Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity 1-1437535-2 is a DIP8 IC SOCKET with 8 contacts, rated at 3A current. It has a PCB contact row spacing of 7.62mm and uses gold termination for soldering. Ideal for applications requiring a chip carrier socket with insulation resistance of 5G ohm and operating temperatures from -55 to 125°C.
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Assy Fe
The close proximity of the PCB contact rows allows for efficient and reliable connectivity.
Polyester is a durable material that provides good protection for the components inside.
Designed specifically for DIP8 devices, ensuring a proper fit and secure connection.
Capable of operating in very low-temperature environments, making it suitable for a variety of applications.
Solder termination ensures a strong and reliable connection between the socket and the PCB.
The close pitch allows for precise alignment and connection with mating components.
Compact body length allows for space-saving installation on a PCB.
Sufficient number of contacts to accommodate DIP8 devices.
High insulation resistance ensures minimal leakage and interference in the circuit.
Straight mounting style simplifies installation and ensures a secure fit on the PCB.
Capable of handling a current rating of 3 A, making it suitable for a variety of applications.
Gold contact finish ensures excellent conductivity and resistance to corrosion.
Shallow body depth allows for compact and space-saving installation on a PCB.
Specifically designed as an IC socket, providing a secure and reliable connection for DIP8 devices.
Capable of operating in high-temperature environments, ensuring reliable performance under varying conditions.
Standard terminal pitch allows for compatibility with a wide range of components and PCB layouts.
Chip Carrier IC & Component Sockets 1-1437535-2 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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Mounting Style:
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Housing Material:
Length:
Depth:
JESD-609 Code:
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1-1437535-2 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
CRCW04020000Z0EDHP
Vishay Intertechnology
Vishay Intertechnology's CRCW04020000Z0EDHP is a 0402 SMT resistor with 0 ohm resistance, rated for temperatures from -55°C to 155°C. Ideal for jumper applications in automotive electronics due to AEC-Q200 compliance and compact size of 1mm x 0.5mm x 0.3mm.
DP83848IVVX/NOPB
National Semiconductor
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
2N7002
Calogic
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): NOT SPECIFIED; Terminal Position: DUAL;
SS14
Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
LM2931AZ-5.0RPG
Onsemi
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
LM358DT
STMicroelectronics
LM358DT by STMicroelectronics is a dual operational amplifier with a max input offset voltage of 9000 uV. It operates at a nominal voltage of 5V and has a min voltage gain of 25000. This amplifier is commonly used in applications requiring high precision and low power consumption.
Vishay Semiconductors
IRLML6402TRPBF
Infineon Technologies
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; No. of Elements: 8; Minimum DC Current Gain (hFE): 1000;
ULN-2803A
Sprague Electric
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
LM358MX
Fairchild Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
1N4148
Kec
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Non Repetitive Peak Forward Current: 2 A; Config: SINGLE; Maximum Operating Temperature: 200 Cel;
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Output Current-1: 1.5 A; No. of Outputs: 1; Qualification Status: Not Qualified;
MMBT3906LT1G
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
2N7002DWH6327XTSA1
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
2271015
Phoenix Contact
RELAY SOCKET; Device Type Used On: SIP1; Housing Material: POLYAMIDE; No. of Contacts: 1; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
PY08-Y3
Omron
RELAY SOCKET;
214-44-314-01-670799
Mill-max Mfg
214-44-314-01-670799 by Mill-max Mfg is a NYLON46 chip carrier IC socket with 14 contacts, TIN finish. It is designed for DIP14 devices, featuring a rectangular contact configuration. Ideal for electronic applications requiring reliable and durable connections in integrated circuits.
XR2A-4815
IC SOCKET; Manufacturer Series: XR2;
HLT-1910-T-H
Samtec
Samtec's HLT-1910-T-H is a 190-contact IC socket with brass contacts and plastic housing. It is designed for use on PGA190 devices, featuring Tin over Nickel mating finish and Tin with Nickel termination. Ideal for chip carrier applications requiring reliable connectivity in electronic systems.
2-640359-4
TE Connectivity
TE Connectivity's 2-640359-4 is a Chip Carrier IC Socket with 18 contacts, made of Phosphor Bronze with Gold finish. It has a PCB contact row spacing of 7.62mm and operates b/w -55°C to 125°C. Ideal for DIP18 devices, it features a rectangular contact pattern and glass-filled polyethylene housing material.
XR2A-2002
IC SOCKET; Manufacturer Series: XR2A; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER;
508-AG11D-ES
TE Connectivity's 508-AG11D-ES is a DIP8 IC socket with 7.62mm PCB contact row spacing and rectangular pattern. It features solder termination, 0.1" mating contact pitch, and can withstand temperatures from -55 to 125°C. Ideal for applications requiring a reliable chip carrier socket with 8 contacts.
XR2A-2011-N
IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
XR2A-6405
XR2A-2421-N
IC SOCKET; Contact Finish (Mating): GOLD FLASH; Contact Finish (Termination): GOLD FLASH; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2A;
8501NR51
Schneider Electric Sa
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
27E122
TE Connectivity's 27E122 is a Chip Carrier IC Socket with GLASS FILLED POLYESTER housing. It features 8 RND PIN-SKT contacts and SCREW termination, suitable for RELAY devices. With dimensions of 2.385" x 1.296" x 0.925", it is ideal for IC SOCKET applications.
ICF-328-T-O-TR
Samtec's ICF-328-T-O-TR is a Chip Carrier IC Socket with 28 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It utilizes liquid crystal polymer housing material and has a mating contact pitch of 0.1 inch. Ideal for DIP28 devices, it offers surface mount termination and operates b/w -55°C to 125°C.
MT78740
IC SOCKET; Housing Material: POLYAMIDE; No. of Contacts: 3; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
3-822472-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: PLCC32; Housing Material: PLASTIC; Manufacturer Series: 822472; Contact Material: PHOSPHOR BRONZE; Contact Finish (Mating): TIN LEAD;
XR2D-4001-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); Contact Material: BERYLLIUM COPPER;
P7SA-10F
Omron's P7SA-10F chip carrier IC socket is designed for relay devices, with 10 contacts and a current rating of 6A. Featuring screw termination, it has a wide operating temperature range (-40 to 85°C) and high insulation resistance (1G ohm). Ideal for relay applications requiring reliable connections in harsh environments.
2833589
P6DS-04P
RELAY SOCKET; Contact Finish (Termination): NOT SPECIFIED; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
1-1437504-9
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Additional Features: LOW PROFILE, STANDARD: UL 94V-0; Maximum Operating Temperature: 125 Cel; Minimum Operating Temperature: -55 Cel;
1-1437539-7
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
1-1437504-4
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Rating (Current): 3 A; Termination Type: SOLDER; No. of Contacts: 3;
1-1437508-6
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Rating (Current): 3 A; Termination Type: SOLDER;
1-1437539-6
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
1-1437508-3
TRANSISTOR SOCKET; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT APPLICABLE;
1-1437537-8
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
1-1437539-0
1-1437531-7
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Housing Material: POLYESTER; Additional Features: STANDARD: UL 94V-0; Body Depth: .18 inch;
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