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551-90-012-05-001005

Mill-max Mfg

551-90-012-05-001005 by Mill-max Mfg

Mill-max Mfg's 551-90-012-05-001005 is a Chip Carrier IC Socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. Designed for PGA12 devices, it features 12 Tin/Lead (Sn/Pb) contacts with Nickel (Ni) barrier finish. Ideal for electronic applications requiring reliable socket connections.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,297 parts In-Stock

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VNN

France . 4,448 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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AZTECH Wire

Italy . 808 parts In-Stock

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$15.564

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Semicontronic

India . 1,272 parts In-Stock

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$41.000

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$39.975

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$39.770

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Ampacity Inc.

Singapore . 503 parts In-Stock

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$48.000

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Continental Prestige Electronics

USA . 5,618 parts In-Stock

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Argo Parts USA

USA . 776 parts In-Stock

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Aztec Data Supply Inc.

USA . 517 parts In-Stock

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Overview

Experience the unmatched quality and reliability of Mill-max Mfg with the 551-90-012-05-001005 Chip Carrier IC & Component Socket. This innovative product, made with high-quality materials like POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts, is perfect for use on PGA12 devices. With its durable construction and superior performance, this IC socket offers exceptional value and benefits to customers in various applications. Trust Mill-max Mfg for all your socket needs and elevate your projects to the next level.

Feature Benefit Bullets

Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER

Provides excellent durability and heat resistance, making it a reliable choice for long-term use.

Device Type Used On: PGA12

Specifically designed for PGA12 devices, ensuring a secure and precise fit for optimal performance.

Contact Material: BRASS

Brass contacts offer superior conductivity and corrosion resistance, enhancing the overall reliability of the component socket.

No. of Contacts: 12

With 12 contacts, this socket can accommodate a wide range of devices, making it versatile and adaptable for various applications.

Contact Finish (Termination): Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier

The tin/lead finish with nickel barrier provides excellent solderability and prevents oxidation, ensuring a stable connection for optimal functionality.

IC Socket Type: IC SOCKET

This socket is specifically designed for IC devices, providing a secure and reliable connection for seamless data transmission.

Technical Specifications

Chip Carrier IC & Component Sockets 551-90-012-05-001005 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg

Connectivity

Number of Positions or Pins:

12

Contact Finish - Termination:

Tin / Lead with Nickel Barrier

Contact Material:

Brass

Physical Characteristics

IC Socket Type:

JESD-609 Code:

e0

Compatibility

Compatible Device Type:

Additional Features

Special Features:

PGA Socket

Trade Compliance

551-90-012-05-001005 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8536.90.40.00

SB

8536.90.40.00

Manufacturer Highlights

Mill-max Mfg

Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.

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