Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Mill-max Mfg's 173-10-306-00-001000 is a plastic IC socket for DIP6 devices with 6 gold over nickel contacts. It features a rectangular contact configuration, suitable for chip carrier IC applications.
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1k+
Vyrian
1+ parts
100+ parts
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VNN
Nova Conductors
AZTECH Wire
$16.619
Ampacity Inc.
$19.000
Continental Prestige Electronics
Argo Parts USA
Robosynatics
Lucentia Tech
Bastille Electronics
PLASTIC is lightweight, durable, and cost-effective, making this chip carrier socket an ideal choice for electronic applications.
Designed to work specifically with DIP6 devices, ensuring compatibility and reliable performance.
Having 6 contacts allows for connectivity with a range of different components, providing versatility in use.
Gold over nickel provides excellent conductivity and corrosion resistance, ensuring a stable connection for your IC.
Being an IC socket type, it allows for easy insertion and removal of the integrated circuit, making maintenance and upgrades hassle-free.
The rectangular contact configuration ensures a secure and stable connection, reducing the risk of signal loss or disconnection.
Chip Carrier IC & Component Sockets 173-10-306-00-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
IC Socket Type:
Housing Material:
JESD-609 Code:
Compatible Device Type:
173-10-306-00-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NUP2105LT1G
Onsemi
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
1N4148
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
2N7002
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
BAV99
Won-top Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
General Instrument
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
Zetex Plc
Rugao Dachang Electronic
RECTIFIER DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 40 V; Maximum Forward Voltage (VF): .55 V; No. of Elements: 1; Technology: SCHOTTKY;
Itt Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
Weitron Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb);
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
110-99-632-41-001000
Mill-max Mfg
Mill-max Mfg's 110-99-632-41-001000 is a Chip Carrier IC Socket with POLYETHYLENE housing, BERYLLIUM COPPER contacts, and 32 rectangular contacts. It is designed for DIP32 devices and features Tin/Lead finish with Nickel barrier. Ideal for electronic applications requiring reliable connections in integrated circuits.
PY14QN-Y1
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Finish (Mating): NOT SPECIFIED; Contact Material: NOT SPECIFIED;
ICF-624-S-I
Samtec
Samtec's ICF-624-S-I is a Chip Carrier IC Socket with 24 contacts, featuring a PCB contact row spacing of 15.24mm and rectangular contact pattern. It uses liquid crystal polymer housing material and has a mating contact pitch of 0.1". Ideal for DIP24 devices, it operates b/w -55°C to 125°C, with termination type as surface mount.
M12883/52-001
Amphenol
RELAY SOCKET; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; Contact Finish (Termination): GOLD; JESD-609 Code: e4; Contact Finish (Mating): GOLD;
HLS-1518-T-11
The Samtec HLS-1518-T-11 is a plastic IC socket with 270 gold contacts for PGA270 devices. It offers reliable connectivity and durability, making it ideal for chip carrier applications. With gold contact finish on mating and termination, this socket ensures high performance in electronic assemblies.
XR2B-2411-N
IC SOCKET; Contact Finish (Mating): GOLD (10); Contact Finish (Termination): GOLD; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2;
RXZE2M114
Schneider Electric Sa
RELAY SOCKET;
2-1571552-3
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP14; Housing Material: PCT PLASTIC POLYESTER; JESD-609 Code: e3; Contact Finish (Termination): TIN OVER NICKEL; Contact Material: BERYLLIUM COPPER;
110-43-628-41-001000
110-43-628-41-001000 by Mill-max Mfg is a Chip Carrier IC Socket with PCT Polyester housing material, 28 contacts, and Matte Tin over Nickel termination. It is designed for use on DIP28 devices, featuring a rectangular contact configuration suitable for various electronic applications.
IC51-0844-401-1
Yamaichi Electronics
Yamaichi Electronics IC51-0844-401-1 is a PLCC84 socket with POLYETHERIMIDE housing, BE-CU contacts, and 1000000000 ohm insulation resistance. It operates b/w -55°C to 170°C, making it ideal for high-temp applications in electronics manufacturing. The socket has 84 contacts with AU ON NI finish and dielectric voltage of 700VAC.
RIF-2-BPT/4X21/EX
Phoenix Contact
RELAY SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE;
1047031
2-1571552-8
TE Connectivity
TE Connectivity's 2-1571552-8 is a DIP24 IC socket with 24 contacts, rated at 3A current. It features a rectangular PCB contact pattern with 15.24mm row spacing and uses thermoplastic polyester housing material. Ideal for applications requiring a mating contact pitch of 0.1 inch, solder termination, and operating temperatures ranging from -55 to 105°C.
