Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Samtec HLS-1204-TT-31 is a POLYETHYLENE chip carrier socket for PGA48 devices with 48 contacts. It features Tin contact finish for mating and Tin (Sn) with Nickel (Ni) barrier for termination. Ideal for IC applications requiring reliable connections in electronic assemblies.
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Advanced Electronics
Polyethylene is a durable and resistant material, which provides good protection for the IC socket components within the chip carrier. It also helps in reducing the risk of damage from external factors.
PGA48 is a widely used device type for chip carriers, ensuring compatibility and ease of integration with various systems and components.
Having 48 contacts allows for a higher level of connectivity and functionality in the chip carrier IC socket, enabling more complex operations and data transfer capabilities.
Tin contact finish ensures good electrical conductivity and reliable connections between the IC socket and mating components, reducing the risk of signal loss or interference.
The tin finish with a nickel barrier provides enhanced durability and corrosion resistance, ensuring long-lasting performance and stability of the connections within the IC socket.
Being a standard IC socket type, it offers ease of use and compatibility with a wide range of integrated circuits, making it a versatile and practical choice for various applications.
Chip Carrier IC & Component Sockets HLS-1204-TT-31 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Samtec
Number of Positions or Pins:
Contact Finish - Mating:
Contact Finish - Termination:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
HLS-1204-TT-31 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.69.40.40
SB
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models. This unique approach allows us to serve customers in 125+ countries with revenues exceeding $1 billion in 2022. We believe that taking care of our customers and our employees is paramount in how we approach our business, and this belief is deeply ingrained throughout Samtec worldwide.
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
1N4148
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
NC7WZ17P6X
BUFFER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 6; Package Code: TSSOP; Package Shape: RECTANGULAR;
STM8S003F3P6TR
STMicroelectronics
STM8S003F3P6TR by STMicroelectronics is an 8-bit microcontroller with a max clock frequency of 16 MHz. It features 1024 RAM bytes, 128 data EEPROM size, and 5-ch 10-bit ADC channels. Ideal for industrial applications requiring low power mode and connectivity via I2C, SPI, and UART interfaces.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
DP83848IVVX/NOPB
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
SMBJ18CA
Mde Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Intersil
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
27E419
TE Connectivity
IC SOCKET; Housing Material: NYLON; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
299-43-310-10-001000
Mill-max Mfg
Mill-max Mfg's 299-43-310-10-001000 is a PCT POLYESTER IC SOCKET for DIP10 devices with 10 contacts. It features MATTE TIN OVER NICKEL finish, RECTANGLE contact config, ideal for Chip Carrier IC & Component Sockets applications.
HLS-1219-T-15
Samtec
The Samtec HLS-1219-T-15 is a POLYETHYLENE chip carrier socket with 228 contacts, featuring GOLD finish for mating and termination. Designed for use on PGA228 devices, this IC SOCKET is ideal for high-performance applications requiring reliable connections.
150-10-640-00-018101
Preci-dip Sa
150-10-640-00-018101 by Preci-dip Sa is a DIP40 IC socket with POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER housing and BRASS contacts. It features 40 gold-plated contacts for superior connectivity. Ideal for chip carrier applications requiring reliable connections in electronic devices.
HLS-1902-S-22-L
Samtec's HLS-1902-S-22-L is a POLYETHYLENE chip carrier IC socket with 38 contacts, GOLD finish for mating and termination. Designed for DIP38 devices, it offers reliable connectivity in various electronic applications.
ICF-324-F-O
Samtec's ICF-324-F-O is a Chip Carrier IC Socket with 24 contacts, 0.1" pitch, and gold flash over nickel finish. It has a body size of 1.2"x0.375"x0.18" and operates b/w -55°C to 125°C. Ideal for DIP24 devices in applications requiring high insulation resistance and dielectric voltage withstand capabilities.
8420-21B1-RK-TP
3m Electronic Products Division
8420-21B1-RK-TP by 3M Electronic Products Division is a PLCC20 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 20 contacts made of PHOSPHOR BRONZE with MATTE TIN finish over NICKEL. Operating temperature ranges from -40°C to 105°C, ideal for chip carrier applications.
342-90-139-00-592000
Mill-max Mfg's 342-90-139-00-592000 is a POLYETHYLENE Chip Carrier IC Socket with 39 contacts, TIN LEAD (200) mating finish, and Tin/Lead termination. It is designed for SIP39 devices and features a RECTANGLE contact configuration.
PT11QN
Omron
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; No. of Contacts: 11; Contact Material: NOT APPLICABLE;
ICF-320-T-O-TR
Samtec's ICF-320-T-O-TR is a Chip Carrier IC Socket with 20 contacts, rated at 1A current. It features a rectangular contact pattern, liquid crystal polymer housing material, and surface mount termination type. Ideal for DIP20 devices, it has a mating contact pitch of 0.1 inches and operates b/w -55°C to 125°C.
XR2D-1401-N
IC SOCKET; Contact Finish (Mating): GOLD (30); Contact Finish (Termination): Gold (Au); JESD-609 Code: e4; Contact Material: BERYLLIUM COPPER;
1-390261-6
TE Connectivity 1-390261-6 is a DIP20 IC SOCKET with 20 contacts, rated at 1A current. It features a PCB contact row spacing of 7.62mm and rectangular contact pattern for solder termination. Suitable for applications requiring a mating contact pitch of 0.1 inch, it operates b/w -40°C to 105°C temperature range.
