Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Samtec's PLCC-084-TM-N-TR is a Chip Carrier IC Socket with 84 contacts. It features LIQUID CRYSTAL POLYMER housing and BERYLLIUM COPPER ALLOY contacts finished with TIN OVER NICKEL. Ideal for devices using PLCC84, this IC socket ensures reliable connections in electronic applications.
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AZTECH Wire
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Advanced Electronics
Corohmni
The use of liquid crystal polymer as the housing material ensures high durability and resistance to heat, making this product suitable for long-term use in various applications.
Designed specifically for PLCC84 devices, this product provides a secure and reliable connection, reducing the risk of damage or disconnection during operation.
The use of beryllium copper alloy for the contacts ensures excellent conductivity and durability, resulting in a stable and efficient connection for the integrated circuit.
With 84 contacts, this product offers compatibility with a wide range of integrated circuits, allowing for versatile use in various electronic devices.
The tin over nickel finish on the mating contacts provides corrosion resistance and low contact resistance, ensuring a reliable and long-lasting connection for the IC socket.
The tin with nickel barrier termination on the contacts enhances the durability and conductivity of the socket, ensuring consistent performance over time.
As an IC socket specifically designed for PLCC84 devices, this product offers a secure and stable connection, allowing for easy installation and removal of the integrated circuit.
Chip Carrier IC & Component Sockets PLCC-084-TM-N-TR attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
PLCC-084-TM-N-TR Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
1N4148
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Db Lectro
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
Renesas Electronics
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
LM107H
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
2N2222A
General Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
2N7002
Nte Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .115 A; No. of Terminals: 3;
Bytesonic Electronics
LL4148
Rfe International
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32F405RGT6
STMicroelectronics
STM32F405RGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 16 external interrupts, and 196608 RAM bytes. Ideal for industrial applications, it features CAN(2), I2C(3), SPI(3) connectivity options and operates at a max clock frequency of 26 MHz. With low power mode and DMA support, it offers versatile performance in compact dimensions.
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
326-93-107-41-002000
Mill-max Mfg
326-93-107-41-002000 by Mill-max Mfg is a PLASTIC Chip Carrier IC Socket for SIP7 devices with 7 contacts. Features GOLD (30) over NICKEL (100) mating finish and Tin/Lead termination. Ideal for rectangular contact configuration in electronic applications.
XR2A-4211-N
Omron
IC SOCKET; Device Type Used On: DIP42; JESD-609 Code: e4; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); No. of Contacts: 42;
27E127
TE Connectivity
IC SOCKET; Housing Material: PHENOLIC; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; No. of Contacts: 22; Termination Type: SOLDER;
360-90-142-00-001000
The Mill-max Mfg 360-90-142-00-001000 is a Chip Carrier IC & Component Socket made of POLYETHYLENE, designed for SIP42 devices with 42 contacts. It features TIN LEAD (200) mating finish over NICKEL (150), and Tin/Lead (Sn/Pb) termination with Nickel (Ni) barrier. Ideal for IC SOCKET applications due to its RECTANGLE contact configuration.
7-1393161-3
IC SOCKET; Housing Material: POLYAMIDE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
XR2A-2021-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; JESD-609 Code: e4; Manufacturer Series: XR2A;
P2RF-05
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
2833534
Phoenix Contact
RELAY SOCKET;
1050281001
Molex
OTHER SOCKET; Device Type Used On: CAMERA; Housing Material: PLASTIC; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 32; Additional Features: STANDARD: UL 94V-0;
69802-432LF
Amphenol Communications Solutions
Amphenol's 69802-432LF is a PLCC32 IC socket with POLYPHENYLENE SULFIDE housing. Featuring 32 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. With surface mount termination and high insulation resistance, it is ideal for chip carrier applications.
5-1415043-1
IC SOCKET; No. of Contacts: 2; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
XR3G-6401
IC SOCKET; Contact Finish (Termination): GOLD; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
1-1393824-0
IC SOCKET; Housing Material: POLYCARBONATE; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Termination Type: SOLDER;
8452-11B1-RK-TP
3m Electronic Products Division
8452-11B1-RK-TP by 3M is a PLCC52 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 52 contacts made of PHOSPHOR BRONZE, it has a temperature range from -40°C to 105°C. Ideal for applications requiring high insulation resistance and reliable solder termination.
M12883/45-01
Defense Logistics Agency
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; Contact Finish (Termination): GOLD; No. of Contacts: 8; Additional Features: LOW PROFILE;
PLCC-032-T-N
Samtec
Samtec's PLCC-032-T-N is a 32-contact IC socket with Liquid Crystal Polymer housing. Featuring bellowed contact style, it operates b/w -55°C to 105°C. Ideal for PLCC32 devices, it has surface mount termination and measures 0.7" x 0.8" x 0.2".
551-10-155-18-121003
Mill-max Mfg's 551-10-155-18-121003 is a PGA155 IC socket with 155 contacts. It features gold (Au) mating finish over nickel (Ni), and gold (Au) termination finish with Ni barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it is ideal for chip carrier applications.
4-1571551-4
TE Connectivity 4-1571551-4 is a DIP16 IC SOCKET with 16 contacts, rated at 3A current. It features a PCB contact row spacing of 7.62mm and uses solder termination. Ideal for applications requiring a mating contact pitch of 0.1 inch, such as chip carrier ICs.
110-87-324-41-001101
Preci-dip Sa
110-87-324-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and operates b/w -55°C to 125°C. Suitable for chip carrier ICs, it has a PCB contact row spacing of 7.62mm and Polycyclohexydimethylene Terephthalate-Polyester housing material.
HLS-0116-T-10
Samtec's HLS-0116-T-10 is a 16-contact IC socket with gold finish for SIP16 devices. It features a plastic housing and rectangular contact configuration. Ideal for chip carrier applications, this component offers reliable connectivity in electronic systems.
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PLCC-32-AT-SMT
Adam Tech
PLCC-32-AT-SMT by Adam Tech is a Chip Carrier IC Socket with GLASS FILLED POLYPHENYLENE SULPHIDE housing. Featuring 32 P-CUSN contacts, it has -55 to 105 °C operating range and 1A current rating. Ideal for PLCC32 devices, this surface mount socket offers high insulation resistance and dielectric voltage withstand capability of 500VAC.
PLCC-068-T-N
IC SOCKET; Device Type Used On: PLCC68; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Contact Config: 17X17;
PLCC-044-T-N
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
PLCC-032-F-N-TR
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Minimum Operating Temperature: -65 Cel;
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Additional Features: TIGER EYE;
PLCC-084-F-A-TR
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 84;
PLCC-084-F-N-TR
PLCC-084-F-N
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Contact Config: 21X21;
PLCC-084-T-A-TR
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Maximum Operating Temperature: 110 Cel;
PLCC-084-T-A
PLCC-084-T-N-TR
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Rating (Current): 1 A;
PLCC-084-T-N
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: 1.4 inch;
PLCC-084-FM-A-TR
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Additional Features: UL 94V-0; JESD-609 Code: e3;
PLCC-084-FM-A
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; Additional Features: UL 94V-0; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; No. of Contacts: 84;
PLCC-084-FM-N-TR
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: BERYLLIUM COPPER ALLOY;
PLCC-084-LM-A-TR
IC SOCKET; Device Type Used On: PLCC84; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Manufacturer Series: PLCC; No. of Contacts: 84; Contact Material: BERYLLIUM COPPER ALLOY;
PLCC-084-SM-A-TR
IC SOCKET; Device Type Used On: PLCC84; Contact Finish (Mating): HEAVY GOLD OVER NICKEL; No. of Contacts: 84; Manufacturer Series: PLCC; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
PLCC-084-TM-A-TR
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY; JESD-609 Code: e3; No. of Contacts: 84;
PLCC-084-TM-A
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY; No. of Contacts: 84; JESD-609 Code: e3;
PLCC-084-TM-N
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3; Additional Features: UL 94V-0; Contact Material: BERYLLIUM COPPER ALLOY;
Supply Digital Components
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12,000 In-Stock
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