sockets on PCBs with rectangular contact pattern and 7.62mm row spacing.
PF083A-D
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
8134-HC-5P3
TE Connectivity
TE Connectivity's 8134-HC-5P3 is a Chip Carrier IC Socket with -65 to 125°C temp range, PRESS FIT termination, and 5A current rating. Ideal for straight mounting applications in electronic devices requiring reliable IC connections.
RP78602
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 1;
XR2A-2825
IC SOCKET; Manufacturer Series: XR2;
2-1571586-3
TE Connectivity's 2-1571586-3 is a chip carrier IC socket with a PCB contact row spacing of 7.62mm and rectangular contact pattern. It is made of polycyclohexyldimethylene terephthalate, suitable for DIP14 devices. With a rating of 3A, it has a max operating temperature of 105°C and insulation resistance of 5GΩ, making it ideal for various electronic applications.
110-87-328-41-001101
Preci-dip Sa
110-87-328-41-001101 by Preci-dip Sa is a DIP28 IC socket with 28 contacts, Beryllium Copper contact material, and Gold Flash finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for chip carrier applications requiring high insulation resistance and dielectric voltage withstand capabilities.
MVAT-209-AG-17
Samtec
IC SOCKET; Device Type Used On: PGA209; No. of Contacts: 209; JESD-609 Code: e4; Additional Features: PGA SOCKET; Contact Finish (Termination): GOLD;
540-88-044-17-400
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
XR2B-4011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4; Manufacturer Series: XR2;
415-13-228-41-003000
The Mill-max Mfg 415-13-228-41-003000 is a POLYETHYLENE IC SOCKET for SIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
XR2B-1601-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD;
XR2B-1611-N
IC SOCKET; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10);
XR2B-2401-N
IC SOCKET; Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
XR2B-2411-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
XR2B-2811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
XR2B-3201-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Manufacturer Series: XR2; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD;
XR2B-3211-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2;
XR2B-4001-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (30);
Supply Digital Components
1+ parts
$106.00
100+ parts
$54.25
1k+ parts
$11.90
10k+ parts
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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