Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Samtec's PLCC-044-T-N is a Chip Carrier IC Socket with LIQUID CRYSTAL POLYMER housing. Featuring 44 contacts, it has a -55 to 105 °C operating range and Matte Tin (Sn) finish. Ideal for PLCC44 devices, this surface mount socket is bellowed type with 11x11 contact configuration.
Median Price
$4.350
Lifecycle Status
Suppliers In-Stock
24
In-Stock Inventory
1k+
DF Sales Co.
1+ parts
100+ parts
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1k+ parts
10k+ parts
Vyrian
Quantum Digital Technology
SPM Sales
Lantek
Sensible Micro Corp
Netsource Technology, Inc.
Bristol Electronics
LWI Electronics Inc
Lighthouse Electronics, Inc.
J2 Sourcing AB
PC Components Company LLC
Atlantic Semiconductor
Legend Electronics Inc.
Mil-Aero Solutions, Inc.
LIBRA Elektronik GmbH
Sogenti Electronics
Extreme Components
Nova Conductors
Resion
Electronics Depot
Speed Components Ltd
North Shore Components
AZTECH Wire
$9.370
Authorized Procurement Solutions
Continental Prestige Electronics
Argo Parts USA
Netroflash
GreenTree Electronics
Resion (Excess)
The use of liquid crystal polymer in the housing material provides excellent thermal and mechanical properties, making the product highly durable and reliable.
Specifically designed for PLCC44 devices, ensuring compatibility and secure connection for the intended components.
The wide temperature range of -55 °C allows the product to function effectively in extreme cold environments, enhancing its versatility.
Surface mount termination allows for easy installation and removal of the IC socket, saving time and effort during assembly and maintenance.
The use of beryllium copper alloy in the contact material ensures high conductivity and resistance to corrosion, resulting in reliable electrical connections.
With a total of 44 contacts, this IC socket can accommodate a wide range of components, making it versatile for various applications.
The matte tin finish over nickel provides a smooth mating surface, reducing the risk of signal interference and ensuring secure connections between devices.
The straight mounting style simplifies the installation process and ensures proper alignment of the IC socket, improving overall performance and reliability.
The bellowed contact style allows for better resilience and flexibility, accommodating slight variations in component size and ensuring consistent contact pressure.
The compact body width of 0.9 inch saves space and allows for efficient utilization of circuit board real estate, making it ideal for compact electronic designs.
The matte tin finish with nickel barrier provides excellent corrosion resistance and ensures long-term reliability, ideal for applications in harsh environments.
The slim body depth of 0.2 inch reduces the overall profile of the IC socket, allowing for more streamlined designs and improved airflow in electronic systems.
Designed specifically for IC sockets, this product ensures compatibility and secure connections for various integrated circuits, facilitating smooth operation.
The 11x11 contact configuration provides a high density of contacts within a compact space, allowing for efficient signal transmission and connectivity in electronic systems.
With a maximum operating temperature of 105 °C, this IC socket can withstand high heat environments, ensuring reliable performance under elevated temperature conditions.
Chip Carrier IC & Component Sockets PLCC-044-T-N attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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PLCC-044-T-N Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
PCN Obsolescence/ EOL - DK OBS NOTICE
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
1N4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Vishay Intertechnology
Vishay Intertechnology's BAV99 diode features a max forward voltage of 1.3V and a max output current of 0.15A, making it ideal for rectification applications. With a small outline package style and dual terminal position, this series-connected diode is designed for surface mount usage in various electronic circuits with an operating temperature range from -55°C to 150°C.
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
4554
Jw Miller Magnetics
Other Semiconductors;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
LM7805CT
Onsemi
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
LM107H/883
LM107H/883 by Texas Instruments is a MIL-STD-883 compliant operational amplifier with 3000uV max input offset voltage, 80dB common mode reject ratio, and 250kHz unity gain bandwidth. Ideal for military applications due to its -55 to 125 °C operating temperature range and robust metal package body material.
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Laube Technology
390261-2
TE Connectivity
TE Connectivity's 390261-2 is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular contact pattern. It features glass-filled PBT housing, solder termination, and leaf contact style. Ideal for applications requiring a 1A current rating, it operates b/w -40°C to 105°C with a dielectric voltage of 1000VAC.
12-823-90C
Aries Electronics
Aries Electronics 12-823-90C is a chip carrier IC socket with 12 contacts, rectangular PCB pattern, and nylon46 housing. It features a mating contact pitch of 0.1 inch and solder termination type. Ideal for DIP12 devices, this socket has a right-angle mounting style for easy installation in electronic circuits.
P7SA-14P
Omron
Omron's P7SA-14P is a 14-contact relay socket with rectangular contact pattern and solder termination. It has a PCB row spacing of 10.59mm, suitable for G7SA devices. Operating temperature ranges from -40°C to 85°C, making it ideal for various industrial applications.
380-10-120-10-003000
Mill-max Mfg
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
2-1571552-8
TE Connectivity's 2-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and uses thermoplastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55 to 105°C.
2-2822979-3
TE Connectivity 2-2822979-3 is a POLYETHYLENE Chip Carrier IC Socket for LGA3647 devices. With 3647 contacts and 0.5A current rating, it operates b/w -25°C to 100°C. Ideal for surface mount applications in various electronic systems.
ICF-624-S-I
Samtec
Samtec's ICF-624-S-I is a Chip Carrier IC Socket with 24 contacts, featuring a PCB contact row spacing of 15.24mm and rectangular contact pattern. It uses liquid crystal polymer housing material and has a mating contact pitch of 0.1". Ideal for DIP24 devices, it operates b/w -55°C to 125°C, with termination type as surface mount.