ICO-308-NGG
The Samtec ICO-308-NGG is a Chip Carrier IC Socket with 8 contacts, featuring a PCB contact row spacing of 7.62mm and rectangular contact pattern. It uses beryllium copper for contacts, gold finish over nickel for mating, and operates b/w -65°C to 125°C. Ideal for DIP8 devices, it has a current rating of 1A and dielectric voltage withstand of 1000VAC.
HLS-1217-T-22-L
The Samtec HLS-1217-T-22-L is a POLYETHYLENE chip carrier socket with 204 GOLD contacts for PGA204 devices. It features IC SOCKET type and GOLD (Au) contact finish for mating and termination. Ideal for high-performance applications requiring reliable connections in electronic systems.
M12883/45-01
Stpi Group
RELAY SOCKET; Device Type Used On: RELAY; Housing Material: POLYETHERIMIDE; Additional Features: LOW PROFILE; JESD-609 Code: e4; No. of Contacts: 8;
D01-997.3242
Harwin Plc
Sockets and Chip Carriers;
P2CF-11
Omron's P2CF-11 is a 11-contact chip carrier IC socket for relays, featuring screw termination and 5A current rating. With dimensions of 2.76" x 1.97" x 1.23", it offers high insulation resistance (1G ohm) and dielectric voltage withstand (2000VAC), ideal for relay applications requiring secure connections.
416-43-226-41-008000
416-43-226-41-008000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP26 devices with 26 contacts and TIN finish. It is used in Chip Carrier IC & Component Sockets applications due to its RECTANGLE contact configuration.
MVAT-114-NT-13
IC SOCKET; Device Type Used On: PGA114; Contact Finish (Termination): TIN; No. of Contacts: 114; Additional Features: PGA SOCKET; JESD-609 Code: e3;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
173-10-318-00-001000
IC SOCKET; Device Type Used On: DIP18; Housing Material: PLASTIC; Contact Config: RECTANGLE; No. of Contacts: 18; Contact Finish (Mating): NOT SPECIFIED;
173-10-308-00-001000
IC SOCKET; Device Type Used On: DIP8; Housing Material: PLASTIC; JESD-609 Code: e4; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED;
173-10-314-00-001000
Mill-max Mfg's 173-10-314-00-001000 is a plastic chip carrier IC socket with 14 gold over nickel contacts. It is used for DIP14 devices and has a rectangular contact configuration.
173-10-316-00-001000
IC SOCKET; Device Type Used On: DIP16; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-322-00-001000
IC SOCKET; Device Type Used On: DIP22; Housing Material: PLASTIC; Contact Config: RECTANGLE; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e4;
173-10-320-00-001000
IC SOCKET; Device Type Used On: DIP20; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-304-00-001000
IC SOCKET; Device Type Used On: DIP4; Housing Material: PLASTIC; Contact Material: NOT SPECIFIED; JESD-609 Code: e4; Contact Finish (Termination): GOLD OVER NICKEL;
173-10-310-00-001000
IC SOCKET; Device Type Used On: DIP10; Housing Material: PLASTIC; Contact Finish (Mating): NOT SPECIFIED; Contact Finish (Termination): GOLD OVER NICKEL; Contact Config: RECTANGLE;
173-10-324-00-001000
IC SOCKET; Device Type Used On: DIP24; Housing Material: PLASTIC; Contact Finish (Termination): GOLD OVER NICKEL; Contact Finish (Mating): NOT SPECIFIED; Contact Config: RECTANGLE;
173-10-328-00-001000
The Mill-max Mfg 173-10-328-00-001000 is a plastic chip carrier IC socket with 28 gold over nickel contacts. It is designed for use on DIP28 devices and has a rectangular contact configuration. Ideal for electronic applications requiring reliable connections.
173-10-306-00-001
IC SOCKET; Device Type Used On: DIP6; Housing Material: GLASS FILLED POLYETHYLENE POLYESTER; Contact Finish (Termination): Gold (Au) - with Nickel (Ni) barrier; Additional Features: DIP HEADER; Contact Material: NOT SPECIFIED;
173-10-306-00-001100
IC SOCKET; Device Type Used On: DIP6; Housing Material: POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER; Additional Features: SOCKET HEADER; Contact Config: RECTANGLE; JESD-609 Code: e4;
Supply Digital Components
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