Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Mill-max Mfg 299-43-314-10-001000 is a plastic chip carrier IC socket with a DIP14 device type. It has a mating contact pitch of 0.1 inch and can handle a current rating of 3A. This IC socket is commonly used for right angle mounting in various electronic applications.
Median Price
$10.127
Lifecycle Status
Suppliers In-Stock
9
In-Stock Inventory
1k+
Mouser Electronics
1+ parts
$9.350
100+ parts
$6.750
1k+ parts
$5.860
10k+ parts
-
DigiKey
$6.753
$5.741
Arrow
$10.904
$6.662
$5.789
Verical
Nova Conductors
$6.160
VNN
Vyrian
NAC Semi
$13.260
IBS Electronics
$14.460
$14.306
AZTECH Wire
$4.896
Ampacity Inc.
$6.150
Continental Prestige Electronics
$6.037
Netroflash
Semicontronic
$13.380
$13.046
$12.979
Argo Parts USA
Advanced Electronics
Perfect Parts
Aztec Data Supply Inc.
The plastic housing material provides durability and insulation, making it a suitable choice for various applications.
Designed specifically for DIP14 devices, ensuring compatibility and reliable connectivity.
Capable of operating in extremely cold environments, enhancing its versatility and reliability.
The solder termination type facilitates easy and secure installation, ensuring a stable and lasting connection.
The small contact pitch allows for space-efficient circuit designs and compatibility with a wide range of components.
With a compact body length of 0.7 inches, this chip carrier socket is suitable for applications with limited space.
With 14 contacts, this socket allows for the connection of multiple components, enabling complex circuitry.
The high insulation resistance ensures minimal signal loss and prevents interference, promoting optimal performance.
The right angle mounting style enables convenient and flexible PCB layout options, enhancing overall design efficiency.
The round pin socket contact style offers secure and reliable connections, reducing the risk of intermittent connections.
With a current rating of 3 A, this chip carrier socket can handle moderate power requirements, making it suitable for various applications.
The compact body width of 0.4 inches allows for efficient utilization of board space, especially in densely populated circuits.
The high dielectric withstand voltage rating ensures safe operation and protection against electrical breakdown.
The matte tin over nickel contact finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.
With a body depth of 0.52 inches, this socket offers a suitable depth for secure component insertion and compatibility with a variety of devices.
Designed specifically for IC components, this socket promotes easy installation and reliable connectivity.
The rectangular contact configuration allows for efficient soldering and secure connections, ensuring optimal electrical conductivity.
Capable of withstanding high operating temperatures, making it suitable for applications that may experience heat buildup.
Chip Carrier IC & Component Sockets 299-43-314-10-001000 attributes and parameters. Explore more Chip Carrier IC & Component Sockets devices from Mill-max Mfg
Number of Positions or Pins:
Contact Finish - Termination:
Contact Configuration:
Contact Style:
Installation Type:
Mating Contact Pitch:
Mounting Style:
IC Socket Type:
Housing Material:
Length:
Width:
Depth:
JESD-609 Code:
Current Rating:
Dielectric Withstanding Voltage:
Insulation Resistance:
Minimum Operating Temperature:
Maximum Operating Temperature:
Compatible Device Type:
Special Features:
299-43-314-10-001000 Chip Carrier IC & Component Sockets trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8536.90.40.00
SB
Mill-Max Mfg. Corp. is a vertically integrated engineering and manufacturing company capable of producing over 100 million interconnect components a week, making us the largest manufacturer of precision machined interconnect components in North America.
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
MBR130T1G
Onsemi
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
BSS138
Vishay Intertechnology
Vishay Intertechnology's BSS138 is a N-CHANNEL FET with SINGLE configuration and ENHANCEMENT MODE operation. It features 0.35W power dissipation, METAL-OXIDE SEMICONDUCTOR tech, and 150°C max temp. Ideal for surface mount applications in various electronic circuits requiring efficient power management.
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Diotec Semiconductor Ag
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 10; Terminal Finish: MATTE TIN;
2N2222A
Surge Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Terminals: 3;
SZNUP2105LT1G
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
DS18B20+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 1.5 mA; Package Equivalence Code: SIP3,.1,50;
BAV99
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM7805CT
Fairchild Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
FDN306P
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Weitron Technology
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
Brightking
P3G-08
Omron
RELAY SOCKET; Contact Finish (Termination): NOT APPLICABLE; Contact Material: NOT SPECIFIED; Contact Finish (Mating): NOT SPECIFIED;
2-345832-2
Tyco Electronics Amp
IC SOCKET; Device Type Used On: DIP20; Manufacturer Series: 345832; Contact Material: BERYLLIUM COPPER; Contact Finish (Mating): NOT SPECIFIED; JESD-609 Code: e0;
4-1437508-0
TE Connectivity
TRANSISTOR SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT SPECIFIED;
40-6552-11
Aries Electronics
Aries Electronics 40-6552-11 is a DIP42 IC socket with 40 contacts made of beryllium copper. The housing material is polyphenylene sulfide, and the contact finish includes gold over nickel. Ideal for chip carrier applications requiring reliable connections in electronic devices.