8452-11B1-RK-TP
3m Electronic Products Division
8452-11B1-RK-TP by 3M is a PLCC52 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 52 contacts made of PHOSPHOR BRONZE, it has a temperature range from -40°C to 105°C. Ideal for applications requiring high insulation resistance and reliable solder termination.
214-99-318-01-670800
The Mill-max Mfg 214-99-318-01-670800 is a Chip Carrier IC Socket with NYLON46 housing and BERYLLIUM COPPER contacts. It has 18 contacts, TIN LEAD mating finish, and Tin/Lead termination with Nickel barrier. Ideal for DIP18 devices in electronic applications.
828-AG12D-ES-LF
TE Connectivity's 828-AG12D-ES-LF is a chip carrier IC socket with 28 contacts and a rectangular PCB contact pattern. It has a body length of 1.4 inch, body width of 0.7 inch, and body depth of 0.18 inch. This socket is commonly used on DIP28 devices and can withstand temperatures ranging from -55 to 105 °C.
DRSED
Crydom
RELAY SOCKET; Manufacturer Series: ED; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): NOT APPLICABLE;
1415044-1
TE Connectivity's 1415044-1 is a Chip Carrier IC Socket with 11 contacts, rated for 10A current. It has a dielectric voltage of 2121VAC and operates b/w -40°C to 70°C. Ideal for use on relays due to its blade pin-skt contact style and solder termination.
XR2A-4011-N
IC SOCKET; Device Type Used On: DIP40; JESD-609 Code: e4; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 40;
416-43-260-41-003000
416-43-260-41-003000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP60 devices with 60 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
1-1437504-9
TE Connectivity 1-1437504-9 is a FLUOROPOLYMER Chip Carrier IC Socket for TO-5 devices. With 3 solder contacts, it supports up to 3A current rating. Operating b/w -55°C to 125°C, it's ideal for high-temp applications in various industries.
27E891
TE Connectivity's 27E891 is a POLYAMIDE chip carrier socket with SCREW termination, suitable for RELAY devices. Featuring 8 BLADE PIN-SKT contacts, it is an IC SOCKET type ideal for relay applications.
XR2A-1415
IC SOCKET; Manufacturer Series: XR2;
GFZ-30-03-G-10-AD
The Samtec GFZ-30-03-G-10-AD is an IC socket with 300 contacts, made of beryllium copper with gold over nickel finish. It is designed for LGA300 devices and features a housing material of liquid crystal polymer. Ideal for chip carrier applications due to its high-quality contact materials and construction.
8468-21B1-RK-TP
8468-21B1-RK-TP by 3M is a PLCC68 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It has 68 contacts, matte tin finish over nickel, and operates b/w -40°C to 105°C. Ideal for surface mount applications requiring high insulation resistance and reliable connections.
27E937
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT APPLICABLE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
PLCC-084-TM-N-TR
IC SOCKET; Device Type Used On: PLCC84; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Additional Features: UL 94V-0;
PLCC-32-AT-SMT
Adam Tech
PLCC-32-AT-SMT by Adam Tech is a Chip Carrier IC Socket with GLASS FILLED POLYPHENYLENE SULPHIDE housing. Featuring 32 P-CUSN contacts, it has -55 to 105 °C operating range and 1A current rating. Ideal for PLCC32 devices, this surface mount socket offers high insulation resistance and dielectric voltage withstand capability of 500VAC.
PLCC-068-T-N
IC SOCKET; Device Type Used On: PLCC68; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Contact Config: 17X17;
PLCC-032-F-N-TR
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Minimum Operating Temperature: -65 Cel;
PLCC-032-T-N
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Additional Features: TIGER EYE;
PLCC001-PT44T-PS
Mmt Machrone
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 830VAC; Housing Material: POLYPHENYLENE SULPHIDE;
PLCC-020-T-A
IC SOCKET; Device Type Used On: PLCC20; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Additional Features: TIGER EYE;
PLCC-020-T-N
IC SOCKET; Device Type Used On: PLCC20; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .6 inch;
PLCC-028-T-N-TR
IC SOCKET; Device Type Used On: PLCC28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: .7 inch;
PLCC-028-T-N
IC SOCKET; Device Type Used On: PLCC28; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 28;
PLCC-032-T-A
IC SOCKET; Device Type Used On: PLCC32; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Maximum Operating Temperature: 105 Cel;
PLCC-044-F-A-TR
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Contact Finish (Mating): GOLD FLASH OVER NICKEL (50);
PLCC-044-F-A
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; No. of Contacts: 44;
PLCC-044-F-N-TR
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Length: .9 inch;
PLCC-044-F-N
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Termination Type: SURFACE MOUNT;
PLCC-044-T-A-TR
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Contact Material: BERYLLIUM COPPER ALLOY;
PLCC-044-T-A
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; JESD-609 Code: e3;
PLCC-044-T-N-TR
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Housing Material: LIQUID CRYSTAL POLYMER; Termination Type: SURFACE MOUNT; Contact Finish (Mating): MATTE TIN OVER NICKEL (50);
PLCC-084-T-N
IC SOCKET; Device Type Used On: PLCC84; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Width: 1.4 inch;
PLCC-044-TM-N-TR
IC SOCKET; Device Type Used On: PLCC44; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Housing Material: LIQUID CRYSTAL POLYMER; Body Depth: .2 inch;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
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12,000 In-Stock
Total price ≈ $80,197.29
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