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551-90-022-05-001005

Mill-max Mfg

551-90-022-05-001005 by Mill-max Mfg

Mill-max Mfg 551-90-022-05-001005 is a PGA22 IC socket with 22 contacts. It features TIN LEAD (200) mating finish and Tin/Lead termination with Nickel barrier. Made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER, it's ideal for Chip Carrier applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,009 parts In-Stock

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VNN

France . 3,623 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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200

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AZTECH Wire

Italy . 529 parts In-Stock

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$15.671

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Semicontronic

India . 366 parts In-Stock

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$19.000

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$18.525

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$18.430

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366

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Ampacity Inc.

Singapore . 1,290 parts In-Stock

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$31.000

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Continental Prestige Electronics

USA . 3,667 parts In-Stock

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Argo Parts USA

USA . 2,566 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,246 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Elevate your electronic projects with the 551-90-022-05-001005 by Mill-max Mfg. Crafted with precision and quality, this Chip Carrier IC & Component Socket is designed to enhance the performance of your PGA22 devices. With its durable housing material and reliable contact finish, this IC Socket offers unmatched reliability and longevity. Trust in Mill-max Mfg's expertise and innovation to deliver superior connectivity solutions for your applications. Upgrade your projects today with the 551-90-022-05-001005 and experience the difference in quality and performance.

Feature Benefit Bullets

Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER

This housing material provides durability and good thermal properties, making it suitable for high-performance applications.

Device Type Used On: PGA22

Designed specifically for PGA22 devices, ensuring compatibility and a secure fit.

No. of Contacts: 22

Provides a sufficient number of contacts for connecting the device, allowing for reliable data transmission.

Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (150)

The tin lead finish with nickel overlay ensures a low contact resistance and reliable connection during mating.

Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

The tin/lead termination with nickel barrier provides a stable termination point for the contacts, reducing the risk of signal interference.

IC Socket Type: IC SOCKET

Specifically designed for IC sockets, allowing for easy insertion and removal of the device while maintaining a secure connection.

Technical Specifications

Chip Carrier IC & Component Sockets 551-90-022-05-001005 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

22

Contact Finish - Mating:

Tin Lead (200) over Nickel (150)

Contact Finish - Termination:

Tin / Lead with Nickel Barrier

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e0

Compatibility

Compatible Device Type:

Additional Features

Special Features:

PGA Socket

Trade Compliance

551-90-022-05-001005 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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