VCF4-1002
IC SOCKET; Contact Finish (Mating): NOT APPLICABLE; Contact Material: NOT APPLICABLE; Termination Type: SOLDER;
203-2737-55-1102
3m Electronic Products Division
203-2737-55-1102 by 3M Electronic Products Division is a chip carrier IC socket with POLYPHENYLENE SULFIDE housing and BERYLLIUM COPPER contacts. It features 3 gold-over-nickel contacts for mating and termination. Ideal for electronic applications requiring reliable connections in IC sockets.
XR2C-1011-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Manufacturer Series: XR2; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10);
HLT-1712-G-T
Samtec
Samtec's HLT-1712-G-T is a plastic chip carrier IC socket with 204 brass contacts. It is used on PGA204 devices and has gold (Au) mating finish over nickel (Ni). This IC socket is ideal for various applications requiring reliable connections.
173-10-322-00-001000
Mill-max Mfg
173-10-322-00-001000 by Mill-max Mfg is a PLASTIC IC SOCKET for DIP22 devices with 22 contacts. It features GOLD OVER NICKEL contact finish, RECTANGLE contact config, and is used in Chip Carrier IC & Component Sockets applications.
TTD08
Taicom
TTD08 by Taicom is a DIP8 IC socket with 8 contacts, 7.62mm PCB row spacing, and PBT housing material. It has a solder termination type, operates b/w -40°C to 105°C, and offers a dielectric voltage of 1000VAC. Ideal for chip carrier applications due to its rectangular contact pattern and 2X4 contact configuration.
1-390262-2
TE Connectivity's 1-390262-2 is a chip carrier IC socket with 28 contacts and a rectangular contact pattern. It has a PCB contact row spacing of 15.24mm and is used for DIP28 devices. With a temperature range of -40 to 105°C, it offers reliable performance in various applications.
A14-LC-TT
Assmann Wsw Components
A14-LC-TT by Assmann Wsw Components is a DIP14 IC socket with 14 phosphor bronze contacts and polybutylene terephthalate housing. It features tin contact finish for mating (80) and termination (Sn), suitable for chip carrier applications. The rectangular contact configuration makes it ideal for secure connections in electronic devices.
XR3G-6411
IC SOCKET; Contact Material: BERYLLIUM COPPER; Contact Finish (Termination): GOLD; Contact Finish (Mating): GOLD (10); JESD-609 Code: e4;
1-1814655-1
TE Connectivity's 1-1814655-1 is a SIP16 IC socket with THERMOPLASTIC POLYESTER housing. Featuring 16 contacts, it has a current rating of 1A and operates b/w -55°C to 125°C. Ideal for applications requiring straight mounting and solder termination, with a terminal pitch of 2.54mm.
XR2A-2821-N
IC SOCKET; Contact Material: BERYLLIUM COPPER; JESD-609 Code: e4; Contact Finish (Termination): GOLD FLASH; Manufacturer Series: XR2A; Contact Finish (Mating): GOLD FLASH;
16-350000-11-RC
IC SOCKET; Device Type Used On: SOIC16-DIP16; Contact Material: NOT SPECIFIED; Contact Finish (Mating): GOLD OVER NICKEL; Additional Features: SOCKET ADAPTER; No. of Contacts: 16;
HLT-1719-T-R
Samtec's HLT-1719-T-R is a plastic IC socket for PGA323 devices with 323 brass contacts. Features tin over nickel mating finish and tin with nickel termination. Ideal for chip carrier applications, offering reliable connectivity and durability in electronic assemblies.
D01-9923246
Harwin Plc
IC SOCKET; Device Type Used On: SIP32; Housing Material: POLYAMIDE46; No. of Contacts: 32; Contact Finish (Mating): NOT APPLICABLE; Contact Finish (Termination): Tin (Sn) - with Nickel (Ni) barrier;
GFZ-30-01-G-10-AD
The Samtec GFZ-30-01-G-10-AD is a Chip Carrier IC Socket with 300 contacts. It features Beryllium Copper contact material and Gold over Nickel finish for mating. Designed for LGA300 devices, it utilizes Liquid Crystal Polymer housing material for high performance in electronic applications.
XR2A-1815
IC SOCKET; Manufacturer Series: XR2;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
218-1-014-3-X0STH-XT0
MPE
IC SOCKET; Device Type Used On: DIP14; Mounting Style: RIGHT ANGLE; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1400VAC; Housing Material: THERMOPLASTIC;
299-43-310-10-001000
IC SOCKET; Device Type Used On: DIP10; Housing Material: PCT POLYESTER; No. of Contacts: 10; Contact Finish (Termination): MATTE TIN OVER NICKEL; Contact Config: RECTANGLE;
299-43-314-11-001000
IC SOCKET; Device Type Used On: DIP14; Mounting Style: RIGHT ANGLE; Contact Style: RND PIN-SKT; Dielectric Withstanding Voltage (V): 1000VAC; Housing Material: PLASTIC;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved