Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TE Connectivity 1-1437504-9 is a FLUOROPOLYMER Chip Carrier IC Socket for TO-5 devices. With 3 solder contacts, it supports up to 3A current rating. Operating b/w -55°C to 125°C, it's ideal for high-temp applications in various industries.
Median Price
$12.606
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3
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Nova Conductors
1+ parts
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VNN
Vyrian
Continental Prestige Electronics
$12.354
Bastille Electronics
$12.610
$11.980
$11.223
Perfect Parts
Argo Parts USA
Glotronic Ltd.
Assy Fe
FLUOROPOLYMER material provides excellent chemical resistance and high temperature stability, ensuring the longevity and reliability of the chip carrier socket.
Compatible with TO-5 devices, offering a secure and precise fit for optimal performance.
Capable of functioning in very low temperatures, making it suitable for a wide range of applications even in extreme environments.
SOLDER termination type ensures a strong and reliable connection for efficient signal transmission.
3 contacts provide the necessary connectivity for the specific IC or component while keeping the design compact and efficient.
With a current rating of 3 A, this chip carrier socket can handle moderate power requirements without any issues.
Dedicated IC SOCKET type ensures compatibility with various integrated circuits, enhancing the versatility of the product.
Can operate safely at high temperatures, allowing for stable performance even in demanding thermal conditions.
Chip Carrier IC & Component Sockets 1-1437504-9 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from TE Connectivity
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Installation Type:
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Special Features:
1-1437504-9 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
TE Connectivity is a global leader in the design and production of innovative connectors and sensors for multiple industries, such as automotive, industrial equipment, data communication systems, aerospace, defense, medical, oil and gas, consumer electronics and energy. It is an American-Swiss domiciled firm that has been providing high-quality products to its customers since 1907.
CEO
Terrence R. Curtin
Executive VP, CFO
Heath A. Mitts
Senior VP, Principal Accounting Officer
Robert J. Ott
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CM
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STMicroelectronics
Vishay Sprague
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
MBRS130LT3G
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
1N4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM555CMX
CSNF651
Honeywell Sensing And Control
CSNF651 by Honeywell Sensing And Control is an industrial-grade analog circuit with 3 terminals. It operates b/w -40 to 85°C, supporting supply voltages from -15V to 15V. Ideal for applications requiring a special shape rectangular package style and through-hole terminal form.
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
LM358AN
NXP Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N7002
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
PLCC-068-T-N
Samtec
The Samtec PLCC-068-T-N is a Chip Carrier IC Socket with 68 contacts, made of Liquid Crystal Polymer. It has a contact finish of Matte Tin over Nickel and operates b/w -55°C to 105°C. Ideal for PLCC68 devices, it features surface mount termination and bellowed type contact style.
4593
Keystone Electronics
TRANSISTOR SOCKET; Manufacturer Series: 4593;
P2RF-08
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
XR2A-2011-N
IC SOCKET; Device Type Used On: DIP20; No. of Contacts: 20; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
10140369-201LF
Amphenol Communications Solutions
Amphenol's 10140369-201LF is a Chip Carrier IC Socket with 225 contacts, featuring a rectangular contact pattern and surface mount termination. With a PCB contact row spacing of 0.99mm, it is designed for BGA225 devices. This IC socket has a mating contact pitch of 0.039" and is ideal for straight mounting applications.
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
HLT-1712-T-R
HLT-1712-T-R by Samtec is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has a contact finish of tin over nickel (50). This IC socket is ideal for applications requiring reliable and secure connections.
342-10-142-00-591000
Mill-max Mfg
Mill-max Mfg 342-10-142-00-591000 is a POLYETHYLENE IC SOCKET for SIP42 devices with 42 contacts. Features GOLD OVER NICKEL finish, RECTANGLE contact config. Ideal for Chip Carrier IC & Component Sockets applications.
1860991-1
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; No. of Contacts: 8; Termination Type: SOLDER; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
MT78755
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SOLDER; Contact Material: NOT SPECIFIED;
304-13-142-41-770000
The Mill-max Mfg 304-13-142-41-770000 is a POLYETHYLENE chip carrier IC socket for SIP42 devices with 42 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact configuration, and is ideal for electronic applications requiring reliable connections.
110-87-308-41-001101
Preci-dip Sa
110-87-308-41-001101 by Preci-dip Sa is a DIP8 IC socket with 7.62mm PCB contact row spacing and Beryllium Copper contacts. It features a housing made of Polycyclohexydimethylene Terephthalate-Polyester, gold flash mating contact finish, and can withstand temperatures from -55 to 125 °C. Ideal for applications requiring reliable connections in electronic devices.
5401
Pomona Electronics
IC SOCKET; Device Type Used On: PLCC68; Housing Material: GLASS FILLED POLYAMIDE; Additional Features: PLCC ADAPTER; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
XR2A-2465
IC SOCKET; Manufacturer Series: XR2;
1-2199300-2
TE Connectivity 1-2199300-2 is a DIP32 IC SOCKET with 32 contacts, PCB spacing of 15.24mm, and housing made of POLYESTER. It has a current rating of 1A, operates b/w -40 to 105 °C, and uses SOLDER termination. Ideal for applications requiring chip carrier sockets with bellowed contact style.
PT14QN
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
415-13-228-41-003000
The Mill-max Mfg 415-13-228-41-003000 is a POLYETHYLENE IC SOCKET for SIP28 devices with 28 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is ideal for Chip Carrier IC & Component Sockets applications.
16-350000-11-RC
Aries Electronics
IC SOCKET; Device Type Used On: SOIC16-DIP16; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD OVER NICKEL; Additional Features: SOCKET ADAPTER; No. of Contacts: 16;
XR2D-2404
IC SOCKET; Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): GOLD (30);
ICF-316-T-O-TR
Samtec's ICF-316-T-O-TR is a chip carrier socket with 16 contacts, rectangular pattern, and liquid crystal polymer housing. It has a contact pitch of 0.1", suitable for DIP16 devices. With operating temperatures from -55°C to 125°C, it is ideal for surface mount applications in electronics.
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1-1437539-7
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: POLYESTER;
1-1437504-4
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Rating (Current): 3 A; Termination Type: SOLDER; No. of Contacts: 3;
1-1437535-2
IC SOCKET; Device Type Used On: DIP8; Mounting Style: STRAIGHT; Housing Material: POLYESTER; Body Length: .4 inch; Contact Finish (Mating): NOT APPLICABLE;
1-1437508-6
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Minimum Operating Temperature: -55 Cel; Rating (Current): 3 A; Termination Type: SOLDER;
1-1437539-6
IC SOCKET; Device Type Used On: DIP14; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: POLYESTER;
1-1437508-3
TRANSISTOR SOCKET; Contact Material: NOT SPECIFIED; No. of Contacts: 8; Contact Finish (Mating): NOT APPLICABLE;
1-1437508-5
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; No. of Contacts: 10; Termination Type: SOLDER; Contact Finish (Mating): NOT SPECIFIED;
1-1437508-4
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Rating (Current): 3 A; Termination Type: SOLDER; Contact Material: NOT APPLICABLE;
1-1437504-7
IC SOCKET; Device Type Used On: TO-5; Housing Material: FLUOROPOLYMER; Contact Material: NOT APPLICABLE; No. of Contacts: 4; Contact Finish (Mating): NOT SPECIFIED;
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