Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Aries Electronics 40-6552-11 is a DIP42 IC socket with 40 contacts made of beryllium copper. The housing material is polyphenylene sulfide, and the contact finish includes gold over nickel. Ideal for chip carrier applications requiring reliable connections in electronic devices.
Median Price
$24.140
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
Nova Conductors
1+ parts
100+ parts
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1k+ parts
10k+ parts
Vyrian
AZTECH Wire
$5.097
Continental Prestige Electronics
$23.657
Netroflash
Aztec Data Supply Inc.
Argo Parts USA
POLYPHENYLENE SULFIDE - Provides excellent strength and heat resistance, making it a durable choice for electronic applications.
DIP42 - Ensures compatibility with DIP42 devices, allowing for easy integration into existing systems.
BERYLLIUM COPPER - Offers high conductivity and corrosion resistance, ensuring reliable electrical connections.
40 - Provides ample connectivity options for a wide range of components and devices.
GOLD (10) OVER NICKEL (50) - Offers superior conductivity and durability for optimal performance during mating cycles.
Gold (Au) - with Nickel (Ni) barrier - Enhances durability and prevents corrosion for long-lasting use.
IC SOCKET - Provides a secure and stable connection for integrated circuits, ensuring reliable performance.
Chip Carrier IC & Component Sockets 40-6552-11 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Aries Electronics
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
Contact Material:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
Special Features:
40-6552-11 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Aries Electronics, incorporated in 1972, began when the late William “Bill” Sinclair purchased the back panel line from Thomas & Betts Corporation. The line included IC sockets, headers, and printed circuit cards. Under Bill’s vision, Aries expanded the line to encompass a wide variety of packaging products, including sockets, headers and covers, programmable devices and a variety of jumper and cable assemblies. Aries has become established in the industry as a major source for unique connector products that solve a wide variety of packaging problems. Aries is the recognized industry leader in ZIF (Zero-Insertion-Force) Test Sockets for DIP, PGA, PLCC, and SOIC devices, and continues to be a leading source for a wide variety of specialty electronic connectors. In recent years, the company has made major inroads in the market for high-temperature sockets and flexible cable products. The addition of the Correct-A-Chip® product line established the company as a major source for “intelligent connectors” (incorporating other components, both passive and active), adapters (connectors that allow the use of one termination style on a board designed for a different termination style). Most recently, the company has developed and patented several concepts for BGA (ball grid array) and LGA (land grid array) sockets, and has acquired a high-frequency test and burn-in socket line, furthering growth in the test socket market.
C0603C104K5RACTU
KEMET Corporation
KEMET C0603C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V URdc. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
1N4148WS
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Onsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
KYOCERA AVX
1552200253
Molex
WIRE AND CABLE;
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
General Diode
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Panjit International
AT90CAN128-16AUR
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
173-10-320-00-001000
Mill-max Mfg
173-10-320-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP20 devices with 20 contacts. It features GOLD OVER NICKEL contact finish, ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
PTF08A
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
P6B-26P
RELAY SOCKET; Device Type Used On: RELAY; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; No. of Contacts: 6; Additional Features: STANDARDS: CSA; UL;
173-10-308-00-001000
173-10-308-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP8 devices with 8 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for Chip Carrier IC & Component Sockets applications.
214-44-316-01-670800
214-44-316-01-670800 by Mill-max Mfg is a NYLON46 chip carrier IC socket for DIP16 devices with 16 contacts and matte tin finish. It features a rectangular contact configuration, ideal for secure connections in electronic applications like PCBs and integrated circuits.
XR2T-2477-N
IC SOCKET; Manufacturer Series: XR2T; Contact Finish (Mating): GOLD FLASH; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD FLASH;
PY14QN-Y3
RELAY SOCKET;
08-3518-10H
Aries Electronics
Aries Electronics 08-3518-10H is a DIP18 IC socket with 8 brass contacts, gold finish, and solder termination. It has a 7.62mm PCB contact row spacing and rectangular pattern for applications requiring a current rating of 3A at up to 105°C operating temperature.
XR2A-4811-N
IC SOCKET; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
110-93-632-41-001000
Mill-max Mfg's 110-93-632-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing and BERYLLIUM COPPER contacts. Featuring 32 contacts with Tin/Lead finish, it is designed for DIP32 devices. Ideal for applications requiring reliable connections in electronic circuits.
XR2B-2811-N
IC SOCKET; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
5-1437536-2
TE Connectivity
TE Connectivity 5-1437536-2 is a DIP28 IC socket with 28 contacts. It features a PCB contact row spacing of 15.24mm, rectangular contact pattern, and polyester housing material. Suitable for applications requiring a current rating of 3A, it has solder termination and operates b/w -55°C to 125°C.
