Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SS-104-TT-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, BE-CU contact material, and SN mating finish. It has a rectangular PCB contact pattern and glass-filled polyester housing. Ideal for SIP4 devices, it operates b/w -65°C to 125°C, making it suitable for various electronic applications.
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The rectangular contact pattern allows for a secure connection on the PCB, ensuring reliability.
The use of glass filled polyester housing material provides durability and resistance to high temperatures.
Designed for use with SIP4 devices, ensuring compatibility and seamless integration.
With a minimum operating temperature of -65°C, this socket is suitable for a wide range of applications, including extreme environments.
The solder termination type makes for easy installation and a strong connection.
The 0.1 inch mating contact pitch allows for precise alignment and connection with other components.
With a body length of 0.4 inch, this socket is compact and space-saving.
The use of beryllium copper contact material ensures high conductivity and durability.
With 4 contacts, this socket is suitable for a variety of applications requiring multiple connections.
The tin contact finish provides a reliable mating surface for optimal performance.
The straight mounting style allows for easy installation and alignment on the PCB.
The round pin socket contact style ensures a secure and stable connection.
With a current rating of 1A, this socket is suitable for low power applications.
The 0.1 inch body width ensures a compact design for tight spaces.
The tin finish with nickel barrier termination ensures a durable and reliable connection.
The 0.175 inch body depth provides ample space for components while maintaining a compact size.
This IC socket type is versatile and compatible with a wide range of integrated circuits.
The rectangular contact configuration allows for a secure and reliable connection.
With a maximum operating temperature of 125°C, this socket can withstand high temperatures without compromising performance.
The 2.54mm terminal pitch allows for easy alignment and connection with other components.
Chip Carrier IC & Component Sockets SS-104-TT-2-N attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
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SS-104-TT-2-N Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
2N2222A
Semiconductor Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
FDC5614P
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
ROHM
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Diodes Incorporated
LM317TG
Texas Instruments
LM317TG by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max output current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount, with a rectangular shape and through-hole terminals for easy installation.
LM358M
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Hy Electronic
Fairchild Semiconductor
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Cobham Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 100; Maximum Turn Off Time (toff): 300 ns;
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
BSS138-7-F
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
1N4148WS
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
D2828-42
Harwin Plc
Harwin PLC's D2828-42 is a plastic IC socket with 28 contacts, rated for 1A current. It has a dielectric voltage of 1400VAC and operates b/w -55°C to 125°C. Ideal for DIP28 devices, it features solder termination and round pin sockets, suitable for various electronic applications.
XR2A-0802
Omron
IC SOCKET; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD;
316-43-144-41-008000
Mill-max Mfg
The Mill-max Mfg 316-43-144-41-008000 is a PLASTIC IC SOCKET for SIP44 devices with 44 contacts and TIN finish. It features RECTANGLE contact configuration, ideal for Chip Carrier IC & Component Sockets applications.
SR3P-05
Idec
Idec's SR3P-05 chip carrier IC socket has 11 RND PIN-SKT contacts, rated for 10A current. With a temperature range of -5 to 40°C, it is ideal for relay applications requiring secure screw terminations. Measuring 2.165" x 1.654" x 1.122", this RELAY SOCKET offers reliable connectivity in various electronic devices.
XR2A-0815
IC SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
D2816-42
The Harwin PLC D2816-42 is a Chip Carrier IC Socket with 16 contacts, rated for 1A current. It has a plastic housing and solder termination, suitable for DIP16 devices. With a temperature range of -55 to 125°C, it offers high insulation resistance and dielectric voltage withstand capability of 1400VAC, making it ideal for various electronic applications.
214-44-314-01-670800
214-44-314-01-670800 by Mill-max Mfg is a Chip Carrier IC Socket with NYLON46 housing. It features 14 contacts with MATTE TIN OVER NICKEL finish, designed for DIP14 devices. Ideal for applications requiring rectangular contact configuration in electronic assemblies.
PR1-BSP3/2X21
Phoenix Contact
RELAY SOCKET;
RIF-2-BSC/4X21/EX
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
540-44-032-17-400004
IC SOCKET; Device Type Used On: PLCC32; Housing Material: POLYPHENYLENE SULFIDE; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; Contact Finish (Termination): MATTE TIN;
08-3518-10M
Aries Electronics
The Aries Electronics 08-3518-10M is a chip carrier IC socket with a rectangular PCB contact pattern and a 7.62mm row spacing. It is used for DIP18 devices, has 8 contacts, and can handle a current rating of 3A. Its housing material is nylon46 and it has a max operating temperature of 105°C.
