Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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173-10-304-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP4 devices with 4 contacts. Features GOLD OVER NICKEL contact finish, RECTANGLE configuration. Ideal for Chip Carrier IC & Component Sockets applications.
Median Price
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3
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1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
VNN
Nova Conductors
AZTECH Wire
$18.351
Ampacity Inc.
$45.000
Continental Prestige Electronics
Argo Parts USA
Bastille Electronics
Plastic housing material makes the chip carrier IC socket lightweight and cost-effective.
Designed to be used on DIP4 devices, ensuring compatibility and proper fit.
Having 4 contacts allows for connecting a variety of components in a streamlined manner.
Gold over nickel finish provides excellent conductivity and corrosion resistance for reliable connections.
Specifically designed as an IC socket, ensuring optimal performance for integrated circuits.
Rectangular contact configuration provides a secure and stable connection for the chip in the socket.
Chip Carrier IC & Component Sockets 173-10-304-00-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
173-10-304-00-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
E8WSDC12-32.768KTR
Ecliptek
PARALLEL - FUNDAMENTAL; Mounting Feature: SURFACE MOUNT; Frequency Tolerance: 20 ppm; Aging: 3 PPM/YEAR; Load Capacitance: 12.5 pF; Nominal Operating Frequency: .032768 MHz;
MBRA160T3G
Onsemi
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SS495A-SP
Honeywell Sensing And Control
SS495A-SP by Honeywell is a magnetic field sensor with 10.5V max supply voltage, 3" body width, and 1.5% linearity. Ideal for applications requiring a Hall effect sensor with -40 to 150°C operating temperature range, such as position sensing in automotive or industrial systems.
FT232RL-REEL
FTDI
FTDI's FT232RL-REEL is a bus controller with 28 terminals, operating at 3.3V to 5.25V. It supports USB, VBUS, and UART buses with a data transfer rate of 60MBps. Ideal for industrial applications due to its CMOS technology and compatibility with RS232, RS422, and RS485 standards.
2N7002-7-F
Diodes Incorporated
Diodes Inc. 2N7002-7-F is a N-channel FET with 60V DS breakdown voltage, 0.115A max drain current, and 13.5 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features Gull Wing terminals, small outline package style, and operates up to 150°C.
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
EU2B-YS3203F
Idec
ROTARY SWITCH;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
SS14
Jinan Jingheng Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F407VGT6
STMicroelectronics
STM32F407VGT6 by STMicroelectronics is a 32-bit microcontroller with 2/3.3V power supplies, 196608 bytes RAM, and 16-Ch 12-Bit ADC channels. It is ideal for industrial applications requiring CAN, ETHERNET, I2C(3), SPI(3), UART(2), USB(2) connectivity and features DMA(16) for efficient data transfer. With a max clock frequency of 50 MHz and operating temperature range of -40 to 85 °C, it offers high performance in a compact package style (14mm x 14mm).
1N4148WS
Tak Cheong Electronics Holdings
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Lite-on Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Changzhou Starsea Electronics
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
Won-top Electronics
MBR0520LT1
PY14QN
Omron
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE;
ICF-640-S-O
Samtec
Samtec's ICF-640-S-O is a Chip Carrier IC Socket with 40 contacts, featuring Beryllium Copper pins and Liquid Crystal Polymer housing. It has a contact pitch of 0.1", suitable for DIP40 devices, with operating temperatures ranging from -55 to 125°C. Ideal for surface mount applications in electronics requiring high insulation resistance and dielectric voltage withstand capabilities.
XR2A-4205
IC SOCKET; Manufacturer Series: XR2;
PY14QN-Y3
RELAY SOCKET;
8501NR52B
Schneider Electric Sa
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
MT78745-
TE Connectivity
IC SOCKET; Housing Material: POLYAMIDE; Contact Finish (Mating): NOT SPECIFIED; Termination Type: SCREW; No. of Contacts: 8; Contact Material: NOT SPECIFIED;
PT08-0
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 8; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
1-1437535-2
TE Connectivity 1-1437535-2 is a DIP8 IC SOCKET with 8 contacts, rated at 3A current. It has a PCB contact row spacing of 7.62mm and uses gold termination for soldering. Ideal for applications requiring a chip carrier socket with insulation resistance of 5G ohm and operating temperatures from -55 to 125°C.
PYF14A-E
RELAY SOCKET; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED; No. of Contacts: 4;
PT14QN
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; No. of Contacts: 14; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
HLS-1219-T-15
The Samtec HLS-1219-T-15 is a POLYETHYLENE chip carrier socket with 228 contacts, featuring GOLD finish for mating and termination. Designed for use on PGA228 devices, this IC SOCKET is ideal for high-performance applications requiring reliable connections.
540-88-032-17-400-2
Preci-dip Sa
540-88-032-17-400-2 by Preci-dip Sa is a PLCC32 IC socket with PPS thermoplastic housing. It features 32 contacts with tin finish for mating and termination. Ideal for chip carrier IC applications, providing reliable connectivity in electronic devices.
CQF208-168B
Texas Instruments
IC SOCKET; Device Type Used On: QFP208; Housing Material: GLASS FILLED POLYETHERIMIDE; Manufacturer Series: CQF; No. of Contacts: 208;
XR2T-2001-N
IC SOCKET; JESD-609 Code: e4; Contact Finish (Mating): GOLD (30); Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Manufacturer Series: XR2T;
SH1B-05
RELAY SOCKET; Contact Material: NOT APPLICABLE; Contact Finish (Mating): NOT APPLICABLE;
551-10-081-09-000004
Mill-max Mfg
Mill-max Mfg's 551-10-081-09-000004 is a chip carrier IC & component socket made of POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER. It has 81 contacts with GOLD (10) over NICKEL (150) mating finish and Gold (Au) termination finish. This IC socket is used on PGA81 devices.
SM2S-05C
788-304
Wago
RELAY SOCKET; Contact Material: NOT SPECIFIED; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED;
326-93-108-41-003000
Mill-max Mfg's 326-93-108-41-003000 is a PLASTIC IC SOCKET for SIP8 devices with 8 contacts. Features GOLD (30) OVER NICKEL (100) finish for mating and Tin/Lead termination. Ideal for Chip Carrier IC & Component Sockets applications.
SH3B-05
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
173-10-318-00-001000
IC SOCKET; Device Type Used On: DIP18; Housing Material: PLASTIC; Contact Config: RECTANGLE; No. of Contacts: 18; Contact Finish (Mating): NOT SPECIFIED;
173-10-308-00-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED;
173-10-314-00-001000
Mill-max Mfg's 173-10-314-00-001000 is a plastic chip carrier IC socket with 14 gold over nickel contacts. It is used for DIP14 devices and has a rectangular contact configuration.
173-10-306-00-001000
IC SOCKET; Device Type Used On: DIP6; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
173-10-316-00-001000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-322-00-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
173-10-320-00-001000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-310-00-001000
IC SOCKET; Device Type Used On: DIP10; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-324-00-001000
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
173-10-328-00-001000
The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
173-10-304-00-001
IC SOCKET; Device Type Used On: DIP4; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Config: RECTANGLE; Additional Features: DIP HEADER; JESD-609 Code: e4;
173-10-304-00-001100
IC SOCKET; Device Type Used On: DIP4; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Contact Material: NOT SPECIFIED; Additional Features: SOCKET HEADER; JESD-609 Code: e4;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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