27E305
IC SOCKET; Housing Material: NYLON; Termination Type: SOLDER; No. of Contacts: 11; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
940-44-032-24-001000
Mill-max Mfg 940-44-032-24-001000 is a PLCC32 IC socket with GLASS FILLED POLYPHENYLENE SULFIDE housing. It features 32 contacts with Matte Tin (Sn) - Nickel (Ni) finish for mating and termination. Ideal for chip carrier ICs, this socket offers reliable connectivity in electronic applications.
SS-104-G-22-N
SS-104-G-22-N by Samtec is a Chip Carrier IC Socket with 4 contacts, rated at 1A current. It features a rectangular PCB contact pattern, glass-filled polyester housing material, and gold finish with nickel barrier. This socket is used on SIP4 devices and operates b/w -65°C to 125°C, making it ideal for various electronic applications.
110-87-632-41-001101
110-87-632-41-001101 by Preci-dip Sa is a DIP32 IC socket with 32 contacts, rated for 1A current. It features Beryllium Copper contact material with Gold Flash finish and Polycyclohexydimethylene Terephthalate-Polyester housing. With a PCB contact row spacing of 15.24mm, it operates b/w -55°C to 125°C, making it ideal for various electronic applications requiring reliable connections.
342-10-139-00-593000
Mill-max Mfg's 342-10-139-00-593000 is a POLYETHYLENE IC SOCKET for SIP39 devices with 39 GOLD OVER NICKEL contacts. Ideal for Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
60431011
Delphi Connection Systems
RELAY SOCKET; Housing Material: POLYBUTYLENE TEREPHTHALATE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Additional Features: POLARIZED;
828-AG11D-ESL
Abb Installation Products
IC SOCKET; Device Type Used On: DIP28; Mounting Style: STRAIGHT; Contact Style: RND PIN-SKT; Housing Material: POLYESTER; Body Depth: .105 inch;
XR2A-1402
IC SOCKET; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; JESD-609 Code: e4;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HLS-1217-T-22-L
IC SOCKET; Device Type Used On: PGA204; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au);
HLS-1518-T-11
IC SOCKET; Device Type Used On: PGA270; Housing Material: PLASTIC; Additional Features: LOWPROFILE; No. of Contacts: 270; Contact Finish (Termination): Gold (Au);
HLS-1820-T-22
IC SOCKET; Device Type Used On: PGA360; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED; Contact Finish (Termination): Gold (Au);
IC SOCKET; Device Type Used On: DIP38; Housing Material: POLYETHYLENE; No. of Contacts: 38; Contact Finish (Termination): Gold (Au); Contact Material: NOT SPECIFIED;
IC SOCKET; Device Type Used On: PGA228; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
HLS-1204-T-11
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Finish (Mating): GOLD (30);
HLS-1204-T-22
IC SOCKET; Device Type Used On: PGA48; Housing Material: PLASTIC; Contact Finish (Mating): GOLD (30); JESD-609 Code: e3; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
HLS-1204-T-23
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; No. of Contacts: 48; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier; Contact Material: NOT SPECIFIED;
HLS-1204-T-2
IC SOCKET; Device Type Used On: PGA48; Housing Material: PLASTIC; JESD-609 Code: e3; Contact Finish (Mating): GOLD (30); Contact Material: NOT SPECIFIED;
HLS-1204-T-30
HLS-1204-T-38
IC SOCKET; Device Type Used On: PGA48; Housing Material: POLYETHYLENE; Contact Finish (Mating): GOLD (30); JESD-609 Code: e4; Contact Material: NOT SPECIFIED;
HLS-1204-TT-10
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; JESD-609 Code: e3; Contact Finish (Mating): TIN; Contact Material: NOT SPECIFIED;
HLS-1204-TT-11
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; No. of Contacts: 48; Contact Finish (Termination): Tin (Sn);
HLS-1204-TT-12
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; Additional Features: LOWPROFILE; Contact Finish (Mating): TIN;
HLS-1204-TT-18
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Additional Features: LOWPROFILE; Contact Finish (Termination): Tin (Sn); JESD-609 Code: e3;
HLS-1204-TT-22-L
IC SOCKET; Device Type Used On: PGA48; Housing Material: POLYETHYLENE; JESD-609 Code: e3; No. of Contacts: 48; Contact Finish (Termination): Tin (Sn);
HLS-1204-TT-22
IC SOCKET; Device Type Used On: PGA48; Housing Material: PLASTIC; JESD-609 Code: e3; No. of Contacts: 48; Contact Material: NOT SPECIFIED;
HLS-1204-TT-2
IC SOCKET; Device Type Used On: PGA48; Housing Material: PLASTIC; No. of Contacts: 48; Contact Material: NOT SPECIFIED; Contact Finish (Mating): TIN;
HLS-1204-TT-30
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; JESD-609 Code: e3; No. of Contacts: 48;
HLS-1204-TT-32
IC SOCKET; Device Type Used On: PGA48; Housing Material: THERMOPLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Mating): TIN; Additional Features: LOWPROFILE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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