ICA-314-ZSTT
Samtec
Samtec's ICA-314-ZSTT is a DIP14 IC socket with 14 contacts, 7.62mm PCB row spacing, and rectangular contact pattern. It uses beryllium copper alloy for contacts and has a current rating of 1A. Ideal for applications requiring a chip carrier IC socket with solder termination and operating temperatures ranging from -65°C to 125°C.
28-C182-10
28-C182-10 by Aries Electronics is a DIP28 IC socket with 28 contacts, made of brass with gold finish. It has a PCB contact row spacing of 15.24mm and operates b/w -55°C to 105°C. Ideal for applications requiring a chip carrier socket with high insulation resistance and dielectric voltage withstand capability.
XR2T-2473-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Manufacturer Series: XR2T; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
415-13-222-41-001000
Mill-max Mfg 415-13-222-41-001000 is a POLYETHYLENE IC SOCKET for SIP22 devices with 22 GOLD contacts. Its RECTANGLE contact config makes it ideal for Chip Carrier IC & Component Sockets applications.
HLS-1518-T-11
The Samtec HLS-1518-T-11 is a plastic IC socket with 270 gold contacts for PGA270 devices. It offers reliable connectivity and durability, making it ideal for chip carrier applications. With gold contact finish on mating and termination, this socket ensures high performance in electronic assemblies.
1-390261-3
TE Connectivity
TE Connectivity 1-390261-3 is a Chip Carrier IC Socket with 14 contacts, rated at 1A current. It has a PCB contact row spacing of 7.62mm and operates b/w -40°C to 105°C. Ideal for DIP14 devices, it features a rectangular contact pattern and uses solder termination.
ICF-308-T-O
Samtec's ICF-308-T-O is a Chip Carrier IC Socket with 8 contacts, 0.1" pitch, and Liquid Crystal Polymer housing. It is used for DIP8 devices in applications requiring -55 to 125°C operating temperature range and surface mount termination.
153-10-952-00-001000
153-10-952-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP52 devices with 52 contacts. It features GOLD OVER NICKEL contact finish and RECTANGLE contact configuration. Ideal for Chip Carrier IC & Component Sockets applications.
SD-103-G-22-N
SD-103-G-22-N by Samtec is a Chip Carrier IC Socket with 6 contacts, rectangular contact pattern, and body dimensions of 0.3" length, 0.2" width, and 0.175" depth. It has a PCB contact row spacing of 2.54mm and operates b/w -65°C to 125°C, suitable for DIP6 devices with a current rating of 1A.
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SS-104-G-2-N
SS-104-G-2-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. Ideal for SIP4 devices, it operates b/w -65°C to 125°C and has a mating contact pitch of 0.1 inch.
SS-104-G-22-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Length: .4 inch;
SS-104-T-1A-N
SS-104-T-2-L-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Terminal Pitch (mm): 2.54;
SS-104-T-22-L-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; No. of Contacts: 4;
SS-104-T-28-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Width: .1 inch;
SS-104-T-28
SS-104-T-29-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Termination Type: SOLDER;
SS-104-T-38-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Config: RECTANGLE;
SS-104-T-5A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Additional Features: 0.030 PROJECTION ABOVE PCB;
SS-104-T-7-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Minimum Operating Temperature: -65 Cel;
SS-104-TT-1A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Mating Contact Pitch (inch): 0.1;
SS-104-TT-1B-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Material: BE-CU;
SS-104-TT-1C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Body Depth: .193 inch;
SS-104-TT-21A-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; PCB Contact Pattern: RECTANGULAR;
SS-104-TT-21B-N
SS-104-TT-21C-N
IC SOCKET; Device Type Used On: SIP4; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; Contact Finish (Mating): SN;
SS-104-TT-22-N
SS-104-TT-22
SS-104-TT-5
IC SOCKET; Device Type Used On: SIP4; Mounting Style: RIGHT ANGLE; Contact Style: RND PIN-SKT; Housing Material: GLASS FILLED POLYESTER; No. of Contacts: 4;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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