8452-11B1-RK-TP
3m Electronic Products Division
8452-11B1-RK-TP by 3M is a PLCC52 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. Featuring 52 contacts made of PHOSPHOR BRONZE, it has a temperature range from -40°C to 105°C. Ideal for applications requiring high insulation resistance and reliable solder termination.
110-87-624-41-001101
Preci-dip Sa
110-87-624-41-001101 by Preci-dip Sa is a DIP24 IC socket with 24 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications.
XR2T-2011-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD;
22-3
Grayhill
TRANSISTOR SOCKET; Housing Material: PLASTIC; Contact Finish (Mating): GOLD; No. of Contacts: 4; Manufacturer Series: 22; JESD-609 Code: e4;
540-88-044-17-400
540-88-044-17-400 by Preci-dip Sa is a PLCC44 IC socket with 44 contacts, rated for 1A current. It features bellowed type contact style, tin finish, and glass-filled polyethylene housing material. This chip carrier socket has a mating pitch of 0.05", operates b/w -55°C to 125°C, and offers high insulation resistance suitable for surface mount applications.
540-88-032-17-400-2
540-88-032-17-400-2 by Preci-dip Sa is a PLCC32 IC socket with PPS thermoplastic housing. It features 32 contacts with tin finish for mating and termination. Ideal for chip carrier IC applications, providing reliable connectivity in electronic devices.
ICA-628-STT
Samtec
Samtec's ICA-628-STT is a DIP28 IC socket with 28 contacts, 15.24mm PCB row spacing, and rectangular contact pattern. It features polyester housing material, solder termination, and Tin finish for mating contacts. Ideal for applications requiring a current rating of 1A, operating temperatures from -65 to 125 °C, and dielectric voltage withstand of 1000VAC.
299-43-314-10-001000
The Mill-max Mfg 299-43-314-10-001000 is a plastic chip carrier IC socket with a DIP14 device type. It has a mating contact pitch of 0.1 inch and can handle a current rating of 3A. This IC socket is commonly used for right angle mounting in various electronic applications.
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40-6554-10
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: BELLOWED TYPE; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYPHENYLENE SULFIDE;
40-6508-311
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED NYLON46; Body Length: 2 inch;
40-6552-18
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYETHERETHERKETONE;
40-6571-11
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYPHENYLENE SULFIDE;
40-6572-11
40-6574-10
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: SQ PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYPHENYLENE SULFIDE;
40-6574-11
40-6575-11
40-6513-11
IC SOCKET; Device Type Used On: DIP42; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Terminal Pitch (mm): 2.54;
40-6518-111H
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Body Length: 2 inch;
40-6518-111T
IC SOCKET; Device Type Used On: DIP40; Housing Material: NYLON46; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10) OVER NICKEL (50); No. of Contacts: 40;
40-6518-112H
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; No. of Contacts: 40;
40-6518-11H
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Rating (Current): 3 A;
40-6518-11T
IC SOCKET; Device Type Used On: DIP40; Housing Material: NYLON46; JESD-609 Code: e4; Contact Finish (Mating): GOLD (10) OVER NICKEL (50); Additional Features: STANDARD: UL 94V-0;
40-6518-11
IC SOCKET; Device Type Used On: DIP40; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: NYLON46; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier;
40-6551-10
IC SOCKET; Device Type Used On: DIP42; Housing Material: POLYPHENYLENE SULFIDE; Additional Features: STANDARD: UL 94V-0; JESD-609 Code: e3; Contact Material: BERYLLIUM COPPER;
40-6551-11
IC SOCKET; Device Type Used On: DIP42; Housing Material: POLYPHENYLENE SULFIDE; JESD-609 Code: e4; Additional Features: STANDARD: UL 94V-0; Contact Finish (Mating): GOLD (10) OVER NICKEL (50);
40-6553-11
IC SOCKET; Device Type Used On: DIP42; Housing Material: POLYPHENYLENE SULFIDE; Contact Material: BERYLLIUM COPPER; Additional Features: STANDARD: UL 94V-0; JESD-609 Code: e4;
40-6554-11
40-6551-10TL
IC SOCKET; Device Type Used On: DIP42; Housing Material: POLYPHENYLENE SULFIDE; Contact Finish (Mating): TIN LEAD (200) OVER NICKEL (50); Contact Material: BERYLLIUM COPPER; Additional Features: STANDARD: UL 94V-0;
Supply Digital Components
$106.00
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12,000 In-Stock
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